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Related Manuals for Multi-Tech MultiConnect xDot Series
Summary of Contents for Multi-Tech MultiConnect xDot Series
- Page 1 ® MultiConnect xDot MTXDOT Developer Guide...
- Page 2 Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes.
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Page 3: Table Of Contents
CONTENTS Contents Chapter 1 Product Overview ............................ 6 Overview ..................................6 Documentation Overview ............................. 6 Related Documentation .............................. 6 mbed Documentation ..............................6 Programming the xDot Microcontroller ........................7 General mBed Links ..............................7 xDot Platform ................................7 EUI and Networking ..............................7 Product Build Options .............................. - Page 4 CONTENTS Antenna Specifications ............................. 24 Pulse Electronics Antenna............................24 Antenna Specifications ............................. 24 RSMA-to-U.FL Coaxial Cables ............................. 25 Coaxial Cable Specifications ............................. 25 OEM Integration ................................. 25 FCC & IC Information to Consumers ......................... 25 FCC Grant Notes................................ 25 Host Labeling................................26 Chapter 6 Safety Information..........................
- Page 5 CONTENTS Programming Devices in Production ........................37 xDot Developer Kit Mechanical Drawings........................38 Micro Developer Board LEDs ............................39 Chapter 11 Developer Board Schematics........................ 40 Assembly Diagrams and Schematics ........................... 40 Assembly Diagrams ..............................40 Schematics ................................42 Chapter 12 Design Considerations.......................... 46 Noise Suppression Design ............................
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Page 6: Chapter 1 Product Overview
CHAPTER 1 PRODUCT OVERVIEW Chapter 1 Product Overview Overview The MultiConnect xDot (MTXDOT) is a LoRaWAN , low-power RF device, capable of two way communication over long distances, deep into buildings, or within noisy environments using the unlicensed ISM bands in North America, Europe and worldwide. -
Page 7: Programming The Xdot Microcontroller
CHAPTER 1 PRODUCT OVERVIEW Programming the xDot Microcontroller Note: To program an xDot application, you need the xDot Developer kit, which includes an xDot mounted on a developer board. Use the ARM mbed ecosystem to program the microcontroller. Compile in the cloud or locally, copy the resulting binary file to the mbed USB drive, and reset the xDot. -
Page 8: Product Build Options
CHAPTER 1 PRODUCT OVERVIEW Product Build Options Product Description Package Quantity North America MTXDOT-NA1-A00 915 MHz LoRa Module UFL/TRC (NAM) 1 or 100 MTXDOT-NA1-A01 915 MHz LoRa Module TRC (NAM) EMEA MTXDOT-EU1-A00 868 MHz LoRa Module UFL/TRC (EU) 1 or 100 MTXDOT-EU1-A01 868 MHz LoRa Module TRC (EU) Developer Kits... -
Page 9: Chapter 2 Getting Started
CHAPTER 2 GETTING STARTED Chapter 2 Getting Started Getting Started with the xDot Developer Kit Getting started depends on what you want to do. By default, xDot ships with firmware that supports AT Commands that use the serial I/O. For AT Commands, refer to the separate MultiConnect Dots AT Command Reference Guide. -
Page 10: Mac
CHAPTER 2 GETTING STARTED ■ AT Command Port: XR21V1410 USB UART You may need to install a driver for the debug port to function properly. Go to: https://developer.mbed.org/handbook/Windows-serial-configuration On Mac systems, COM ports appear in the Device Manager as: ■ /dev/cu.usbmodemx Where x is a string of numbers and possibly letters, ending in a number. -
Page 11: Chapter 3 Mechanical Drawings With Pinouts
CHAPTER 3 MECHANICAL DRAWINGS WITH PINOUTS Chapter 3 Mechanical Drawings with Pinouts xDot ® MultiConnect xDot MTXDOT Developer Guide... -
Page 12: Chapter 4 Specifications And Pin Information
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Chapter 4 Specifications and Pin Information MTXDOT Specifications Category Description General Compatibility LoRaWAN 1.0 specifications Interfaces Note that pin functions are multiplexed. Up to 19 digital I/O Up to 10 analog inputs 2 DAC outputs Wake pin Reset pin Full UART... - Page 13 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Category Description Environment Operating -40° C to +85° C Temperature Storage -40° C to +85° C Temperature Humidity 20%-90% RH, non-condensing Power Requirements Operating Voltage 2.4 to 3.57 V Certifications and Compliance EMC and Radio EN 300 220-2 V2.4.1:2012 EN 300 220-2 V2.4.1:2012 Compliance...
