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Summary of Contents for Zte MG2639_V3
- Page 1 MG2639_V3 Module Hardware Design User Manual Version：V1.2...
- Page 2 User Manual Copyright Statement If you accept this manual of ZTE Corporation, it means that you have agreed to the following terms and conditions; if you don’t agree, please stop using this manual. The copyright of this manual belongs to ZTE Corporation. ZTE Corporation reserves any rights not expressly granted in this manual.
- Page 3 ‘Connection Method of GPS Active Antenna’. Writer Document version Date Written by Checked by Approved by 2012-8-23 Cai Zongfei 2013-11-08 Cai Zongfei 2014-1-4 Zhao Xiaolin This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved...
- Page 4 3. Provide evaluations and technical diagnosis for principle diagram, PCB, test scenarios; 4. Provide test environment; ZTE Corporation provides customers with onsite supports, and also you could get supports through telephone, website, instant messenger, E-mail, etc. This document is not allowed to transmit without ZTE Corporation’s...
- Page 5 Preface Summary This document describes MG2639_V3 module’s product principle diagram, module’s PINs, hardware interface and module’s structure, and instructs the users to perform hardware design of modules, and quickly and conveniently design different kinds of wireless terminals on the basis of this module.
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Page 6: Table Of Contents
3.1.12 SIM CARD INTERFACE................16 3.1.13 AUDIO INTERFACE................16 3.1.14 NETWORK SIGNAL INDICATION............17 MODULE’S POWER CONSUMPTION..............17 RELIABILITY CHARACTERISTICS..............17 ESD CHARACTERISTICS................18 INTERFACE CIRCUIT DESIGN ..................19 RESET AND POWER DESIGN...............19 This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... - Page 7 6.2.2 BAKING DEVICES AND OPERATION PROCEDURE......34 6.2.3 PARAMETER SETTINGS OF BAKING DEVICES........34 MECHANICAL DIMENSIONS ..................... 35 APPEARANCE DIAGRAM................35 MODULE’S ASSEMBLY DIAGRAM..............36 MODULE’S PCB PACKAGE DIMENSIONS............37 This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved...
- Page 8 Figure 4-9 Charging interface circuit reference design principle diagram ............27 Figure 5-1 Furnace temperature curve ..................错误！未定义书签。 Figure 6-1 MG2639_V3 appearance diagram ......................... 35 Figure 6-2 Module’s assembly diagram ..........................36 Figure 6-3 Relevant package dimensions from TOP view ..................37 Figure 6-4 Relevant package dimensions from BOTTOM view ................
- Page 9 Table 3-12 SIM card interface signal definitions ......................16 Table 3-13 Audio interface signal definitions ........................ 17 Table 3-14 MG2639_V3 power consumption ......................... 17 Table 3-15 MG2639_V3 module’s temperature characteristics ................18 Table 3-16 ESD characteristics ............................. 18 Table 4-1 Voltage characteristics ............................20 Table 4-3 UART1 interface definitions ..........................
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Page 10: General Description Of Module
User Manual General description of module Developed by ZTE Corporation, MG2639_V3 is a kind of GSM850/EGSM900/DCS1800/ PCS1900 industrial module with the independent GPS function, which can be built in the Set-Top-Box, vehicle-mounted terminals through a 60-PIN stamp-hole interface, and it allows users to send/receive Emails, browse the web pages and download at high speed anywhere and anytime. -
Page 11: Module's Application Block Diagram
AT Command Set GSM 07.05/GSM 07.07/ZTE Proprietary AT Commands Module’s application block diagram See the application block diagram of MG2639_V3 in the following figure: This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 12: Abbreviations
Digital Signal Processor Data Terminal Equipment DTMF Dual Tone Multi-Frequency Data Terminal Ready EDGE Enhanced Data Rate for GSM Evolution Enhanced Full Rate EGSM Enhanced GSM This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... - Page 13 Surface Mount Technology SRAM Static Random Access Memory Terminal adapter TDMA Time Division Multiple Access Terminal Equipment also referred it as DTE UART Universal asynchronous receiver-transmitter This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved...
- Page 14 User Manual User Identifier Management Universal Serial Bus USIM Universal Subscriber Identity Module VSWR Voltage Standing Wave Ratio ZTE Corporation This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved...
