How To Disassemble Heat Sink - Sony KD-65X8000C Service Manual

APPENDIX-4
How to disassembly Heat sink
<NOTE>
HEAT SINK are already attached to the B board for service.
If you need to disassemble HEAT SINK from B board,
Please cut HOLDER,HS WS(MUF) with tool (nippers) from B side of B board.
However, please it carefully because some damage may be given
to the neighborhood parts or the B board itself.
Do not reuse both HOLDER. Please replace to new parts.
Potting is necessary for re-assembly of HEAT SINK.
Please follow
KD-65X8000C(CH)
HOLDER, HS WS (MUF)
4-548-743-01
SBR "New Potting TIM Operation for board repair"
BMFW board
HEAT SINK (MUFF)
HEAT SINK (MUFF C)
HOLDER, (HS MUF)
4-549-188-01
for details.
nipper
98