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7.2 Recommended Profile for Reflow Soldering
Typical values for reflow soldering of the module in convection or IR/convection
ovens are as follows (according to IPC/JEDEC J-STD-020D):
Parameter
Peak temperature (RoHS compliant process)
Average ramp up rate to peak (217°C to Peak)
Preheat temperature
Ramp up time from min. to max. preheat temperature
Temperature maintained above 217°C
Time within 5°C of actual peak temperature
Ramp down rate
Time 25°C to peak temperature
The solder pads hold solder of a thickness of about 150 µm for improved solder
process results.
As results of soldering may vary among different soldering systems and types of
solder and depend on additional factors like density and types of components on
board, the values above should be considered as a starting point for further optimi-
zation.
V1.0-Mar-14
Table 9: Reflow soldering profile A5100-A
User's Manual
Value
245°C
3°C / second max.
min=150°C; max=200°C
60 ... 120 seconds
60 ... 150 seconds
30 seconds
6°C / second max.
8 minutes max.
Page 28 of 43
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