Table Of Contents - Sony WALKMAN WM-SR10 Service Manual

WM-SR10

TABLE OF CONTENTS

1. SERVICE NOTE
............................................................... 3
2. GENERAL
.......................................................................... 4
3. DISASSEMBLY
3-1. Front Cabinet Assy .......................................................... 5
3-2. MAIN Board ................................................................... 6
3-3. Mechanism Deck (MT-WMGX221-175) ....................... 6
3-4. Belt (CAP), M601, HRP901, HE901 .............................. 7
3-5. Cassette Holder Sub Assy ............................................... 7
4. MECHANICAL ADJUSTMENT
5. ELECTRICAL ADJUSTMENT
6. DIAGRAMS
...................................................................... 10
6-1. Block Diagram - Tuner Section - ................................. 11
6-2. Block Diagram - Main Section - ................................. 12
6-3. Printed Wiring Boards .................................................. 13
6-4. Schematic Diagram - MAIN Board (1/2) - .................. 14
6-5. Schematic Diagram - MAIN Board (2/2) - .................. 15
6-6. IC Block Diagrams ....................................................... 16
7. EXPLODED VIEWS
7-1. Overall Section ............................................................. 17
7-2. Cabinet (Front) Section ................................................. 18
7-3. Mechanism Deck Section-1 (MT-WMGX221-175) ..... 19
7-4. Mechanism Deck Section-2 (MT-WMGX221-175) ..... 20
8. ELECTRICAL PARTS LIST
2
.................................. 8
.................................... 8
....................................... 21
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.