Table of Contents
Advertisement
Quick Links
DESCRIPTION
CEL's MeshConnect™ EM357 Mini Modules combine high
performance RF solutions with the market's premier ZigBee
stack. Available in low and high output power options
(+8dBm and +20dBm), these modules can accommodate
variable range and performance requirements. The tiny
module footprint makes them suitable for a wide range
of ZigBee applications. The MeshConnect EM357 Mini
Modules are certified and qualified, enabling customers to
accelerate time to market by greatly reducing the design
and certification phases of development.
CEL's MeshConnect EM357 Mini Modules (ZICM357SP0,
ZICM357SP2) are based on the Ember EM357 Zigbee
compliant SOC radio IC. The IC is a single-chip solution,
compliant with ZigBee specifications and IEEE 802.15.4,
a complete wireless solution for all ZigBee applications.
The IC consists of an RF transceiver with the baseband
modem, a hardwired MAC and an embedded 32-bit ARM®
Cortex™-M3 microcontroller with internal RAM (12kB) and
Flash (192kB) memory. The device provides numerous
general-purpose I/O pins and peripheral functions such as
timers and UARTs.
ORDERING INFORMATION
Part Number
Order Number
ZICM357SP0-1
ZICM357SP0-1C
MeshConnect™
EM357 Mini Modules
ZICM357SP2-1
ZICM357SP2-1C
MeshConnect™ EM357
ZICM-EM35X-DEV-KIT-2
Development Kit
The information in this document is subject to change without notice.
Document No: 0011-00-07-00-000 (Issue E)
Date Published: June 20, 2013
DATA SHEET
MeshConnect™ EM357 Mini Modules
Ember
Integrated Transceiver Modules for ZigBee / IEEE 802.15.4
Development Kit available: ZICM-EM35X-DEV-KIT-2
®
Description
+8 dBm Output Power, PCB Trace antenna
+8 dBm Output Power, with Castellation pin for external antenna
+20 dBm Output Power, PCB Trace antenna
+20 dBm Output Power, with Castellation pin for external antenna
MeshConnect EM35x Ember Companion Kit for Ember EM35x
Development Kit
ZICM357SP0-1, ZICM357SP2-1
EM357 Transceiver Based Modules
TM
MeshConnect
• 192 kB FLASH
• 12 kB SRAM
• 32-bit ARM® Cortex™-M3
• Up to 23 GPIO Pins
• SPI (Master/Slave), TWI, UART
• Timers, Serial Wire/JTAG Interface
• 5-channel 14-bit ADC
ZICM357SP0
Tx:
+8dBm
Rx:
-100dBm
Link Budget:
+108dB
FEATURES
• High RF Performance:
Up to 123 dB RF Link Budget
RX Sensitivity:
-100 dBm (ZICM357SP0)
-103 dBm (ZICM357SP2)
• Data Rate: 250 kbps
• Advanced Cortex-M3 Processor
• Advanced Power Management
• 16 RF Channels
• Industry's Premier ZigBee Pro
Stack: EmberZNet PRO™
APPLICATIONS
•
Smart Energy / Grid Markets
Thermostats
In-Home-Displays
Smart Plugs
Building Automation and
•
Control
•
Lighting: Fixture and Control
™
EM357 Mini Modules
ZICM357SP2
+20dBm
-103dBm
+123dB
• Mini Footprint:
(23.9mm x 16.6mm)
0.940" x 0.655"
• Antenna Options:
1) Integrated PCB Trace Antenna
or
2) RF Port for External Antenna
• Supports Mesh Networks
• AES Encryption
• FCC, CE and IC Certifications
• ROHS Compliant
Solar Inverter and Control
•
Home Automation and Control
•
Energy Management
Security Devices
HVAC Control
•
General ZigBee Wireless Sensor
Networking
Min./Multiple
330 / 330
330 / 330
330 / 330
330 / 330
1 / 1
Advertisement
Table of Contents
Related Manuals for CEL MeshConnect ZICM357SP0-1
Summary of Contents for CEL MeshConnect ZICM357SP0-1
-
Page 1: Description
Development Kit available: ZICM-EM35X-DEV-KIT-2 DESCRIPTION MeshConnect ™ EM357 Mini Modules CEL’s MeshConnect™ EM357 Mini Modules combine high • 192 kB FLASH performance RF solutions with the market's premier ZigBee ® • 12 kB SRAM stack. Available in low and high output power options •... -
Page 2: Module Block Diagram
CEL's MeshConnect EM35x Ember Companion Kit is EM35x Ember Companion Kit designed to work with the Ember development kit [EM35X- DEV and EM35X-DEV-IAR]. Each module in this CEL kit is soldered on a carrier board making it pin-for-pin compatible Kit Contents: with the Ember development board. -
Page 3: Table Of Contents
