Block Diagram -Display Section - Sony CDX-GT07 Service Manual

CDX-GT07/CXS-GT07HP
5-2. BLOCK DIAGRAM – DISPLAY Section –
SYSTEM CONTROL
IC501 (2/2)
KEY MATRIX 40 KEYIN1
LSW903–910, S904
LCD_SO
LSW901, 902, S901–903 41 KEYIN0
LCD_CKO
D503 LCD_CE
KEY ACKNOWLEDGE
SWITCH
52 KEY ACK
Q664
RE901
PUSH SELECT
76 AD_ON
(VOLUME)
ROTARY
RE-0
31 RE-IN0
ENCODER
RE-1
32 RE-IN1
79 XOUT
X502
32.768kHz
80 XIN
82 OSCIN
X501
18.432MHz
83 OSCOUT
CN901 CN701
15 15
7 NOSE_SW SIRCS
CDX-GT07/CXS-GT07HP
DISPLAY CONTROL
IC901
3
S1
| LCD901
28 48 DI
|
34
29 47 CL CL
LIQUID
S33 •
39
27 46 CE CE CRYSTAL
DISPLAY
COM4 35
PANEL
|
|
COM1
38
1 2
PANEL+B
LED931
( )
LCD BACK
LIGHT
LSW901–910
( KEY )
ILLUMINATE
DIMMER
SWITCH
Q931
BACK LIGHT
SWITCH
PANEL+B
Q932
LED861,863–865
REMOTE CONTROL
KEY
( )
SIGNAL RECEIVER
ILLUMINATE
IC971
64 2 OUT
IR
• NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1 / W or less unless otherwise
4
specified.
• f : internal component.
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• B : B– Line.
• H : adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
( ) : AM
< > : CD PLAY
∗ : Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD PLAY
F
: FM
f
: AM
L : AUX
• Waveforms
— MAIN Board —
1
IC501 ul (XOUT)
1Vp-p
32.768kHz
0.5 V/DIV, 20 µ sec/DIV
18 18
For printed wiring boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Through hole.
a
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
C
Q
These are omitted
B E
B E C
These are omitted
E C B
These are omitted
2
IC501 id (OSCOUT)
3.1Vp-p
18.432MHz
1 V/DIV, 20 nsec/DIV