Design Of Steel Mesh Aperture At The Module Board's Pad On The Interface Board; Module Board's Mounting - Zte MG2639_V3 User Manual

Module hardware design
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(The diagram is just for your reference; it does not represent the actual module encapsulation)
In addition, other components cannot be arranged within 2mm around the module on the
interface board to ensure the maintenance of the module.
6.1.4

Design of steel mesh aperture at the module board's pad on the interface board

The thickness of the steel mesh on the interface board is selected based on the principle of
comprehensive consideration according to the encapsulation type of components on the interface
board. The expected thickness of steel mesh at the module on the interface board is 0.15mm (locally
increased to 0.18MM at the module position), or just 0.18mm. In respect of the steel mesh aperture,
the inner side of the pad is cut by 0.3mm, the two sides are respectively cut by 0.1mm, and the
outside is extended by 0.5mm.
0.1MM
6.1.5

Module Board's Mounting

The pallets, which are suitable for mounting, have been made for many modules. If our company
has offered the pallets, customers can directly apply them in Pick & placement machine; otherwise,
customers need make a loading tool similar to the pallet. Customers can take out the modules from
This document is not allowed to
transmit without ZTE Corporation's
permission
0.1M
M
Steel
Mesh
Mouth
Module Pad on
PCB
©ZTE CORPORATION All rights reserved
Thicknesses of White
Oil and Green Oil
0.5MM
0.3MM
User Manual
31

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