MeshConnect™ EM357 Mini Modules TABLE OF CONTENTS Introduction and Overview Description......................................Features........................................Applications......................................Ordering Information..................................... Module Block Diagram................................... Development Kit..................................... System Level Function Transceiver IC......................................Antenna........................................Power Amplifier...................................... Software/Firmware....................................Electrical Specification Absolute Maximum Ratings................................... Recommended (Operating Condition)..............................DC Characteristics....................................RF Characteristics....................................Pin Signal and Interfaces Pin Signals I/O Configuration................................ -
Page 4: Transceiver Ic
(a minimum of 1.5" x 1.5" is recommended). The installation of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout. -
Page 5: Absolute Maximum Ratings
MeshConnect™ EM357 Mini Modules ABSOLUTE MAXIMUM RATINGS MeshConnect™ ZICM357SPx Module Description Unit Power Supply Voltage (V -0.3 Voltage on any I/O Line -0.3 + 0.3 ZICM357SP0 – RF Input Power ZICM357SP2 – Storage Temperature Range °C Reflow Soldering Temperature – °C Note: Exceeding the maximum ratings may cause permanent damage to the module or devices. -
Page 6: Pin Signals I/O Configuration
MeshConnect™ EM357 Mini Modules PIN SIGNALS I/O PORT CONFIGURATION CEL’s MeshConnect module has 33 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions shows the layout of the 33 edge castellations. MeshConnect I/O PIN ASSIGNMENTS... - Page 7 MeshConnect™ EM357 Mini Modules MeshConnect I/O PIN ASSIGNMENTS (Continued) CEL MeshConnect Ember EM357 ZICM357SPx Name Notes IC Pin Number Module PIN Number Digital I/O SC1MISO - SPI slave data out of Serial Controller 1 SC1MOSI - SPI master data out of Serial Controller 1...
-
Page 8: Module Dimensions
MeshConnect™ EM357 Mini Modules MODULE DIMENSIONS MeshConnect™ EM357 Mini Modules EM300 Series Module ZICM35xSPx 0000 00 00 00 000 Pin 33 R11 C23 R11 C23 Pin 1 C6A C1 C6A C1 XTAL1 XTAL1 Pin 11 Pin 22 0.062” 0.655” 0.152” MAX Note: All dimensions are +/- 0.005"... -
Page 9: Module Footprint
MeshConnect™ EM357 Mini Modules MODULE LAND FOOTPRINT Note: For layout recommendation for optimum antenna performance, refer to the Antenna section in this document. Page 9... -
Page 10: Processing
MeshConnect™ EM357 Mini Modules PROCESSING Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max Minimum Soak Temperature 150ºC Maximum Soak Temperature 200ºC Soak Time 60-120 sec TLiquidus 217ºC Time above TL 60-150 sec Tpeak 250ºC Time within 5º... -
Page 11: Agency Certifications
Warning (Part 15.21) Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment. 20 cm Separation Distance To comply with FCC/IC RF exposure limits for general population/uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. - Page 12 MeshConnect™ EM357 Mini Modules AGENCY CERTIFICATIONS (Continued) The OEM of the MeshConnect Module may only use the approved antenna, (PCB Trace Antenna) that has been certified with this module. The OEM of the MeshConnect Module must test their final product configuration to comply with Unintentional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.
- Page 13 The ZICM357SP2 requires software restrictions to meet agency certification requirements. These restrictions have been implemented in the sample application included with the software development kit. If a customer is not starting with CEL's software development kit, they must implement these output power restrictions to use the ZICM357SP2 FCC or IC certification:...
-
Page 14: Shipment, Storage And Handling
Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity. QUALITY CEL modules offer the highest quality at competitive prices. Our modules are manufactured in compliance with the IPC-A-610 specification, Class II. Our modules go through JESD22 qualification processes which includes high temperature operating life tests, mechanical shock, temperature cycling, humidity and reflow testing. -
Page 15: Revision History
• CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products.