Package Dimensions - ON Semiconductor LM339 Reference Manual

Comparators
Table of Contents

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LM339, LM239, LM2901, LM2901V, NCV2901, MC3302
14
1
N
−T−
SEATING
PLANE
H
G
−A−
14
1
G
−T−
SEATING
D
14 PL
PLANE
0.25 (0.010)

PACKAGE DIMENSIONS

PDIP−14
P SUFFIX
CASE 646−06
ISSUE M
8
B
7
A
F
C
K
D
14 PL
0.13 (0.005)
M
SOIC−14
D SUFFIX
CASE 751A−03
ISSUE G
8
−B−
P
7 PL
0.25 (0.010)
M
7
_
R
X 45
C
M
K
T
B
A
M
S
S
http://onsemi.com
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
L
J
M
NOTES:
B
M
F
J
9
Y14.5M, 1982.
FORMED PARALLEL.
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
MAX
A
0.715
0.770
18.16
18.80
B
0.240
0.260
6.10
6.60
C
0.145
0.185
3.69
4.69
D
0.015
0.021
0.38
0.53
F
0.040
0.070
1.02
1.78
G
0.100 BSC
2.54 BSC
H
0.052
0.095
1.32
2.41
J
0.008
0.015
0.20
0.38
K
0.115
0.135
2.92
3.43
L
0.290
0.310
7.37
7.87
_
_
M
−−−
10
−−−
10
N
0.015
0.039
0.38
1.01
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
INCHES
DIM
MIN
MAX
MIN
MAX
A
8.55
8.75
0.337
0.344
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.054
0.068
D
0.35
0.49
0.014
0.019
F
0.40
1.25
0.016
0.049
G
1.27 BSC
0.050 BSC
J
0.19
0.25
0.008
0.009
K
0.10
0.25
0.004
0.009
_
_
_
_
M
0
7
0
7
P
5.80
6.20
0.228
0.244
R
0.25
0.50
0.010
0.019

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