About The Difference Between Oad And Ota In Ti Protocol Stack; Which Protocol Stack Shall Be Selected For Developing Private Application Based On Zigbee Mesh; Production Guidance; Reflow Soldering Temperature - Ebyte E18 Series User Manual

CC2530 Wireless Module
4.1.6.

About the difference between OAD and OTA in TI protocol stack?

OAD is short for Over the Air Download, OTA is short for Over the Air. The functions of these two are the same, they can be called the
software upgrade on air. In the earlier ZigBee protocol standard, there was no standard for node software upgrading on air, but many
customers have such requirements, thus TI developed their own protocol stack for software upgrading on air, and named it as OAD. After
that, ZigBee alliance noticed the more and more requirements for upgrading on air, so they developed the upgrading on air standard and
named it as OTA, this standard has taken the TI OAD method as reference and has made some modification. The upgrading on air in TI's
earlier protocol stack, it is called OAD, and in the later stack, it is called OTA as following the ZigBee alliance stack.
4.1.7.

Which protocol stack shall be selected for developing private application based on ZigBee Mesh?

Many customers only need to apply the function of ZigBee Mesh network in their system or products, and do not need to do according to
the application layer as defined by the ZigBee, especially for some industrial applications, as for such requirements, how to select proper TI
protocol stack for developing products?
http://www.deyisupport.com/question_answer/wireless_connectivity/zigbee/f/104/t/132197.aspx

5. Production guidance

5.1. Reflow soldering temperature

Pre-heating area: maximum temperature rise is 2.5℃/s;

Thermal insulation area: temperature is 150~190℃, time is 60~90s，maximum temperature rise is 2.5℃/s;

Reflowing area: maximum temperature is 235~245℃, time for above 217℃ is 40~80s;

Cooling area: maximum temperature drop is 4℃/s.


5.2. Reflow soldering curve

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