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JVC GZ-EX210BUA Service Manual
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JVC GZ-EX210BUA Service Manual

JVC GZ-EX210BUA Service Manual

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SERVICE MANUAL
3 S ERVICE MANUAL
EVERIO-S-HD
YF412<Rev.001>
2012
GZ-EX210BUA, GZ-EX210BUB
COPYRIGHT © 2012 JVC KENWOOD Corporation
Lead free solder used in the board (material: Sn-Ag-Cu, melting point: 219 Centigrade)
This service manual (No.YF412< Rev.001 >) describes only the items which differ from those of already issued service manual
(No.YF400< Rev.001 >)
1
PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
2
SPECIFIC SERVICE INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
3
DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
4
ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17
5
TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-19
CAMCORDER
GZ-EX210BUAM, GZ-EX210BUBM [C2A303]

TABLE OF CONTENTS

COPYRIGHT © 2012 JVC KENWOOD Corporation
SERIES
C2A3
No.YF412<Rev.001>
2012/3

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Summary of Contents for JVC GZ-EX210BUA

  • Page 1: Table Of Contents

    C2A3 GZ-EX210BUAM, GZ-EX210BUBM [C2A303] COPYRIGHT © 2012 JVC KENWOOD Corporation Lead free solder used in the board (material: Sn-Ag-Cu, melting point: 219 Centigrade) This service manual (No.YF412< Rev.001 >) describes only the items which differ from those of already issued service manual (No.YF400<...

  • Page 2: Precautions

    SECTION 1 PRECAUTIONS SAFETY PRECAUTIONS Prior to shipment from the factory, JVC products are strictly can increase the high voltage value and cause X-ray emis- inspected to conform with the recognized product safety and sion from the cathode ray tube.
  • Page 3 1.1.2 Safety Check after Servicing Examine the area surrounding the repaired location for damage (4) Leakage current test or deterioration. Observe that screws, parts and wires have been Confirm specified or lower leakage current between earth returned to original positions, Afterwards, perform the following ground/power cord plug prongs and externally exposed tests and confirm the specified values in order to verify accessible parts (RF terminals, antenna terminals, video...

  • Page 4: Specific Service Instructions

    SECTION 2 SPECIFIC SERVICE INSTRUCTIONS DIFFERENCE LIST MODEL GZ-EX210BUA GZ-EX210BUB AC CORD IRAM TYPE BRAZIL TYPE 1-4 (No.YF412<Rev.001>)

  • Page 5: Disassembly

    SECTION 3 DISASSEMBLY Disassembly procedure Fig.3-1-1 (No.YF412<Rev.001>)1-5...

  • Page 6: No.yf412)1

    Fig.3-1-2 1-6 (No.YF412<Rev.001>)
  • Page 7 Fig.3-1-3 (No.YF412<Rev.001>)1-7...
  • Page 8 Fig.3-1-4 1-8 (No.YF412<Rev.001>)
  • Page 9 Fig.3-1-5 (No.YF412<Rev.001>)1-9...
  • Page 10 Fig.3-1-6 1-10 (No.YF412<Rev.001>)
  • Page 11 Fig.3-1-7 (No.YF412<Rev.001>)1-11...
  • Page 12 Fig.3-1-8 1-12 (No.YF412<Rev.001>)
  • Page 13 Fig.3-1-9 (No.YF412<Rev.001>)1-13...
  • Page 14 Fig.3-1-10 1-14 (No.YF412<Rev.001>)
  • Page 15 Fig.3-1-11 (No.YF412<Rev.001>)1-15...
  • Page 16 Quality point When you assemble the unit, please check the following points for keeping the quality. Between the CMOS and the MAIN, run the FPC under the mold. Do not apply excessive shock to the CMOS ASSY. (Running the FPC over the mold will result in poor contact because of (It is 3-demensionally adjusted using adhesive.) stress.) Between the CMOS and the MAIN, insert the FPC before assembly.

  • Page 17: Adjustment

    SECTION 4 ADJUSTMENT PREPARATION • 4.1.1 Precaution Torque Driver Be sure to use to fastening the mechanism and exterior parts This model is specially adjusted by using PC. However, if parts such as the following are replaced, an because those parts must strictly be controlled for tightening adjustment is required.
  • Page 18 JIG CONNECTOR CABLE CONNECTION Connection procedure Remove the 4 screws (1-4), and then remove the TOP COVER ASSY. TOP COVER ASSY CN9003 CONNECTOR CABLE SERVICE SUPPORT SYSTEM (Software) MENU PC CABLE PERSONAL COMPUTER 1-18 (No.YF412<Rev.001>)

