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Package Dimensions - ON Semiconductor MC14028B Manual

Bcd-to-decimal/binary-to-octal decoder

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−A−
16
9
1
8
F
H
G
D
16 PL
0.25 (0.010)
−A−
16
1
G
−T−
SEATING
PLANE
D
16 PL
0.25 (0.010)
MC14028B

PACKAGE DIMENSIONS

PDIP−16
CASE 648−08
ISSUE T
B
C
S
SEATING
−T−
PLANE
K
J
T
A
M
M
SOIC−16
CASE 751B−05
ISSUE J
9
−B−
P
8 PL
0.25 (0.010)
8
K
C
M
T
B
A
M
S
S
http://onsemi.com
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
L
DIM
A
B
C
D
F
G
M
H
J
K
L
M
S
B
M
S
F
_
R
X 45
J
6
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
0.740
0.770
18.80
19.55
0.250
0.270
6.35
6.85
0.145
0.175
3.69
4.44
0.015
0.021
0.39
0.53
0.040
0.70
1.02
1.77
0.100 BSC
2.54 BSC
0.050 BSC
1.27 BSC
0.008
0.015
0.21
0.38
0.110
0.130
2.80
3.30
0.295
0.305
7.50
7.74
_
_
_
_
0
10
0
10
0.020
0.040
0.51
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM
MIN
MAX
MIN
MAX
A
9.80
10.00
0.386
0.393
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.054
0.068
D
0.35
0.49
0.014
0.019
F
0.40
1.25
0.016
0.049
G
1.27 BSC
0.050 BSC
J
0.19
0.25
0.008
0.009
K
0.10
0.25
0.004
0.009
_
_
_
_
M
0
7
0
7
P
5.80
6.20
0.229
0.244
R
0.25
0.50
0.010
0.019

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