Table of Contents
Advertisement
Philips Semiconductors
1 to 4 W audio power amplifier
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
1
Z
DIMENSIONS (mm are the original dimensions)
A
2
UNIT
A
A
3
max.
18.5
8.7
mm
3.7
17.8
8.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT110-1
November 1982
D
D
1
q
P
P
1
pin 1 index
e
b
2
A
b
b
b
c
4
1
2
15.8
1.40
0.67
1.40
0.48
15.4
1.14
0.50
1.14
0.38
REFERENCES
IEC
JEDEC
q
q
1
L
9
b
w
M
b
1
0
5
10 mm
scale
(1)
(1)
D
D
E
e
L
1
21.8
21.4
6.48
3.9
2.54
21.4
20.7
6.20
3.4
EIAJ
12
A
3
2
A
A
4
P
P
Q
q
1
2.75
3.4
1.75
15.1
2.50
3.2
1.55
14.9
EUROPEAN
PROJECTION
Product specification
TDA1015
SOT110-1
A
2
E
c
Q
(1)
Z
q
q
w
1
2
max.
4.4
5.9
1.0
0.25
4.2
5.7
ISSUE DATE
92-11-17
95-02-25
Advertisement
Table of Contents
