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7 Mounting
This chapter describes the suggested mounting process for the A5100-A receiver
modules. In a RoHS compliant product with a RoHS compliant process it is rec-
ommended to use chemical tin as the counter-part to the module's pins. This will
guarantee highest resistance against shocks.
7.1 Proposed Footprint for Soldering
Following soldering footprint parameters are recommended:
• Copper and solder paste footprint are identical
• Pad-shape / -size, inner pads: 1.2 mm x 1.2 mm
• Pad-shape / -size, outer pads: 1.5 mm x 0.8 mm
• Stencil thickness of 120 – 150 µm
V1.0-Mar-14
Figure 13: Recommended Solder PAD Layout
User's Manual
Page 27 of 43
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