  • Page 19: Troubleshooting

    SECTION 5 TROUBLESHOOTING This service manual does not describe TROUBLESHOOTING. (No.YF412<Rev.001>)1-19...
  • Page 20 <BOARD INTERCONNECTIONS> Q G F 0 3 1 9 F 1 - 3 1 X O P E R A T I O N TO LED LIGHT CMOS PWB I N T M I C Z O O M C M O S 1 2 6 P W B O P B L O C K ( A 2 W N ) C M O S 0 5 3 P W B SPEAKER...
  • Page 21 <MAIN(MAIN IF) SCHEMATIC DIAGRAM> Note : The parts numbers in the schematic diagram are for references only. When replacing the parts, refer to the PARTS LIST. L E D S P K M I C T E L E , W I D E , P H O T O - K E Y , T R I G G E R , G N D # CN9006 to OPERATION UNIT QGF0543F3-06X...
  • Page 22 <MAIN(SUB CPU) SCHEMATIC DIAGRAM> Note : The parts numbers in the schematic diagram are for references only. When replacing the parts, refer to the PARTS LIST. R 1 0 1 4 L I T _ 3 . 0 V L I T _ 3 . 0 V A L _ 2 .
  • Page 23 <MAIN(AUDIO) SCHEMATIC DIAGRAM> Note : The parts numbers in the schematic diagram are for references only. When replacing the parts, refer to the PARTS LIST. From REG Q 2 4 6 2 2 S C 5 3 8 3 / F / - X R E G _ 5 .
  • Page 24 <MAIN(FELIX) SCHEMATIC DIAGRAM> Note : The parts numbers in the schematic diagram are for references only. When replacing the parts, refer to the PARTS LIST. TL3039 TL3038 R3044 O P E N R3043 O P E N VDDE_2.8V R3015 R3012 O P E N O P E N O P E N...
  • Page 25 <MAIN(OP DRV) SCHEMATIC DIAGRAM> Note : The parts numbers in the schematic diagram are for references only. When replacing the parts, refer to the PARTS LIST. R E G _ 2 . 8 V O P E N C 4 6 0 1 R 4 6 0 6 3 3 0 Z _ L E D _ S U B...
  • Page 26 <MAIN(REG) SCHEMATIC DIAGRAM> Note : The parts numbers in the schematic diagram are for references only. When replacing the parts, refer to the PARTS LIST. F L T D O N E M O D E L N O - W I F I W I F I P E N 2 S Y M B O L N O .
  • Page 27 <MAIN(eMMC) SCHEMATIC DIAGRAM> Note : The parts numbers in the schematic diagram are for references only. When replacing the parts, refer to the PARTS LIST. # C 8 0 1 1 # C 8 0 0 3 O P E N # C 8 0 0 8 4 .
  • Page 28 / WIFI model <MAIN(WIFI) SCHEMATIC DIAGRAM> Note : The parts numbers in the schematic diagram are for references only. When replacing the parts, refer to the PARTS LIST. WIFI_RST M O D _ 3 . 3 V _ C T R L S F L _ I N # C8501 S F L _ S C K...
  • Page 29 <REAR SCHEMATIC DIAGRAM> Note : The parts numbers in the schematic diagram are for references only. When replacing the parts, refer to the PARTS LIST. R E A R P W B TO MAIN PWB CN601 L 6 0 1 AV JACK N R S A 6 A J - 0 R 0 W QGF0574F1-40X...
  • Page 30 <JACK SCHEMATIC DIAGRAM> Note : The parts numbers in the schematic diagram are for references only. When replacing the parts, refer to the PARTS LIST. J 2 0 1 NNZ0212-001X TO MAIN PWB H D M I G N D C N 2 0 1 G N D QGF0543F3-18X...
  • Page 31 <MONITOR SCHEMATIC DIAGRAM> Note : The parts numbers in the schematic diagram are for references only. When replacing the parts, refer to the PARTS LIST. From Main PWB M O N I T O R P W B C N 7 0 1 R E G _ 2 .
  • Page 32 <CMOS SCHEMATIC DIAGRAM> Notes : 1. The parts number in the schematic diagram are for references only. When replacing the parts, refer to the PARTS LIST. 2. The schematic diagram is only for reference. Avoid replacing individual parts. Replace the entire unit only. When CMOS BOARD ASSEMBLY needs replacement, replace the CMOS FRAME ASSEMBLY in whole because it cannot be replaced alone C M O S S E N S O R I M X 1 0 2 / I M X 1 2 6 L 4 5 1...
  • Page 33 <MAIN CIRCUIT BOARD> (Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)) <01>MAIN LYB10323-001B FOIL SIDE(B) C9016 CN9003 R9001 R9004 R9003 R9002 C9004 R9011 RA9001 R8010 C9010 RA3012 R9019 R9012 L8055 LC3005 C9012 R3137 R9006 IC8003 IC8002...
  • Page 34 <MAIN CIRCUIT BOARD> (Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)) CAUTION : FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH SAME TYPE AND RATED FUSE(S). ATTENTION : POUR UNE PROTECTION PERMANENTE CONTRE LES RISQUE D'INCENDE, REMPLACER LES FUSIBLES PAR UNAAUTRE DE MEME TYPE ET DE MEME TENSION.
  • Page 35 <REAR CIRCUIT BOARD> (Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)) CAUTION : <02>REAR FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH SAME TYPE AND RATED FUSE(S). ATTENTION : LYB20112-001A POUR UNE PROTECTION PERMANENTE CONTRE LES RISQUE D'INCENDE, REMPLACER LES FUSIBLES PAR UNAAUTRE DE MEME TYPE ET DE MEME TENSION.
  • Page 36 <MONITOR CIRCUIT BOARD> (Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)) <04>MONITOR LYB20112-001A FOIL SIDE(B) COMPONENT SIDE(A) R750 R749 UL MARK R748 R747 R746 R745 R744 R743 L723 L701 L702 R705 R704 R703 C749 C748 C755...
  • Page 37 JVC KENWOOD Corporation Home & Mobile Electronics Business Group, Imaging Products Business Division 12, 3-chome, Moriya-cho, Kanagawa-ku, Yokohama-city, Kanagawa-prefecture, 221-0022, Japan (No.YF412<Rev.001>) Printed in Japan...

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Gz-ex210bub