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Huawei ME309-562 Hardware Manual

Emtc lga module
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Issue
03
Date
2017-07-18

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Summary of Contents for Huawei ME309-562

  • Page 1 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Issue Date 2017-07-18...
  • Page 2 Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Huawei reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability.

  • Page 3: Revision History

    HUAWEI ME309-562 eMTC LGA Module Hardware Guide About This Document Revision History Document Date Chapter Descriptions Version 2017-03-23 Draft release 2017-05-26 1.Cancel SPI/I2C function; 2.Cancel wake_up out function, use RING to replace it; 3.Update the pin map interface picture because the change above.

  • Page 4: Table Of Contents

    HUAWEI ME309-562 eMTC LGA Module Hardware Guide Contents 1 Introduction............................ 5 2 Overall Description ........................6 2.1 About This Chapter ........................... 6 2.2 Function Overview..........................6 2.3 Circuit Block Diagram ........................7 2.4 Application Block Diagram ....................... 8 3 Description of the Application Interfaces ................10 3.1 About This Chapter .........................

  • Page 5: Introduction

    Hardware Guide Introduction This document describes the hardware application interfaces and air interfaces provided by HUAWEI ME309-562 eMTC LGA module (hereinafter referred to as the ME309-562 module). This document helps hardware engineer to understand the interface specifications, electrical features and related product information of the ME309-562 module.

  • Page 6: Overall Description

    HUAWEI ME309-562 eMTC LGA Module Hardware Guide Overall Description 2.1 About This Chapter This chapter gives a general description of the ME309-562 module and provides:  Function Overview  Circuit Block Diagram  Application Block Diagram 2.2 Function Overview Table 2-1 ME309-562 module features...

  • Page 7: Circuit Block Diagram

    Interface Data Services LTE FDD: DL 300kbps; UL 375kbps @1.4MHz BW catM1 [1]: When the ME309-562 module works at –40°C to –30°C or +75°C to +85°C, NOT all its  RF performances comply with the 3GPP specifications. 2.3 Circuit Block Diagram Figure 2-1 shows the circuit block diagram of the ME309-562 module.

  • Page 8: Application Block Diagram

    HUAWEI ME309-562 eMTC LGA Module Hardware Guide Figure 2-1 Circuit block diagram of the ME309-562 module 2.4 Application Block Diagram Figure 2-2 Application block diagram of the ME309-562 module UART Interface: The module supports 3 UART interfaces. Two are 4-wire UARTs, and the other one is 8-wire UART.
  • Page 9 HUAWEI ME309-562 eMTC LGA Module Hardware Guide SPI: Serial Peripheral Interface RF Pad: RF antenna interface. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.

  • Page 10: Description Of The Application Interfaces

    This chapter mainly describes the external application interfaces of the ME309-562 module LGA Interface. 3.2 LGA Interface The ME309-562 module uses a 120-pin LGA as its external interface. For details about the module and dimensions, see 4.4 Dimensions. Huawei Proprietary and Confidential...
  • Page 11 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Figure 3-1 Pin map of LGA interface (Top view) Update 26/05/2017 Figure 3-2 Appearance of ME309-562 module (without label) Top View Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
  • Page 12 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Table 3-1 Definitions of pins on the LGA interface Pin Name Description Parameter Min. Typ. Max. Comments Type UART0_TX UART0 transmit 1.44 output 0.36 UART0_RX UART0 receive 1.26 data input 0.54 UART0_CTS UART0 clear to 1.26...
  • Page 13 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin Name Description Parameter Min. Typ. Max. Comments Type UART2_CTS UART2 clear to 1.26 send 0.54 UART2_RTS UART2 ready 1.44 0.36 receive SPI_CS_N Active low chip 1.44 NOT support select to SPI 0.36...
  • Page 14 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin Name Description Parameter Min. Typ. Max. Comments Type detection high to 0.54 VCC_EXT on H: SIM is resent your board. L: SIM is absent SIM_SWITCH Switch from one 1.44 If not use,...
  • Page 15 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin Name Description Parameter Min. Typ. Max. Comments Type pins. down. 1.26 GPIO3 General 1.44 Default Purpose I/O configuration 0.36 pins. is input pull down. 1.26 GPIO4 General 1.44 Default Purpose I/O configuration 0.36...
  • Page 16 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin Name Description Parameter Min. Typ. Max. Comments Type POWER_ON System power - Not support, will cancel it POWER_OFF System power - Not support, will cancel it RESIN_N System reset, Please add a active low.
  • Page 17 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin Name Description Parameter Min. Typ. Max. Comments Type Reserved Reserved, please keep this pin open. Reserved Reserved, please keep this pin open. Reserved Reserved, please keep this pin open. Reserved Reserved, please keep this pin open.
  • Page 18 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin Name Description Parameter Min. Typ. Max. Comments Type Not connected Not connected Not connected Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground...
  • Page 19 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin Name Description Parameter Min. Typ. Max. Comments Type Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground  I indicates pins for digital signal input; O indicates pins for digital signal output; AI indicates pins for analog signal input;...

  • Page 20: Mechanical Specifications

    Refer to JESD-033C ≤ 60% in detail Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033. 4.4 Dimensions Figure 4-1 shows the dimensions of the ME309-562 module in details. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
  • Page 21 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Figure 4-1 Dimensions (Unit: mm) The detail information about the corner and the module pin description top view: 1. the yellow pins, diameter is 0.76 mm, pitch is 1.35 mm, 2. the blue pins, diameter is 0.89 mm, pitch is 1.60 mm.

  • Page 22: Customer Pcb Design

    HUAWEI ME309-562 eMTC LGA Module Hardware Guide 4.5 Customer PCB Design 4.5.1 PCB Surface Finish The PCB surface finish recommended is Electroless Nickel Immersion Gold (ENIG). Organic Solderability Preservative (OSP) may also be used, ENIG preferred. 4.5.2 PCB Pad Design...
  • Page 23 2. the blue pins, diameter is 0.81 mm, pitch is 1.60 mm. Figure 4-3 Detail information about the recommend module footprint Figure 4-4 Recommended Package Size on HUAWEI motherboard (Unit: mm) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.

  • Page 24: Solder Mask

    PCB or component (located in module) re-melding defects caused by uneven weight.  Customers PCB together with ME309-562 should be placed in an enclosed box to reduce the impact of high humidity as far as possible. ...
  • Page 25 Hardware Guide Figure 4-5 Recommended stencil design of LGA module (Unit: mm) The stencil design has been qualified for HUAWEI motherboard assembly, customers can adjust the parameters by their motherboard design and process situation to assure LGA soldering quality and no defect.

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