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SANYO Original technology
Module technologies that achieve high-density and thinner form factors
Integrated System in Board
Integrated System in Board
Integrated System in Board Process Lineup
ISB-Solo
Thickness of only 0.45 mm (0.65 mm if resistors are included) realizes excellent thermal radiation and
short development TAT
Optimal for SiP implementation of small-scale block that includes semi-power semiconductors.
Assembly structure examples
ISB-Duo
Adopts unique SANYO-developed 0.2 mm thickness high-density substrate (2 layers)
Line 40 µm / Space 40 µm at 25 µm thickness copper foil,
Via diameter 100 µm / Via land diameter 150 µm
Thickness of only 0.53 mm (0.73 mm if resistors are included) realizes high-density mounting
Optimal for SiP implementation of high-frequency (up to 10 GHz) blocks, blocks that require
performance or EMC workarounds based on component placement/wiring pattern, and blocks that
require partial high-density mounting.
Assembly structure examples
ISB-Quad
Adopts unique SANYO-developed 0.24 mm thickness high-density substrate (4 layers)
Thickness of only 0.6 mm realizes high-density mounting
Optimal for SiP implementation of high-frequency (up to 10 GHz) blocks, blocks that require performance
or EMC workarounds based on component placement /wiring pattern, and subsystems that require high-
density mounting.
Chip-on-Board type
Assembly structure examples
ISB-Duo
ISB-Quad
6
Application example (Cell phone charger circuit block)
Earlier mounting
Integrated System in Board
Integrated System in Board
Top surface
4.45
4.45
Mounting area reduced by 80%
Application example (Clock detector block)
Earlier mounting
Integrated System in Board
Integrated System in Board
Top surface
4.3
4.3
Mounting area reduced by 58%
Passive components
WS-CSP
Flip Chip
(resistors and capacitors)
0.24 mm
Integrated System in Board is a type of SiP (system in package) technology, and is a module technology that achieves high
densities and thinner form factors by using SANYO's unique substrate and mounting technologies. The Integrated System in
Board lineup consists of three types of process: ISB-Solo, ISB-Duo, and ISB-Quad. Which process is used is selected based on
the application.
In addition to standard products, customer specified circuit blocks can also be converted to Integrated System in Board using an
optimal process, thus creating a new module device in a short time.
Noise suppression effect (measured)
Reasons noise can be reduced by Integrated Sysytem in Board
Reduced wiring area due to implementation as miniature modules
Integration of noise reducing components
Supply voltage stabilization by using dedicated layers for power supply and ground
Back surface
Dedicated power
supply/ground layer
0.65 mm
3
Surface scan using a field probe
ISB-Duo (2-layer ISB)
Back surface
Heat dissipation effect (simulation)
0.73 mm
3
Typical BGA
97
MK
89
Z
Y
X
81
73
65
Integrated System Board package
57
MK
49
Z
Y
X
Integrated System Board
41
that dissipates heat
MK
33
Y
X
25
Integration of noise
reducing components
LSI
Wiring on board
Integration of
reducing components
Separate microcontroller
and SRAM
Integrated System in
Board stack structure
(high-density mounting)
Integration of
reducing components
Evaluation results using a microcontroller and SRAM
(Surface probe method - 30 MHz to 1 GHz)
Analysis conditions
Maximum temperature
Chip heat generation
92.7 [ C]
Chip size
Land size
Temperature
difference
Atmospheric temperature
38.4 C
Temperature
Cooling conditions
difference
52.3 C
Analysis model
Maximum
temperature
54.3 [ C]
Maximum
temperature
40.4 [ C]
Microcontroller
noise
SRAM
Noise is reduced
significantly
10 mm
10 mm
Microcontroller
noise
SRAM
3 [W]
4 4 0.3 [mm
3
]
5 5 0.03 [mm
3
]
25 [ C]
Ideal cooling of the solder lower
surface;
25 [ C]
1/4 model (since symmetrical)
7
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