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Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 SCREW DRIVER
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Lay the Monitor on the desk and separate base,
2.
Unlock the 2 screws which fix the Chassis with the screw drive
3.
Take out the bezel with hand
4.
Take out the keypad PCBA with hand
5.
Take out the Backcover with hand.
6.
Take out theTape and Foil with hand.
7.
Unlock the 4 screws which fix the hinge and bucket with the screw driver
8. Unlock the 3 screws which fix the ARM and hinge
9. Take out the Tape and Foil with hand.
10. Take out the LED light conector
11. Take out the LVDS conector .
12. Take out the Mylar from chassis
13. Unlock the 2 screws which fix the IF board to the chassis,
14. Unlock the 6screws which fix the IF & Power,USB PCBA
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
Tool Size (if
applicable)
#2
Page
2
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