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refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Phillips screwdriver
Description #2 Dikes
Description #3 Torx screwdriver
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
To remove the access panel (see Figure 1):
a. Loosen the captive thumbscrew (1) that secures the access panel to the computer chassis.
b. Slide the top access panel back about 1.3 cm, (1/2 inch), then lift it off the unit (2).
2.
To remove the system board:
a. Remove the optical drive by disconnecting the flat ribbon cable from the back of the drive, and then pushing the
release latch on the side of the optical drive toward the outside of the computer (1), and sliding the drive out of the
computer through the front bezel (2). (see Figure 2)
b. Disconnect or cut all cables from the system board.
c. Remove the front panel assembly by lifting up on the two green locking levers on the left and right sides of the
chassis. This will unlatch the front panel assembly and push it about 1.3 cm (1/2 inch) out of the chassis. The
assembly will automatically stop at that distance. Then lift the two levers again (1) and pull the front panel assembly
straight out of the chassis (2). (see Figure 3)
d. Note this computer supports two different expansion card cages. Remove the expansion card cage by rotating the
bail handle on the expansion card cage (1) and lifting the cage straight up (2). (see Figure 4 for example of a PCI
Expansion Card cage)
e. Remove the hard drive by pulling the drive release lever away from the hard drive (1), and then lifting the cable-end
of the drive up (2) and pulling it toward the center of the chassis (3) to remove it from the drive cage (see Figure 5)
f. If necessary, remove the heatsink by unscrewing the four screws that secure the heatsink to the system board (2),
and then lifting the heatsink with the shroud from the system board (3).
g. Remove the power supply by sliding the power supply toward the front of the chassis (1) about 1.3 cm (1/2 inch)
then sliding it toward the center of the chassis and rotating it up (2) to access the main cable connection beneath it.
Remove the power supply from the chassis (see Figure 6).
h. Remove the thumbscrew that secures the system board to the chassis (1) (see Figure 7).
i. Slide the system board toward the front of the chassis (2), making sure that all keyhole retainers are clear before
lifting the system board from the chassis (see Figure 7).
3.
To remove the battery:
Locate the battery and battery holder on the system board. Depending on the type of battery holder on the system
board, complete the following instructions to remove the battery
TYPE 1 BATTERY HOLDER (see Figure 8):
Lift the battery out of the holder.
TYPE 2 BATTERY HOLDER (see Figure 9):
To release the battery from its holder, squeeze the metal clamp that extends above one edge of the battery. When the
battery pops up, lift it out.
TYPE 3 BATTERY HOLDER (see Figure 10):
Pull back on the clip that holds the battery in place, and then remove the battery
4.
To remove the power supply PCA:
HP uses two different power supplies from two different vendors in these computers. Use the following steps to
determine which power supply you have and its required disassembly procedures.
EL-MF877-00
Template Revision A
Tool Size (if
applicable)
T-15
Page 2
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