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Philips Semiconductors
TOPFET high side switch
SMD version of BUK210-50Y
MECHANICAL DATA
Plastic single-ended surface mounted package (Philips version of D
(one lead cropped)
H D
DIMENSIONS (mm are the original dimensions)
A
UNIT
4.50
mm
4.10
OUTLINE
VERSION
SOT426
Fig.34. SOT426 surface mounting package
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
May 2001
E
D 1
D
3
1
2
4
e
e
e
D
A 1
b
c
D 1
max.
1.40
0.85
0.64
1.60
11
1.27
0.60
0.46
1.20
REFERENCES
IEC
JEDEC
2
-PAK); 5 leads
mounting
base
5
b
e
0
2.5
5 mm
scale
L p
H D
Q
E
e
10.30
2.90
15.80
2.60
1.70
2.10
14.80
2.20
9.70
EIAJ
1
, centre pin connected to mounting base.
12
Product specification
A
A 1
L p
c
Q
EUROPEAN
ISSUE DATE
PROJECTION
98-12-14
99-06-25
BUK215-50Y
SOT426
Rev 1.010
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