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refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Lay the Monitor on the desk.
2.
Take out the base with finger.
3.
Unlock 2 screws for VGA with #1 Bushing Screw Driver.
4.
Release the stand arm down with thumb.
5.
Unlock the 2 screws which fix the stand arm and Hinge with #2 Crossing Screw Driver.
6.
Take the front bezel out.
7.
Take the LVDs out
8.
Take the panel out from the back cover assy.
9.
Take the keypad out and unlocked the 11 screws which fixed the Power Board & I/F board &Arm Board and chassis
#2 Crossing Screw Driver.
10. Separated the connect and board.
11. Separated the chassis from the back cover with the shark tool.
12. Take the speakers out from the chassis with hand.
13. Take the 4 pcs VESA Cap out from the chassis with hand.
14. Unlock 2 screws from the hinge and back cover.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
Tool Size (if
applicable)
#1 Bushing
Screw Driver
#2 Crossing
Screw Driver
Page 2
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