MODIFICATION NOTICE. SERVICE MANUAL MODEL E1C E1K PMA-50 P P P INTEGRATED AMPLIFIER • For purposes of improvement, specifications and design are subject to change without notice. • Please use this service manual with referring to the operating instructions without fail.
CONTENTS ABOUT THIS MANUAL .............3 BLOCK DIAGRAM ..............43 What you can do with this manual ..........3 POWER DIAGRAM ..............44 Using Adobe Reader (Windows version) ........4 WIRING DIAGRAM ..............45 SAFETY PRECAUTIONS ............6 PRINTED CIRCUIT BOARDS ..........46 NOTE FOR SCHEMATIC DIAGRAM .........7 SCHEMATIC DIAGRAMS (1/11) ..........49 NOTE FOR PARTS LIST ............7 MAIN_ADSP ................49...
ABOUT THIS MANUAL Read the following information before using the service manual. What you can do with this manual Search for a Ref. No. (phrase) Jump to the target of a schematic diagram connector (Ctrl+Shift+F) You can use the search function in Acrobat Reader to search for a Ref.
SAFETY PRECAUTIONS The following items should be checked for continued protection of the customer and the service technician. leakage current check Beforereturningthesettothecustomer,besuretocarryouteither(1)aleakagecurrentcheckor(2)alinetochassis resistance check. If the leakage current exceeds 0.5 milliamps, or if the resistance from chassis to either side of the power cord is less than 460 kohms, the set is defective.
NOTE FOR SCHEMATIC DIAGRAM WARNING: Partsindicatedbythe z markhavecriticalcharacteristics.UseONLYreplacementpartsrecommendedbythemanufacturer. CAUTION: Beforereturningthesettothecustomer,besuretocarryouteither(1)aleakagecurrentcheckor(2)alinetochassisresistancecheck.If the leakage current exceeds 0.5 milliamps, or if the resistance from chassis to either side of the power cord is less than 460 kohms, the set is defective. WARNING: DONOTreturnthesettothecustomerunlesstheproblemisidentifiedandremedied. NOTICE: ALLRESISTANCEVALUESINOHM.k=1,000OHM/M=1,000,000OHM ALLCAPACITANCEVALUESAREEXPRESSEDINMICROFARAD,UNLESSOTHERWISEINDICATED.PINDICATESMICRO-MICRO...
When you update the firmware , you can use the following JIG (RS232C to internal connector conversion adapter without 7P FFC kit ). Please order it from Denon Official Service Distributor in your region if necessary. 8U-210100S (SPK-581) : WRITING KIT (without FFC) 606050028012P : 7P FFC(1.0)L=240...
DISASSEMBLY • Remove each part in the order of the arrows below. • Reassemble removed parts in the reverse order. • Read "Precautions During Work" before reassembling removed parts. • If wire bundles are removed or moved during adjustment or part replacement, reshape the wires after completing the work.
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Explanatory Photos for“ DISASSEMBLY” • The angles from which the photos are taken are shown by “Photo angle: A, B, C, D“ . • See the diagram below about the shooting direction of each photograph. • Photographs with no shooting direction indicated were taken from the top of the set. •...
1. MAIN ASSY TOP COVER → Proceeding : MAINT PCB, GUIDE F PCB, AMP PCB, SMPS PCB 1.1. MAIN PCB (1) Remove the screws. Shooting direction: B (Rear side) (2) Slide to the back side of top panel and remove to lift from the bottom. bottom Shooting direction: E (Right side)
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1.2. GUIDE PCB AMP PCB (1) Remove the screws. Remove the GIDE PCB. Shooting direction: B (Rear side) (2) Remove the screws. (3) Remove the screws. Remove the GUIDE INLET BOARD and COVER. Remove the AMP PCB. AMP PCB Rear side CN9030 Front side Loose...
1.3. SMPS PCB (1) Remove the screws and connector wire. Remove the SMPS PCB. Rear side CN801 Front side View from the top 2. FRONT ASSY TOP COVER → Proceeding : WINDOW → FRONT PANEL (1) Put the driver in the position of arrow. Remove the window panel. Caution: Wrap protective tape, etc.
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(2) Remove the screws. (3) Remove the screw of earth lag wire. Remove the FRONT PANEL ASSY. Shooting direction: B (Rear side) 3. NFC PCB TOP COVER → Proceeding : MAIN, SMPS PCB → FRONT ASSY → NFC PCB (1) Remove the screws. Remove the guide of PCB and remove the NFC PCB. Left side Rear panel Shooting direction: E...
4. SIDE COVER TOP COVER → MAIN, AMP, SMPS PCB → FRONT ASSY Proceeding : → SIDE COVER (1) Remove the screws. (Left Side) Shooting direction: E (Right side) (2) Remove the screws. (Right Side) Shooting direction: F (Left side) (3) Slide the side panel and pull up from the bracket.
5. BOTTOM COVER TOP COVER → MAIN, AMP, SMPS PCB → FRONT ASSY Proceeding : → SIDE COVER → BOTTOM COVER (1) Remov the screws. Remove the BOTTOM PANEL. Rear side Front side View from the top...
SPECIAL MODE Special mode setting button No.1 - 3 :When the power is in standby mode, hold down buttons A and B and press the power button to turn on the power. No.4 : Hold down button A and connect the power cord to an outlet. No.5 : When the power is in standby mode, hold down button A and connect the power cord to an outlet.
1. Version Check mode 1.1. Operation ・Hold down buttons "SOURCE" and "Bluetooth" and press the power button to turn on the power. ・ Mode, Mode and Mode changes each time the button "Source" is Version Display Display / LED check Protection History pressed.
3. Protection Check mode 3.1. Operation ・Hold down buttons "SOURCE" and "Bluetooth" and press the power button to turn on the power. ・Press the "SOURCE" button twice. ・ Mode, Mode and Mode changes each time the button "Source" is Version Display Display / LED check Protection History pressed.
5. Owner’s Manual described initialization mode (User Reset) 5.1. Operation Hold down buttons "POWER" and "SOURCE" while the power is standby. 5.2. The contents of the display " INITIALIZE " is displayed for 3 seconds...
JIG FOR SERVICING The following jigs (extension cable kit) are used when repairing the PCBs. Order the jigs from your dealer if necessary. CAUTION : Incorrect connections may cause malfunction. Connection of Jig for PCB Items to Be Prepared 8U-110084S EXTENSION UNIT KIT 1 Set Insulation sheet (Not supplied)
PROCEDURE AFTER REPLACING THE MICROPROCESSOR, ETC The procedure after replacing the u-COM (Microprocessor), flash ROM, etc. is as follows. After PWB Name Ref. No. Description Remark replaced MAIN IC214 STM32F103ZG SOFTWARE: SYSTEM MAIN IC206 EPCQ16SI8N s SOFTWARE: FPGA MAIN IC102 MX25L4006EM2I SOFTWARE: DSP After replacing...
FIRMWARE UPDATE PROCEDURE 1. Procedure for upgrading IC214 1.1. Items to Be Prepared (1) Personal Computer (Be installed "Flash_Loader_Demonstrator_v2.6.0_Setup.exe"). (2) RS-232C cable (9P (Male), Straight). (3) 8U-210100S Writing Kit(SPK-581 WRITING KIT). 7P FFC(Straight). 1.2. Connecting the WRITING KIT to This Unit (1) Disconnect the AC plug of this unit to turn the power off.
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1.3. Installe Flash_Loader_Demonstrator_v2.6.0 (1) Run the "Flash_Loader_Demonstrator_v2.6.0_Setup.exe" Click "Yes" (2) Click "Next >" (3) Click "Yes"...
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(4) Enter the user name, company name, and Click "Next". (5) Click "Next>" (6) Click "Finish"...
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1.4. Run the Flash Loader Demonstrator Run the "STMicroelectronics flash loader.exe" on desktop of PC. (1) Click the "Flash Loader Demo" (2) Select the RS-232C serial port number on your computer. Connecting the power cord plug to an outlet. Click "Next Port Name : Set according to the PC.
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(5) Checked "Download to device" and click button of "Download from file". Select the specified update file and click the "Open" button. (6) Click "Next" (7) Downloading and writing the file.
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(8) Will display the following, the update is completed. Click "Close". (9) Disconnect the AC plug of this unit to turn the power off. Remove the 7P FFC form the unit. (10) After updating the firmware, check the version. (See 21 page...
