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STANDARD NOTES FOR SERVICING
Circuit Board Indications
1. The output pin of the 3 pin Regulator ICs is
indicated as shown.
Top View
Out
In
2. For other ICs, pin 1 and every fifth pin are
indicated as shown.
Pin 1
3. The 1st pin of every male connector is indicated as
shown.
Pin 1
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an
angle.
FFC Cable
Connector
* Be careful to avoid a short circuit.
Bottom View
Input
5
10
CBA
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
IDENTIFICATION:
Regardless of special logo (not always
indicated)
One must treat all sets from 1.1.2005
onwards, according next rules.
Important note: In fact also products a little older can
also be treated in this way as long as you avoid mixing
solder-alloys (leaded/ lead-free). So best to always
use SAC305 and the higher temperatures belong to
this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solder-
paste is required, please contact the manufacturer
of your solder-equipment. In general use of solder-
paste within workshops should be avoided because
paste is not easy to store and to handle.
• Use only adequate solder tools applicable for lead-
free solder alloy. The solder tool must be able
• To reach at least a solder-temperature of 400°C,
• To stabilize the adjusted temperature at the solder-
tip
• To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around
360°C - 380°C is reached and stabilized at the
solder joint. Heating-time of the solder-joint should
not exceed ~ 4 sec. Avoid temperatures above
400°C otherwise wear-out of tips will rise drastically
and flux-fluid will be destroyed. To avoid wear-out of
tips switch off un-used equipment, or reduce heat.
• Mix of lead-free solder alloy / parts with leaded
solder alloy / parts is possible but PHILIPS
recommends strongly to avoid mixed solder alloy
types (leaded and lead-free). If one cannot avoid,
clean carefully the solder-joint from old solder alloy
and re-solder with new solder alloy (SAC305).
• Use only original spare-parts listed in the Service-
Manuals. Not listed standard-material (commodities)
has to be purchased at external companies.
• Special information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for de-
soldering always use highest lead-free temperature
profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called
'dry-packaging' (sealed pack including a silica gel
pack) to protect the IC against moisture. After
opening, dependent of MSL-level seen on indicator-
label in the bag, the BGA-IC possibly still has to be
baked dry. This will be communicated via AYS-
1-3-1
DVDN_PC_SN
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