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Page 15: Descriptions Of Module's External Interfaces
Descriptions of module’s external interf aces MG2639_V3 module connects externally through a 60PIN stamp-hole interface. Definitions of module’s interf aces See the definitions of MG2639_V3 module’s 60PIN stamp-hole interface in the following table: Table 2-1 60pin stamp-hole definitions Default signal... - Page 16 Power on/off open-collector or open-drain switch. Input, Data terminal DTR1 UART1 2.8V IO GPIO5 ready _WAKEUP DSR1 UART1 Output, Data set ready 2.8V IO This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved...
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Page 17: Antenna Interface
2.8V IO GPIO53 Antenna Interf ace Regarding the antenna of MG2639_V3 module, proper measures should be taken to reduce the access loss of effective bands, and good shielding should be established between external antenna This document is not allowed to transmit without ZTE Corporation’s... -
Page 18: Figure 2-1 Π Shape Matching Network Diagram
RF connector. Besides, external RF cables should be kept far away from all interference sources such as high-speed digital signal or switch power supply. According to the standard for mobile devices, the stationary wave ratio of MG2639_V3 module’s antenna should be between 1.1 and 1.5, and input impedance is 50 ohm. Different environments may have different requirements on the antenna’s gain. -
Page 19: Figure 2-2 Antenna Interface Diagram
PIN2/PIN16 and GND, and drill holes below PIN2/PIN16. It’s not suggested to use the compatible design of PIN2/PIN16 at the same time when using the RF connector. Figure 2-2 Antenna interface diagram This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 20: Antenna Interface's Rf Performance
GSM850 824MHz-849MHz 869MHz-894MHz 33±2 < -107dBm EGSM900 880MHz-915MHz 925MHz-960MHz 33±2 < -107dBm DCS1800 1710MHz-1785MHz 1805MHz-1880MHz 30±2 < -106dBm PCS1900 1850MHz-1910MHz 1930MHz-1990MHz 30±2 < -106dBm This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 21: Module's Electrical Characteristics
Transmitting data from serial port 2.8V IO 3.1.3 I2C MG2639_V3 module provides one I2C BUS interface. SCL and SDA have been pulled up to 2.8V through 2.2K resistance inside the module, and it supports 7BIT/10BIT seeking and high-speed transmission mode. -
Page 22: Spi
Note: the software doesn’t support this interface by default, therefore it requires customization. 3.1.5 PCM MG2639_V3 module adopts its 56-60 PINs as the PCM interface, through which users can expand the audio DAC. Table 3-4 PCM interface signal definitions Classification... -
Page 23: Usb
User Manual 3.1.6 USB MG2639_V3 module integrates the USB interface and conforms to USB1.1 interface specifications. The module can connect the host through the interface and provide up to 12Mbps data rate. Users can upgrade the software via the interface. -
Page 24: Gps/Glonass/Beidou
Note: the software doesn’t support this interface by default, therefore it requires customization. 3.1.10 GPS/GLONASS/Beidou MG2639_V3 module’s GPS function is completely independent from its wireless data communication. The GPS cell provides independent power input and PIN to output the GPS information through the serial port. -
Page 25: Charging
3.1.12 SIM card interface MG2639_V3 module supports the SIM card interface conforming to ISO 7816-3 standard, and it supports SIM cards with two different standards: 1.8V and 3.0V. Users should note that the SIM card’s electrical interface should be defined exactly the same as the SIM card socket. -
Page 26: Network Signal Indication
The output status of RSSI_LED PIN is defined according to the software protocol. The RSSI_LED PIN is a general I/O port with the output driving capability 4mA. Module’s power consumption It describes the module’s power consumption under each status: Table 3-14 MG2639_V3 (GPRS) power consumption Status Frequency Rx. power Min. -
Page 27: Esd Characteristics
User Manual Table 3-15 MG2639_V3 module’s temperature characteristics Parameters Descriptions Min. Max. Remarks Operation temperature -35℃ 75℃ Make sure not to compromise the Limited temperature -40℃ +85℃ RF performance apparently Storage temperature -40℃ +85℃ ESD characteristics See the ESD characteristics at room temperature. -
Page 28: Interface Circuit Design
Figure 4-1 Power & reset circuit reference design principle diagram 输出模块用电压VBAT 电源 22uf 100uf 0.1uf 缓启动电路 PWRKEY_N SYSRST_N MCU_ON/OFF MCU_RESET 4.7K 4.7K This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 29: Figure 4-2 Power Reference Circuit
MIC29302 Power design MG2639_V3 module is powered by VBAT. If the external power cannot be stably started, it’s recommended to add buffer circuit in the circuit. See the module’s required voltage characteristics in table 4-1. Table 4-1 Voltage characteristics... -
Page 30: Uart Interface