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2. Procedure for upgrading IC102 2.1. Items to Be Prepared (1) Personal Computer (Be installed "ItfUsbDsd-HidWriter.exe"). (2) USB cable (A type-B type). 2.2. Updating procedure (1) Connecting the USB cable to the unit. (2) Press the "Power operation" button to turn on the power. (3) Switch to USB-DAC.
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Succeeded (7)Turn off the unit, and disconnect the power cord from an outlet. (8)After updating the firmware, check the version. (See 21page...
TROUBLE SHOOTING 1. OLED dosen't light Check Power Supply Voltages for SMPS. Check the following voltages when the unit is connected to the AC power supply. SMPS PCB Replace the SMPS PCB. [CN222] : 3 or 4 pin +5V [CN222] : 1pin +19V If these voltages are not output, a fault may have occurred in the SMPS PCB.
2. No Sound, Noise generated 2.1. COMMON(signal) Check Digital Audio Data output from DIR. MAIN PCB Check the soldering or replace each device. [IC204] : 17, 18, 19, 20pin [IC204] : 17, 18, 19, 20pin on MAIN PCB. DIR_LRCK, DIR_BCK, DIR_DATA, DIR_MCK Check Digital Audio Data input for PWM Modulator.
2.2. COMMON(Power, Control signal line) Check Power Supply Voltages for DIR. MAIN PCB Check the soldering or replace each device. [IC204] : 46pin +5V MAIN PCB [IC204] : 22,36,42pin +3.3V [IC300] : IN : +5V / OUT : +3.3V_D1 OK ? Check Power Supply Voltages for PWM Modulator AMP PCB.
Check control signal for DIR. Check Soldering or replace each device. MAIN PCB [IC214] : 3, 4, 2, 140pin → [IC204] : 23, 24, 25, 26pin [IC204] : 23,24,25,26pin DIR_DO, DIR_DI, DIR_CL, DIR_CE DIR_DO, DIR_DI, DIR_CL, DIR_CE Check control signal for PWM Modulator. Check Soldering or replace each device.
2.4. USB In Check Power Supply Voltages for USB IC. Check the soldering, replace each device or MAIN PCB. MAIN PCB [IC304] : IN:+3.3V / OUT:+1.2V [IC110] : +1.2V [IC303] : IN:+3.3V / OUT:+1.8V [IC141] : +1.8V [Q310] : IN:+3.3V / OUT:+3.3V [IC162] : +3.3V Check Digital Audio Data from USB.
MEASURING METHOD AND WAVEFORMS It is the better way to use an extension wire between the test point and the probe. MAIN PCB test points JACK101 L101 BKT1 L102 C184 C182 JK800 R102 JK801 R133 R868 C855 R869 C856 TP1614 R140 R134 R139...
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WAVEFORMS fig.1 OLED SYS-com communication waveform fig.2 IC305 SYS-ucom communication waveform (Poewer ON) FPC303 OLED_DC t IC306-5pin FPC303 OLED_CS EEPROM_SCL FPC303 OLED_SCLK y IC306-6pin EEPROM_SDA FPC303 OLED_SDIN fig.3 IC903 CSRA6601communication waveform fig.4 USBB I2S signal waveform ⑨ CP301-18pin ⑪ R148 USBB_LRCK CSR_SP1_DO ⑩...
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fig.7 DIR SYS-ucom communication waveform W0 I C214-140pin DIR_CE W1 R 362 DIR_CL W2 R 364 DIR_DI W3 R 363 DIR_DO...
BLOCK DIAGRAM POWER CONTROL MXS4046 128*100 DOT OLED SMPS P_DOWN RESET Aceleration Sensor SYS U-COM VBUS det NFC anatenna H/P det TACT SW (Standby, SW det Input, BT) NFC IC (Protection) BT anatenna On board or External GPIO/Interrupt X-TAL BT SPDIF BLUETOOTH OPT1 MODULE...
+3V3A Power R937 3K32-B-1608 CH3_REF0 R935 3K32-B-1608 CH3_REF1 R936 53K6-B-1608 CH3_REF2 PMA-50 D AMP - Feedback Processor Part SCHEMATIC DIAGRAMS (2/2) SCHEMATIC DIAGRAMS (9/11) GND LINE POWER+ LINE POWER- LINE STBY POWER SPDIF Analog Audio L Analog Audio R Audio SW...
