Download  Print this page

Philips DVP3960/37 Service Manual Page 5

Hide thumbs


Lead-Free requirement for service
Regardless of special logo (not always indicated)
One must treat all sets from 1.1.2005 onwards, according
next rules.
Important note: In fact also products a little older can also
be treated in this way as long as you avoid mixing
solder-alloys (leaded/ lead-free). So best to always use
SAC305 and the higher temperatures belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solder-paste is
required, please contact the manufacturer of your
solder-equipment. In general use of solder-paste within
workshops should be avoided because paste is not easy
to store and to handle.
• Use only adequate solder tools applicable for lead-free
solder alloy. The solder tool must be able
o To reach at least a solder-temperature of 400°C,
o To stabilize the adjusted temperature at the
o To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around
360°C – 380°C is reached and stabilized at the solder
joint. Heating-time of the solder-joint should not exceed
~ 4 sec. Avoid temperatures above 400°C otherwise
wear-out of tips will rise drastically and flux-fluid will be
destroyed. To avoid wear-out of tips switch off un-used
equipment, or reduce heat.
• Mix of lead-free solder alloy / parts with leaded solder
alloy / parts is possible but PHILIPS recommends
strongly to avoid mixed
solder alloy types (leaded and lead-free). If one cannot
avoid, clean carefully the
solder-joint from old solder alloy and re-solder with new
solder alloy (SAC305).
Use only original spare-parts listed in the
Service-Manuals. Not listed standard-material
(commodities) has to be purchased at external
Special information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for
temperature profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called
'dry-packaging' (sealed pack including a silica gel
pack) to protect the IC against moisture. After
opening, dependent of MSL-level seen on
indicator-label in the bag, the BGA-IC possibly
still has to be baked dry. This will be
communicated via AYS-website.
Do not re-use BGAs at all.
For sets produced before 1.1.2005, containing
leaded soldering-tin and components, all needed
spare-parts will be available till the end of the
service-period. For repair of such sets nothing
• On our website:
You find more information to:
BGA-de-/soldering (+ baking instructions)
Heating-profiles of BGAs and other ICs used in
You will find this and more technical information
within the "magazine", chapter "workshop news".
For additional questions please contact your local


Table of Contents

   Also See for Philips DVP3960/37

   Related Manuals for Philips DVP3960/37

Comments to this Manuals

Symbols: 0
Latest comments: