Suitability Of Surface Mount Ic Packages For - Philips TDA9605H Datasheet

Philips Semiconductors
Audio processor with head amplifier for VHS hi-fi
17.5 Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable
(3)
PLCC , SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods" .
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Apr 14
WAVE
not suitable
(2)
suitable
(3)(4)
not recommended
(5)
not recommended
50
SOLDERING METHOD
suitable
suitable
suitable
suitable
suitable
Product specification
TDA9605H
(1)
REFLOW