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Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1.
Lay the monitor on a flat, soft and clean surface.
2.
Remove the Stand and Base ASSY.
3. Remove the screws.
4.
Remove the rear cover.
5. Remove the hinge
6.
Remove the screws and deco bezel
7. Remove the Pins and tape
8. Remove the Mainframe and panel
9. Remove the the screws and the pin.
10. Remove the boards..
11. Remove the mainboard connect pin and the USB board connect pin
12.
13.
14.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
0
Tool Size (if
applicable)
Page 2
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