Please refer to the last chapter for the part list. * Note for replacing parts 1. Place the tape on the cover so that the DENON logo is centered. 2. Trace the text on the tape with a pen tip to stick it onto the panel.
PACKING VIEW Please see the last chapter for the part list. ONLY JP,E1C LABEL SERIAL(ONLY E1C) (WITH LABEL CONTROL) * ATTACH THE LABEL RATING ABOVE COVER REAR LABEL SERIAL(E2,JP,E3) (WITH LABEL CONTROL) * ATTACH THE BACK-CH LABEL SHIPPING(ONLY E1C) (WITH LABEL CONTROL) 24(E3) 13 X4 UK plug...
SEMICONDUCTORS Only major semiconductors are shown, general semiconductors etc. are omitted to list. The semiconductor which described a detailed drawing in a schematic diagram are omitted to list. 1. IC's Pinouts and pin descriptions STM32F103xF, STM32F103xG STM32F103ZG(IC214) Figure 4. STM32F103xF and STM32F103xG XL-density performance line LQFP144 pinout DD_2 SS_2 PA13...
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Port Assignment Port Name PD/PU I/O STBY CONTENTS DIR_RST DIR RESET DIR_CL DIR CLOCK DIR_DO DIR DATA IN DIR_DI DIR DATA OUT REMOCON IN VBAT BATTERY BACKUP ( NOT USED ) PC13-TAMPER-RTC PC14-OSC32_IN PC15-OSC32_OUT 10 PF0 CSR_BRIDGE CSRA6001 THERMAL INT CSR_RESET CSRA6001 RESET 12 PF2...
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Port Name PD/PU I/O STBY CONTENTS VSS1 VDD1 PB12 OLED_CS O/L OLED DATA SELECTION PB13 OLED_SCLK O/L OLED CLOCK PB14 OLED_DC O/L OLED DATA / COMMAND CONTROL OLED_SDIN O/L OLED DATA PB15 OLED_RES O/L OLED Reset CTRL_OLED O/L OLED LIGHT 17V CONTROL PD10 CTRL_1.2DSP O/L 1.2V power control of USB-B(TMS320C6748BZWT3)
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Port Name PD/PU I/O STBY CONTENTS 136 PB6 O/L - 137 PB7 AUX_SEL O/L "AUX_SEL * H : AUX func. / L : Other func." 138 BOOT0 BOOT 0 BOOT OPTION 139 PB8 CLK_SEL2 O/L "CLK_SEL2 * H : Digital func. / L : Analog & USB-DAC func." 140 PB9 DIR_CE O/L DIR_SELECT...
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EP4CE15F17C8N (IC205) EP4CE15F17C8N Terminal Function Pin No. Location Pin No. Location Dir. Pin Name Dir. Pin Name POWER 3.3V OPEN GND* INPUT FS_STS_A0 OPEN GND* INPUT FS_STS_A1 OPEN GND* bidir FS_STS_B1 INPUT FPGA_VER_CONT bidir FS_STS_B0 INPUT nCE_nCSO OPEN GND* OPEN GND* OPEN GND*...
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Pin No. Location Dir. Pin Name Pin No. Location Dir. Pin Name POWER 1.2V POWER 3.3V POWER 2.5V INPUT TEST9_IO OPEN GND* INPUT TEST8_IO OUTPUT TEST14_O OPEN GND* OUTPUT TEST12_O OPEN GND* OUTPUT TEST11_O OPEN GND* INPUT USBB_DSD_PCM OPEN GND* INPUT USB-B_MUTE POWER...
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Pin No. Location Dir. Pin Name Pin No. Location Dir. Pin Name INPUT GND* POWER 3.3V OUTPUT PCM_DATA OPEN GND* OPEN GND* OPEN GND* OUTPUT PCM_BCK OUTPUT DAC_WCK_OUT/DSD_ OPEN GND* OPEN GND* OPEN GND* OUTPUT SPDIF_MCK_O OPEN GND* OPEN GND+ OPEN GND+ OPEN...
