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DATA SHEET TDA8001 Smart card interface Product specification Supersedes data of 1995 Feb 01 File under Integrated Circuits, IC02 INTEGRATED CIRCUITS 1996 Dec 12...
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(5 V 5%, 100 mA max. with controlled rise and fall times) generation (12.5, 15 or 21 V 2.5%, 50 mA max., with controlled rise and fall times) (only at TDA8001 and TDA8001T) Clock generation (up to 10 MHz), with synchronous...
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V card supply voltage card supply current high voltage supply for card programming voltage (only at TDA8001 and TDA8001T) (P = 5, 12.5, 15 and 21 V) programming current (read or write mode) slew rate on V...
The CLKOUT2 pins may be used to clock a microcontroller or an other TDA8001. The signal available when the circuit is powered up. State diagram...
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Smart card interface EAD MODE When the activation sequence is completed and, after the card has replied its Answer-to-Reset, the TDA8001 will be in the READ mode. Data is exchanged between the card and the microcontroller via the I/O line.
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Philips Semiconductors Smart card interface handbook, full pagewidth CDMS CDMTC XTAL ENCLK 1996 Dec 12 ENCLK 1/2 CLKOUT Fig.5 Clock circuitry. Product specification TDA8001 CMD7 or CDMS = Z Z 1 1 0 0 CMD3.5 or CDMTC = 1 0 1 0 1 0...
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Philips Semiconductors Smart card interface handbook, full pagewidth PDOWN handbook, full pagewidth PRES DETECT CMDVCC VEILLE (INTERNAL) INTERNAL CLOCK V CC V PP CMD3.5 ENRST (INTERNAL) RSTIN 1996 Dec 12 ACTIVATION IDLE FAULT DEACTIVATION Fig.6 State diagram. t act Fig.7 Activation sequence.
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Philips Semiconductors Smart card interface handbook, full pagewidth CMDVCC VEILLE (INTERNAL) INTERNAL CLOCK V CC V PP CMD3.5 ENRST (INTERNAL) RSTIN handbook, full pagewidth PRES DETECT CMDVCC VEILLE (INTERNAL) INTERNAL CLOCK V CC V PP CMD3.5 ENRST (INTERNAL) RSTIN Fig.9 Deactivation after a card extraction during write mode.
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Philips Semiconductors Smart card interface LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL supply voltage voltage on pins VPP21, VPP15, VPP12.5, PRES, PRES, CMDVCC, OFF, ALARM, DETECT and RSTIN voltage on pin V voltage on pin V...
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Philips Semiconductors Smart card interface handbook, halfpage P tot Fig.10 Power derating curve (DIP28). HANDLING Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining. Method 3015 (HBM 1500 , 100 pF) 3 pulses positive and 3 pulse negative on each pin referenced to ground.
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Philips Semiconductors Smart card interface CHARACTERISTICS = 12 V; V = 25 V; V = 5 V; T SYMBOL PARAMETER Supply supply voltage supply current threshold voltage for power-on reset threshold voltage on V hysteresis on V hys4 Voltage supervisor...
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Philips Semiconductors Smart card interface SYMBOL PARAMETER HIGH level input current Reset output to the card (RST) output voltage in IDLE IDLE LOW level output voltage HIGH level output voltage delay between RSTIN and RST Clock output to the card (CLK)
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Philips Semiconductors Smart card interface SYMBOL PARAMETER Card supply voltage (V output voltage output current slew rate 5 V reference output voltage (CVNC) output voltage at pin CVNC CVNC output current at pin CVNC CVNC Crystal connection (XTAL) negative resistance at pin XTAL...
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Philips Semiconductors Smart card interface SYMBOL PARAMETER voltage on pin I/O outside a IDLE session impedance on pin I/O( C) IDLE outside a session internal pull-up resistance between pin I/O and V rise and fall times Protections shut-down local temperature...
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Philips Semiconductors Smart card interface INTERNAL PIN CONFIGURATION handbook, full pagewidth XTAL DETECT V CC V CC 10 k VPP12.5 VPP15 as VPP12.5 PRES as VPP12.5 PRES as VPP12.5 V PP GND1 V DD V CC as VPP12.5 1996 Dec 12...
Philips Semiconductors Smart card interface APPLICATION INFORMATION handbook, full pagewidth to 8805 micro- controller V DD 12 V 25 V 80C52 MICRO- CONTROLLER (1) The capacitor should be placed as close as possible to the IC. (2) If pin V...
Philips Semiconductors Smart card interface PACKAGE OUTLINES DIP28: plastic dual in-line package; 28 leads (600 mil) handbook, full pagewidth pin 1 index DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT max. min. max. 0.51 inches 0.20 0.020 0.16...
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Philips Semiconductors Smart card interface SO28: plastic small outline package; 28 leads; body width 7.5 mm pin 1 index DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT max. 0.30 2.45 2.65 0.25 0.10 2.25 0.012 0.096 inches 0.10...
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Philips Semiconductors Smart card interface SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities.
Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel.
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