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HP EliteDesk 705 G3 Disassembly Instructions Manual

HP EliteDesk 705 G3 Disassembly Instructions Manual

Small form factor business pc

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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 705 G3 Small Form Factor Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Acbel STD
Include the cartridges, print heads, tubes, vent
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
2
1
3
1
Page 1

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Summary of Contents for HP EliteDesk 705 G3

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 including liquids, semi-liquids (gel/paste) and toner chambers, and service stations. Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
  • Page 3 Figure1pullthehandleandremoveaccesspanel Figure2Rotatethedrivercagefromthehook Figure 3 Disconnect FIO Audio cables from MB Figure 4 Disconnect FIO USB3.0 cables from MB Figure 5 Disconnect FIO USB2.0 cables from MB Figure 6 Disconnect SATA cables from the MB EL-MF877-00 Page 3 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 4 Figure 7 Disconnect Speaker cable from the MB Figure 8 Disconnect ODD/HDD PSU cables from the MB Figure 9 Disconnect MB PSU cable from the MB Figure 10 Disconnect other PSU cables from the MB Figure 11 Disconnect CPU Power cable from the MB Figure 12 Disconnect HDD Power cable from HDD EL-MF877-00 Page 4...
  • Page 5 Figure 13 Disconnect SATA cable from HDD Figure 14 Remove the cables from the chassis clip Figure 15 Press the HDD’s latch on HDD cage Figure 16 Remove the HDD from HDD cage Figure 17 Disconnect ODD power cable from ODD Figure 18 Disconnect SATA cable from ODD EL-MF877-00 Page 5...
  • Page 6 Figure 19 Press the ODD’s latch on ODD cage Figure 20 Remove the ODD from ODD cage Figure 21 Rotate the Fan duct 01 and remove it Figure 22 press the hook and remove fan duct 02 Figure 23 Disconnect heat sink fan cable from MB Figure 24 Loose the screws and remove heat sink EL-MF877-00 Page 6...
  • Page 7 Figure 25 Loose the screws and remove the fan Figure 26 Separate the fan from CPU heat sink Figure 27 Rotate the handle and open it up Figure 28 Remove the CPU from the board Figure 29 Remove the Memory card from the board Figure 30 Remove the battery from the system board EL-MF877-00 Page 7...
  • Page 8 Figure 31 Loose the screws of MB from board Figure 32 Remove MB from chassis Figure 33 Remove front panel from chassis Figure 34 Loose the screws of FIO and remove it Figure 35 Loose the screws of speaker and remove it Figure 36 Remove the holder of LED power cable from chassis EL-MF877-00...
  • Page 9 Figure 37 Remove the screws on the PSU chassis Figure 38 Press the PSU’s latch on chassis Figure 39 Remove the Power supply from chassis Figure 40 Remove screw for top Figure 41 Remove the screw form the bottom Figure 42 Release screw of Fan and remove the fan from case EL-MF877-00 Page 9...
  • Page 10 Figure 43 Remove the screw and open case Figure 44 Disconnect the cable-wire from product Figure 45 Figure 46 Remove the thin-film plastic sheet. Unscrew and remove PCB from case Figure 47 Remove cap from PCB. EL-MF877-00 Page 10 Template Revision B PSG instructions for this template are available at EL-MF877-01...