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ADSP21477KCPZ-1A (IC805) ADSP-21477/ADSP-21478/ADSP-21479 OUTLINE DIMENSIONS The processors are available in 88-lead LFCSP_VQ, 100-lead LQFP_EP and 196-ball CSP_BGA RoHS compliant packages. For package assignment by model, see Ordering Guide on Page 12.10 0.30 12.00 SQ 0.60 MAX 0.23 11.90 0.60 0.18 PIN 1 INDICATOR PIN 1...
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Name Function Description CH0_REF2 Output, tristate Channel 0 reference 2 output CH0_REF1 Output, tristate Channel 0 reference 1 output C0GND Ground C0P3V3 3.3 V I/O supply (quiet) CH0_REF0 Output, tristate Channel 0 reference 0 output C0P1V8 1.8 V core supply (quiet) P1V8 1.8 V core supply Ground...
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Name Function Description GPIO_5 Bidirectional, pull-down GPIO TEST Input, pull-down Test mode, tie to ground SPI_CK Input, pull-down SPI control input clock SPI_CS Input, pull-down SPI control input chip select SPI_DATA Bidirectional, pull-down SPI control data input/output P1V8 1.8 V core supply Ground P3V3 3.3 V I/O supply...
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Name Function Description C67GND Ground C67P3V3 3.3 V I/O supply (quiet) CH6_FB1 Bidirectional, pull-up Channel 6 high resolution feedback input or channel 6/7 I²S output bit clock CH6_FB0 Bidirectional, pull-up Channel 6 low resolution feedback input CH6_REF2 Output, tristate Channel 6 reference 2 output CH6_REF1 Output, tristate Channel 6 reference 1 output...
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Name Function Description C3GND Ground CH3_REF1 Output, tristate Channel 3 reference 1 output CH3_REF2 Output, tristate Channel 3 reference 2 output CH3_FB0 Bidirectional, pull-up Channel 3 low resolution feedback input or channel 2/3 I²S output word clock CH3_FB1 Bidirectional, pull-up Channel 3 high resolution feedback input or channel 2/3 I²S output data C23P1V8...
Pin Description Pin Name Description Pad Type PIO_11 Programmable input/output line Bi-directional PIO_12 Programmable input/output line Bi-directional PIO_13 Programmable input/output line Bi-directional PIO_14 Programmable input/output line Bi-directional USB Data Plus with selectable internal 1.5KΩ USB_DP Bi-directional Pull-up resistor USB_DN USB Data minus Bi-directional VDD_USB POWER FOR USB(3.3V)
2. DISPLAY MXS4046 Display Side S020-MXS4046A-1 1Pin 19Pin 15. IO インターフェイス IO Interfaces MXS4046 IO Interfaces 端子番号 端子名 入出力 機能 Pin No. Functions Pin Name 陽極基準電位 Anode Reference Voltage グランド ドライバ系VCC電源 Drive System Power 陰極電源 VCOMH Power Supply for Cathode Driver 内部ロジック系電源...
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MAIN MAIN PCB ASS'Y ※Parts indicated by "nsp"on this table cannot be supplied. ※The parts listed below are only for maintenance. Therefore they might differ from the parts used in the unit in appearances or dimensions. NOTE:The symbols in the column Remarks indicate the following destinations. E3 : U.S.A.
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MAIN REF No. Part No. Part Name Remarks Q'ty New R328 R,CHIP THICK 0-J,1/16W-1005REEL C20000006M100S R330 R,CHIP THICK 100K-J,1/16W-1005REEL C20001046M100S R331 R,CHIP THICK 100-J,1/16W-1005REEL C20001016M100S R332 R,CHIP THICK 10K-J,1/16W-1005REEL C20001036M110S R333,334 R,CHIP THICK 33-J,1/16W-1005REEL C20003306M100S R335,336 R,CHIP THICK 0-J,1/16W-1005REEL C20000006M100S R337,338 R,CHIP THICK 33-J,1/16W-1005REEL C20003306M100S...