UART interf ace MG2639_V3 module provides an integrated full duplex UART1 interface (shortly referred to as UART interface) and an accessorial UART2 interface. The default baud rate is 115200bps and the external interface adopts 2.8V CMOS level signal, which conforms to RS-232 interface protocol. -
Page 31: Figure 4-4 Uart Interface Reference Design Diagram
Figure 4-3 shows the level conversion to 3.3V through the UART interface of MG2639_V3. The resistance and capacitance in figure 4-3 are just for reference, and they need to be recalculated during the design. The diode in Figure 4-4 is Schottky diode (forward voltage drop is 0.3V). -
Page 32: Descriptions Of Uart1 Interface
Output Ringtone Inform DTE upon a indication remote call DSR1 Output Data set ready DCE is ready DCD1 Output Carrier detection Data link connected This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 33: Descriptions Of Uart2 Interface
Output Transmitting data DTE receives serial data SIM card interf ace MG2639_V3 module supports 1.8V or 3.0V SIM card. Refer to figure 4-7 for design. This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 34: Audio Interface
1uf), and then 0.1uf capacitance is added. Audio interf ace MG2639_V3 module provides audio input and output interfaces through its PINs. There are 2 Speaker interfaces and 2 Microphone interfaces. Only one pair I/O works at the same time. See the audio interface circuit in figure 4-8. -
Page 35: Figure 4-8 Audio Interface Circuit Reference Design Principle Diagram
0.5V. If the dynamic range is lower than 0.5V, then the pre-amplifier should be added. If the dynamic range is higher than 0.5V, then network attenuation should be added. Design of the audio interface on the earpiece This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 36: Charging Interface
Note: In order to get better audio effect for users, we present the following suggestions: 1） During the process of using MG2639_V3 module, it’s advised to use 100pf & 33pf capacitance on its external audio path, and serially connect with the beads to improve the audio quality. -
Page 37: Gps Interface
GPS_RFIN to GPS active antenna. The resistance of RF cable in the figure is 50Ω. Figure 4-11 Active GPS antenna circuit reference design principle diagram This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 38: Pcb Design
4）The wiring between the SIM card socket and MCU should be as short as possible to prevent signals from being affected by long wiring, which might result in the failure of SIM card recognition. This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 39: Module Board's Mounting Process And Baking Guide
For the design of interface board’s pad, please refer to the standard pad design recommended by ZTE Mobile Telecom Co., Ltd. It is recommended that the sum of the thickness of the green oil and white oil at the module on the interface board should be less than 0.02mm because the greater thickness would affect the welding quality of module board and interface board. -
Page 40: Design Of Steel Mesh Aperture At The Module Board's Pad On The Interface Board
Pick & placement machine; otherwise, customers need make a loading tool similar to the pallet. Customers can take out the modules from This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 41: Furnace Temperature Curve
240~245° C. The time of the temperature above 217° C is 30~60 seconds. Besides, the temperature at the preheating area is kept at 150~200° C, and the time is 60~120 seconds. This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 42: Reflow Method
Module’s Baking Guide The module must be baked prior to second reflow. This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 43: Module's Baking Environment
During the baking process, do not overlay the modules directly because it might cause damage to the module’s chipset. 6.2.3 Parameter Settings of Baking Devices Baking temperature: 125℃±5℃ Baking duration: 8 hours This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 44: Mechanical Dimensions
User Manual 7. Mechanical dimensions Appearance diagram Figure 7-1 MG2639_V3 appearance diagram Dimensions (L×W×H)：30.0 × 25.0 × 3.0mm Weight: <6g This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 45: Module's Assembly Diagram
User Manual Module’s assembly diagram See the module’s assembly diagram in figure 7-2. Figure 7-2 Module’s assembly diagram This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 46: Module's Pcb Package Dimensions
User Manual Module’s PCB package dimensions See the module’s PCB package dimensions in figure 7-3. Figure 7-3 Relevant package dimensions from TOP view This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved... -
Page 47: Figure 6-4 Relevant Package Dimensions From Bottom View
User Manual Figure 7-4 Relevant package dimensions from BOTTOM view This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved...
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