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Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Screw driver
Plastic Zig
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Put the MNT on the clean vinyl
2.
Disassembly the screw(1ea)
3.
Remove the stand body
4.
Open cabinet from set
5.
Disassemble the backcover
6.
Disassemble the LVD cable and Inner wire
7.
Remove PCBA and cables from LCD module
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
Tool Size (if
applicable)
Page 2
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