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MAIN REF No. Part No. Part Name Remarks Q'ty New C138 C,CERAMIC CHIP HIK X7R)0.01UF-K/50V-1005REEL D011103777101S C141 00D9630325004 C,ELECT CHIP(GE) 100UF-MVG/6.3V,5.3*5.9*5.3 3REEL (Z8156) SY D050101081650S C142-157 C,CERAMIC CHIP HIK X7R)0.1UF-K/16V-1005REEL D011104177101S C162 00D9630325004 C,ELECT CHIP(GE) 100UF-MVG/6.3V,5.3*5.9*5.3 3REEL (Z8156) SY D050101081650S C163-184 C,CERAMIC CHIP HIK X7R)0.1UF-K/16V-1005REEL D011104177101S...
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MAIN REF No. Part No. Part Name Remarks Q'ty New L302 963115100320S COIL,BEAD CBW201209U221T 220ohm SMD2012 TYPE D340201202210S L304-306 963115100320S COIL,BEAD CBW201209U221T 220ohm SMD2012 TYPE D340201202210S L308 963115100320S COIL,BEAD CBW201209U221T 220ohm SMD2012 TYPE D340201202210S L310-315 963115100320S COIL,BEAD CBW201209U221T 220ohm SMD2012 TYPE D340201202210S L316 R,CHIP THICK 0-J,1/10W-2012REEL...
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AMP PCB ASS'Y ※Parts indicated by "nsp"on this table cannot be supplied. ※The parts listed below are only for maintenance. Therefore they might differ from the parts used in the unit in appearances or dimensions. NOTE:The symbols in the column Remarks indicate the following destinations. E3 : U.S.A.
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REF No. Part No. Part Name Remarks Q'ty New R9027 R,CHIP THICK 15-F,1/10W-1608REEL C200015040160S R9028 R,METAL FILM 25PPM 33-F,1/5W-2012REEL MMU01020D3309FB300 VISHAY C06203304P203S R9029 R,CHIP THICK 3.32K-B,1/10W-1608REEL C2003321B0160S R9030,9031 R,METAL FILM 25PPM 12-F,1/5W-2012REEL MMU01020D1209FB300 VISHAY C06201204P203S R9032 R,METAL FILM 25PPM 1.5K-F,1/5W-2012REEL MMU01020D1501FB300 VISHAY C06201524P203S R9033 R,METAL FILM 25PPM 3.3K-F,1/5W-2012REEL MMU01020D3301FB300 VISHAY...
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REF No. Part No. Part Name Remarks Q'ty New R985 R,CHIP THICK 47K-J,1/16W-1608REEL C20004736M160S R986 R,CHIP THICK 33K-J,1/16W-1608REEL C20003336M160S R987 R,CHIP THICK 100K-J,1/16W-1608REEL C20001046M160S CAPACIITORS GROUP C1000 C,CERAMIC CHIP T.C COG120PF-J/50V-1608REEL D010121167160S C1001,1002 C,CERAMIC CHIP HIK X5R)4.7UF-K/25V-2012REEL GRM21BR61E475KA12L MURATA D011475774200S C1003-1006 C,CERAMIC CHIP HIK X7R)0.1UF-K/50V-1608REEL D011104577160S...
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REF No. Part No. Part Name Remarks Q'ty New C908 C,CERAMIC CHIP T.C C0G)0.01UF-J/50V-1608REEL GRM1885C1H103JA01D D010103167163S C9080 963134000450S C,ELECT CHIP(GE) 100UF-MVG/16V,6.6*7.2*5.7 REEL (Z8157) SY D050101083660S C9081 C,CERAMIC CHIP HIK X7R)0.1UF-K/50V-1608REEL D011104577160S C9082 C,CERAMIC CHIP HIK X5R)4.7UF-K/25V-2012REEL GRM21BR61E475KA12L MURATA D011475774200S C909,910 C,CERAMIC CHIP T.C COG12PF-J/50V-1608REEL D010120167160S C911...
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EXPLODED EXPLODED ※Parts indicated by "nsp"on this table cannot be supplied. ※The parts listed below are only for maintenance. Therefore they might differ from the parts used in the unit in appearances or dimensions. NOTE:The symbols in the column Remarks indicate the following destinations. E3 : U.S.A.
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PACKING PACKING ※Parts indicated by "nsp"on this table cannot be supplied. ※The parts listed below are only for maintenance. Therefore they might differ from the parts used in the unit in appearances or dimensions. NOTE:The symbols in the column Remarks indicate the following destinations. E3 : U.S.A.
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