Intel S1400SP Hardware Specification page 14

Expansion modules
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Intel® I/O Expansion Modules for Intel® Platforms HWS
1. External Interfaces provided
PCIe v2.1 (2.5GT/s and 5GT/s) x4/x2/x1
MDI (Copper) standard IEEE 802.3 Ethernet interface for 1000BASE-T, 100BASE-TX,
and 10BASE-T applications (802.3, 802.3u, and 802.3ab)
Serializer-Deserializer (SERDES) to support 1000BASE-SX/LX (optical fiber -
IEEE802.3)
Serializer-Deserializer (SERDES) to support 1000BASE-KX(802.3ap) and 1000BASE-
BX (PICMIG 3.1) for Gigabit backplane applications
SGMII (Serial-GMII Specification) interface for SFP (SFP MSA INF-8074i)/external PHY
connections
NC-SI (DMTF NC-SI) or SMBus for Manageability connection to BMC
IEEE 1149.6 JTAG
2. Performance Enhancements
PCIe v2.1 TLP Process Hints (TPH)
UDP, TCP and IP Checksum offload
UDP and TCP Transmit Segmentation Offload (TSO)
SCTP receive and transmit checksum offload
3. Virtualization ready
Next Generation VMDq support (8 VMs)
Support of up to 8 VMs per port (1 queue allocated to each VM)
PCI-SIG I/O SR-IOV support (Direct assignment)
Queues per port: 8 TX and 8 RX queues
4. Power saving features
Advanced Configuration and Power Interface (ACPI) power management states and
wake-up capability
Advanced Power Management (APM) wake-up functionality
Low power link-disconnect state
PCIe v2.1 LTR
DMA Coalescing for improved system power management
EEE (IEEE802.3az) for reduced power consumption during low link utilization periods
5. IEEE802.1AS - Timing and Synchronization
IEEE 1588 Precision Time Protocol support
Per-packet timestamp
6. Total Cost of Ownership (TCO)
IPMI BMC pass-thru; multi-drop NC-SI
Internal BMC to OS and OS to BMC traffic support
7. Additional product details
17x17 (256 Balls) or 25x25 (576 Balls) PBGA package
Estimated power: 2.8W (max) in dual port mode and 4.2W (max) in quad port mode
Memories have Parity or ECC protection
®
See Intel
Ethernet Controller I350 Datasheet for more details.
Revision 1.1
Intel order number: G30021-004
Quad Port Intel
I350 GbE I/O Module
®
7

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