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Page 14: Mapping Data Rate To Spreading Factor/Bandwidth
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Category Description Receive Sensitivity Spreading Factor North America Typical Sensitivity EMEA Typical Sensitivity -111 dBm -121 dBm -116 dBm -124 dBm -119 dBm -127 dBm -122 dBm -130 dBm -125 dBm -133 dBm -127 dBm -135 dBm -129 dBm -137 dBm... -
Page 15: Power Draw
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Power Draw Note: ■ Multi-Tech Systems, Inc. recommends that you incorporate a 10% buffer into the power source when determining product load. ■ Power measurements are similar for 868 MHz models. Some 868 MHz sub-band frequencies do not support maximum TXP power of 20. -
Page 16: Electrical Characteristics
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Electrical Characteristics Signal Description Vin Low Input low level 0.3 * VDD Vin High Input high level 0.45 * VDD +0.6 Vout Low Output low level Vout High Output high level Standard operating voltage 2.4 Operating current (mA) Operating current (mA) @3.3V... - Page 17 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION 48QFN xDot Pin Pin Name SW Name Function Processor Pin Processor Pin Alt2 Description Alt1 PB12 SPI2_NSS GPIO / SPI TIM10_CH1/ ADC_IN18/ I2C2_SMBA/ COMP1_INP/ SPI2_NSS/ VLCDRAIL2 I2S2_WS/ USART3_CK/ LCD_SEG12 PB13 SPI2_SCK GPIO / SPI TIM9_CH1/ ADC_IN19/ SPI2_SCK/...
- Page 18 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION 48QFN xDot Pin Pin Name SW Name Function Processor Pin Processor Pin Alt2 Description Alt1 I2C1_SDA GPIO / I2C TIM4_CH4/ TIM11_CH1/ I2C1_SDA/ LCD_COM3 PA14 MBED SWCLK JTCK-SWCLK PA13 MBED SWDIO JTMS-SWDIO PA12 UART1_RTS GPIO / UART USART1_RTS/ USB_DP SPI1_MOSI...
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Page 19: Pull-Up/Down
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION 48QFN xDot Pin Pin Name SW Name Function Processor Pin Processor Pin Alt2 Description Alt1 PA15 LORA_NSS LORA Radio LORA_RESET LORA Radio LORA_SCK LORA Radio PB11 SE_CLK Secure Element SE_CTRL Secure Element PB10 SE_IO Secure Element PC13-WKUP2 SE_RESET Secure Element... -
Page 20: Xdot Pinout Design Notes
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION xDot Pinout Design Notes Refer to the mechanical drawing for your model for pin locations. ■ All pins that go to connectors are directly connected to the processor. ■ Refer to Pin Information table for pull up and pull down information. xDots allow you to program pins depending on your application: ■... - Page 21 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION The following table provides example settings and the theoretical maximum range based on these settings. Example 18dB Transmit Power for Units Example 14dB Transmit Power for 915 MHz Models 868MHz Models Frequency TX Power TX Antenna Gain RX Sensitivity -120...
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Page 22: Chapter 5 Antennas
CHAPTER 5 ANTENNAS Chapter 5 Antennas Antenna System The LoRa antenna performance depends on the implementation and antenna design. The integration of the antenna system into the product is a critical part of the design process; therefore, it is essential to consider it early so the performance is not compromised. - Page 23 CHAPTER 5 ANTENNAS ® MultiConnect xDot MTXDOT Developer Guide...
