Wrap.1D / Wrap.1E Revision Changes; Wrap.1C / Wrap.1D Revision Changes; Wrap.2B / Wrap.2C Revision Changes; Support - PC Engines WRAP User Manual

WRAP.1D / WRAP.1E revision changes

The following changes were made going from revision 1D to revision 1E:
pd 050101 3
6
6
6
6
7
7
7
PCB
PCB

WRAP.1C / WRAP.1D revision changes

The following changes were made going from revision 1C (China) to revision 1D (Taiwan):
pd 040512 5
6
10
PCB

WRAP.2B / WRAP.2C revision changes

The following changes were made going from revision 2B (China) to revision 2C (Taiwan):
pd 040520 5
pd 040512 PCB

Support

Please email pdornier@pcengines.ch.
WRAP router platform
Change R97 to 1.5K (ECN009).
Add optional buzzer (e.g. Hycom HY-05) in place of C22.
Add optional soldered battery.
Add IDE DMA support.
Change to TSOP flash (to make space for soldered
battery + commonality with WRAP.2C).
Add 2.2nF capacitor on OVERTMP# net (ECN009).
Delete MIC8115 alternative reset.
Add BAS40-06 dual diode as alternative to MBR0520L.
Reroute OVERTMP# to avoid surge coupling.
Change 4.7uF capacitors to 0805 package.
Change J5 miniPCI (optional) to REQ3, GNT3.
Change J6 miniPCI (always populated) to REQ0, GNT0.
Serial port -> disable auto power down
(ONLINE# = FORCEON high).
Change LAN3 to REQ3, GNT3.
Change silk screen to "Assembled in Taiwan".
Change miniPCI socket from REQ3/GNT3 -> REQ2 / GNT2.
Change silk screen to "Assembled in Taiwan".
12 2/13/2007