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HCD-EP404
Ver 1.1 2002.07
TABLE OF CONTENTS
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3-1. Front Panel Section ······················································· 6
3-2. MAIN Board ································································· 7
3-3. Tape Mechanism Deck (CFL4318) ······························· 7
3-4. POWER Board, Power Transformer ····························· 8
3-5. DISPLAY Board, HEADPHONE Board ······················ 8
3-6. CD Cabinet Section ······················································ 9
3-7. CD Mechanism Deck (CS-21SC-1280) ························ 9
3-8. Cassette Lid ································································ 10
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6-1. Circuit Boards Location ·············································· 15
6-2. Block Diagrams ·························································· 16
TUNER/TAPE DECK Section ··································· 16
AMP Section ······························································· 17
DISPLAY/POWER Section ········································ 18
6-3. Printed Wiring Board MAIN Section ························ 19
6-4. Schematic Diagram MAIN Section (1/3) ·················· 20
6-5. Schematic Diagram MAIN Section (2/3) ·················· 21
6-6. Schematic Diagram MAIN Section (3/3) ·················· 22
6-7. Printed Wiring Board PANEL Section ······················ 23
6-8. Schematic Diagram PANEL Section ························· 24
6-9. Printed Wiring Board POWER Section ····················· 25
6-10. Schematic Diagram POWER Section ························ 26
6-12. IC Pin Function Description ······································· 29
······················································ 31
7-1. Cabinet Section ··························································· 31
7-2. Front Panel Section -1 ················································ 32
7-3. Front Panel Section -2 ················································ 33
7-4. CD Cabinet Section ···················································· 34
2
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Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
The following caution label is located inside the unit.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
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