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Page 24: Ethertronics Chip Antenna
CHAPTER 5 ANTENNAS Ethertronics Chip Antenna This is the developer board's default antenna. Manufacturer: Ethertronics Description: 915MHz Chip RF Antenna 902MHz ~ 928MHz 2.56dB Solder Surface Mount Model Number: M620710-1K Antenna Specifications Category Description Electrical Specifications Frequency Range 902—928 MHz Peak Gain 2.56 dBi VSWR... -
Page 25: Rsma-To-U.fl Coaxial Cables
CHAPTER 5 ANTENNAS Category Description Impedance 50 Ohms VSWR < 2.0 Gain 3.0 dBi Radiation Omni Polarization Vertical RSMA-to-U.FL Coaxial Cables Coaxial Cable Specifications Optional antenna cables can be ordered from MultiTech Cable Type Coaxial Cable Attenuation <1.0db Connector Impedance 50 ohm Maximum Cable Length 16"... -
Page 26: Host Labeling
CHAPTER 5 ANTENNAS Actual content pending Grant: This device is a mobile device with respect to RF exposure compliance. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons, and must not be collocated or operate in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product guidelines. -
Page 27: Chapter 6 Safety Information
CHAPTER 6 SAFETY INFORMATION Chapter 6 Safety Information Handling Precautions To avoid damage due to the accumulation of static charge, use proper precautions when handling any cellular device. Although input protection circuitry has been incorporated into the devices to minimize the effect of static build-up, use proper precautions to avoid exposure to electronic discharge during handling and mounting the device. -
Page 28: Interference With Pacemakers And Other Medical Devices
CHAPTER 6 SAFETY INFORMATION ■ Éteignez votre appareil sans fil dans les hôpitaux ou dans toutes les zones où des appareils médicaux sont susceptibles d'être utilisés. Interference with Pacemakers and Other Medical Devices Potential interference Radio frequency energy (RF) from cellular devices can interact with some electronic devices. This is electromagnetic interference (EMI). -
Page 29: Chapter 7 Regulatory Information
CHAPTER 7 REGULATORY INFORMATION Chapter 7 Regulatory Information EMC, Safety, and R&TTE Directive Compliance The CE mark is affixed to this product to confirm compliance with the following European Community Directives: Council Directive 2014/30/EU on the approximation of the laws of Member States relating to electromagnetic compatibility;... -
Page 30: Industry Canada Class B Notice
CHAPTER 7 REGULATORY INFORMATION MultiTech provides software code meant to operate the radio to a level that maintains compliance with the operating modes under which these radio devices were certified. To ensure this level of compliance, the software code is provided in binary form only. Users are prohibited from making any changes that affect the operation of the radio performance. -
Page 31: Chapter 8 Environmental Notices
CHAPTER 8 ENVIRONMENTAL NOTICES Chapter 8 Environmental Notices Waste Electrical and Electronic Equipment Statement Note: This statement may be used in documentation for your final product applications. WEEE Directive The WEEE Directive places an obligation on EU-based manufacturers, distributors, retailers, and importers to take- back electronics products at the end of their useful life. -
Page 32: Reach Statement
After careful review of the legislation and specifically the definition of an “article” as defined in EC Regulation 1907/2006, Title II, Chapter 1, Article 7.1(a)(b), it is our current view Multi-Tech Systems, Inc. products would be considered as “articles”. In light of the definition in § 7.1(b) which requires registration of an article only if it contains a regulated substance that “is intended to be released under normal or reasonably foreseeable conditions... -
Page 33: Restriction Of The Use Of Hazardous Substances (Rohs)
Certificate of Compliance 2011/65/EU Multi-Tech Systems, Inc. confirms that its embedded products comply with the chemical concentration limitations set forth in the directive 2011/65/EU of the European Parliament (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment - RoHS). -
Page 34: Information On Hs/Ts Substances According To Chinese Standards
Products (EIP) # 39, also known as China RoHS, the following information is provided regarding the names and concentration levels of Toxic Substances (TS) or Hazardous Substances (HS) which may be contained in Multi-Tech Systems Inc. products relative to the EIP standards set by China's Ministry of Information Industry (MII). -
Page 35: Information On Hs/Ts Substances According To Chinese Standards (In Chinese)
依 依 照 照 中 中 国 国 标 标 准 准 的 的 有 有 毒 毒 有 有 害 害 物 物 质 质 信 信 息 息 根据中华人民共和国信息产业部 (MII) 制定的电子信息产品 (EIP) 标准－中华人民共和国《电子信息产品污染 控制管理办法》（第 39 号），也称作中国 RoHS, 下表列出了 Multi-Tech Systems, Inc. 产品中可能含有的有毒 物质 (TS) 或有害物质 (HS) 的名称及含量水平方面的信息。... -
Page 36: Chapter 9 Labels
CHAPTER 9 LABELS Chapter 9 Labels Label Examples Note: Actual labels vary depending on the regulatory approval markings and content. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. -
Page 37: Chapter 10 Developer Kit Overview
CHAPTER 10 DEVELOPER KIT OVERVIEW Chapter 10 Developer Kit Overview xDot Developer Kit The xDot developer kit comes with an xDot already mounted on the developer board. Simply plug the developer kit into a USB port on your computer to test, program, and evaluate your application. Developer Kit Package Contents Your Developer Kit (MTMDK-NX-XDOT-xx) includes the following: Developer Board... -
Page 38: Xdot Developer Kit Mechanical Drawings
CHAPTER 10 DEVELOPER KIT OVERVIEW xDot Developer Kit Mechanical Drawings Note: The Reset and Wake buttons reset and wake the xDot processor. ® MultiConnect xDot MTXDOT Developer Guide... -
Page 39: Micro Developer Board Leds
CHAPTER 10 DEVELOPER KIT OVERVIEW Micro Developer Board LEDs Description LED1 User-definable LED. LED3/SDA Programming Status. LED2/PWR Power, blue light when the board has power. LED4/PROXY LED for the proximity sensor, which is next to it (labeled U14 on the top assembly diagram). -
Page 40: Chapter 11 Developer Board Schematics
CHAPTER 11 DEVELOPER BOARD SCHEMATICS Chapter 11 Developer Board Schematics Assembly Diagrams and Schematics Assembly Diagrams ® MultiConnect xDot MTXDOT Developer Guide... - Page 41 CHAPTER 11 DEVELOPER BOARD SCHEMATICS Bottom ® MultiConnect xDot MTXDOT Developer Guide...
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Page 42: Schematics
CHAPTER 11 DEVELOPER BOARD SCHEMATICS Schematics ® MultiConnect xDot MTXDOT Developer Guide... - Page 43 CHAPTER 11 DEVELOPER BOARD SCHEMATICS ® MultiConnect xDot MTXDOT Developer Guide...
- Page 44 CHAPTER 11 DEVELOPER BOARD SCHEMATICS ® MultiConnect xDot MTXDOT Developer Guide...
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Page 46: Chapter 12 Design Considerations
CHAPTER 12 DESIGN CONSIDERATIONS Chapter 12 Design Considerations Noise Suppression Design Adhere to engineering noise-suppression practices when designing a printed circuit board (PCB). Noise suppression is essential to the proper operation and performance of the modem and surrounding equipment. Any OEM board design must consider both on-board and off-board generated noise that can affect digital signal processing. -
Page 47: Electrostatic Discharge Control
CHAPTER 12 DESIGN CONSIDERATIONS ■ Locate high frequency circuits in a separate area to minimize capacitive coupling to other circuits. ■ Locate cables and connectors to avoid coupling from high frequency circuits. ■ Lay out the highest frequency signal traces next to the ground grid. ■... -
Page 48: Chapter 13 Mounting Xdots And Programming External Targets
CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS Chapter 13 Mounting xDots and Programming Exter- nal Targets Mounting the Device on Your Board A footprint diagram is included on the xDot Mechanical Diagram. Solder Profile Solder Paste: SAC NC 254 Note: Calculate slope over 120 seconds Name... -
Page 49: Setpoints (Celsius)
CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS Setpoints (Celsius) Zone Bottom Conveyer Speed 32.0 inch/minute Max Rising Slope Max Falling Slope Soak Time 150- Peak Temp Total Time /218C 170C Position Slope Slope Time Temp Time <TC2> 1.38 -0.63 28.82 240.22 -30%... -
Page 50: Jtag/Swd Connector
CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS When the xDot developer board detects a target voltage on Pin 1 of header JP1, it redirects the mbed programming interface to the external target. You can use the mbed programming environment as normal to program and debug the external target. - Page 51 CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS ■ Harwin: M50-3500542 ■ Mouser: 855-M50-3500542 ■ Samtec shrouded header: FTSH-105-01-F-D-K The Samtec FTSH-105 header dimensions are 0.25"x 0.188" (6.35mm x 4.78mm). Ensure that you connect your cable correctly, typically by matching the "1" marked on the board to the cable's red stripe.
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Page 52: Index
INDEX Index schematics EMI ................46 Developer Board ...........40 ESD ................47 EUI ...................7 external targets.............49 antenna ..............22 24 developer board ............24 assembly diagrams Developer Board ............40 grant notes...............25 AT command FCC Notice port ................9 Class B ..............29 flow control..............20 baud rate...............20 board components ground plane..............46 Micro Developer Board..........39... - Page 53 INDEX ribbon cable ..............49 RoHS................33 Mac .................9 RSMA-to-UFL cable ............25 maintenance ..............28 mbed ................6 mechanical drawings.............11 Micro Developer Board..........38 safety MTAC-LORA..............6 RF interference ............27 MTCDT................6 safety standards............46 MultiConnect ..............6 serial settings ..............20 solder profile ..............48 specifications..............12 static................27 network, connecting ............7 stop bits.................20 noise suppression............46 sécurité...
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