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SECTION 2
Operation
2.1
INTRODUCTION
WARNING
The matrix configuration
procedures in this
section should only be performed
by quali-
fied personnel who recognize shock hazards
and are familiar
with the safety precautions
required
to avoid possible
injury.
Review
the safety precautions
found at the front of
this manual.
This section contains information
on aspects of matrix
card operation and is arranged as follows:
2.2 Handling
Precautions:
Details
precautions
that
should be observed when handling
the matrix card to en-
sure that its performance is not degraded due to contami-
lMiOIl.
2.3 Card Installation
and Removal: Covers the basic pro-
cedure for installing
and removing
the card from the
Model 707 Switching
Matrix.
2.4 Basic Matrix Configurations:
Covers the basic matrix
configurations
that the card can be configured
for; dual 4
x 12 matrices, a single 4 x 24 matrix or a single 8 x 12 ma-
trix.
2.5 Typical
Matrix
Switching
Schemes: Explains some
of the basic ways that a matrix can be used to source or
measure. Covers single-ended
switching,
differential
(floating) switching,
sensing, shielding,
and guarding.
2.6 Connections:
JXxwses
the various
methods and
techniques that can be used to connect DUTs and in&u-
mentation to the matrix card.
2.7 Matrix Expansion:
Discusses the various matrix con-
figurations
that are possible by using multiple
cards. The
significance
of backplane row jumpers on matrix
con-
figurations
is also covered here.
2.8 Typical
Connection
Schemes: Provides examples of
external connections
for single card, multiple
card and
multiple
mainframe systems.
2.2
HANDLING
PRECAUTIONS
To maintain
high impedance
isolation,
care should be
taken when handling
the matrix card to avoid contami-
nation from such foreign materials as body oils. Such
contamination
can substantially
lower
leakage resis-
tances, degrading performance.
To avoid possible contamination,
always grasp the card
by the handle and side edges. Do not touch the edge con-
nectors of the card and do not touch board surfaces or
components. On D-subminiature
(D-sub) connectors, do
not touch areas adjacent to the electrical contacts.
CAUTION
Do not store the card by leaning it against an
object (such as B wall) with its edge connec-
tars in contact with a contaminated
surface
(such as the flood. The edge connectors will
become contaminated,
and tapes and solder
connections
on the PC board may break as
the card bends. ALWAYS
store the card (in
its anti-static
bag) in the original
shipping
carton.
Dirt build-up
over a period of time is another possible
source of contamination.
To avoid this problem, operate
the mainframe and matrix card in a clean environment.
If the card becomes contaminated,
it should be tbor-
oughly cleaned as explained in paragraph 4.2.
2.3
CARD INSTALLATION
AND REMOVAL
WARNING
To avoid electrical shock that could result in
injury
or death, ALWAYS
remove
power
from the entire system (Model
707, test in-
struments, DUT, etc.) and discharge any ca-
pacitors before doing any of the following:
1. Installing
or removing
the matrix
card
from the mainframe.
2-1
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