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LG KE770 Service Manual

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Service Manual
KE770
Date: April, 2007 / Issue 1.0

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  • Page 1 Service Manual KE770 Date: April, 2007 / Issue 1.0...
  • Page 2 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the KE770 . - 3 -...
  • Page 3 - 4 -...

  • Page 4: Table Of Contents

    2.2 Technical specification......12 5.7 Microphone trouble ........80 5.8 Vibrator trouble ........82 3. TECHNICAL BRIEF ......19 5.9 Keypad back light trouble.......84 3.1 KE770 Component Block diagram..20 5.10 SIM card trouble........85 3.2 Baseband Processor (BBP) 5.11 MicroSD trouble ........87 Introduction ..........21 5.12 RF PART TROUBLESHOOTING ..89 3.3.
  • Page 5 - 6 -...

  • Page 6: Introduction

    A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the KE770 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
  • Page 7 1. INTRODUCTION E. Notice of Radiated Emissions The KE770 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

  • Page 8: Abbreviation

    1. INTRODUCTION 1.3 ABBREVIATION For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current - Constant Voltage Cigar Lighter Adapter Digital to Analog Converter Digital Communication System abbreviation for the power ratio in dB of the measured power referenced to one milliwatt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory...
  • Page 9 1. INTRODUCTION Light Emitting Diode LG Electronics OPLL Offset Phase Locked Loop Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock...

  • Page 10: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Standard Battery Li-Ion, 800mAh AVG TCVR Current 270mA @PL5 Standby Current 2.3mA @PP9 Talk time 3hours (GSM TX Level 7) Standby time 300 hours (Paging Period:5, RSSI: -85dBm) Charging time 2.5 hours RX Sensitivity GSM900 : -105dBm, DCS/PCS : -105dBm...

  • Page 11: Technical Specification

    2. PERFORMANCE 2.2 Technical specification Item Description Specification GSM900 TX: 890 + 0.2 x n MHz RX: 935 + 0.2 x n MHz ( n = 1 ~ 124) EGSM TX: 890 + 0.2 x (n-1024) MHz Frequency Band RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 ) DCS1800 TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885) RX: TX + 95 MHz...
  • Page 12 2. PERFORMANCE Item Description Specification GSM900/EGSM Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 Output RF Spectrum 6,000 DCS1800/PCS1900 (due to modulation) Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000...
  • Page 13 2. PERFORMANCE Item Description Specification DCS1800/PCS1900 Offset from Carrier (kHz). Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status GSM850 BER (Class II) < 2.439% @-102dBm Bit Error Ratio DCS1800/PCS1900 BER (Class II) < 2.439% @-100dBm Rx Level Report accuracy 3 dB 8 3 dB...
  • Page 14 2. PERFORMANCE Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side Tone Distortion Three stage distortion < 10% <Change> System frequency 2.5ppm (26 MHz) tolerance <Change>32.768KHz tolerance...
  • Page 15 2. PERFORMANCE Item Description Specification Battery Bar Number Voltage( 0.05V) 3.86V~4.2V Battery Indicator 3.75V~3.85V 3.75V~3.69V 3.69V~3.62V 3.62V~ 3.58V↓ 0.05V (Call) Low Voltage Warning 3.50V↓ 0.05V (Standby) Forced shut down Voltage 0.05 V Li-ion Battery Standard Voltage = 3.7 V Battery Type Battery full charge voltage = 4.2 V Capacity: 800mAh Switching-mode charger...
  • Page 16 2. PERFORMANCE * EDGE RF Specification (Option: KG99 is not serviced for ”EDGE mode”) Item Description Specification RMS EVM Peak EVM Percentile EVM ≥ Origin Offset Suppression 30dB EGSM Level Power Toler. Level Power Toler. 27dBm 17dBm 27dBm 15dBm 27dBm 13dBm 27dBm 11dBm...
  • Page 17 2. PERFORMANCE Item Description Specification Output RF Spectrum DCS1800, PCS1900 (due to modulation) Offset from carrier(kHz) Max. dBc +0.5 600~<1,200 1,200~<1,800 1,800~<3,000 3,000~<6,000 6,000 EGSM Output RF Spectrum (due to switching transient) Offset from carrier(kHz) Max. dBm 1,200 1,800 --30 DCS1800, PCS1900 Offset from carrier(kHz) Max.

  • Page 18: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF Baseband circuit 3.1 KE770 Component Block diagram. Figure 1 KE770 Functional block diagram - 19 -...

  • Page 19: Ke770 Component Block Diagram

    3. TECHNICAL BRIEF 3.2 Baseband Processor (BBP) Introduction Figure 2. Top level block diagram of the S-GOLD2 (PMB8876) 3.2.1 General Description S-GOLD2 is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital functionality of a cellular radio. Additionally S-GOLD2 Provides multimedia extensions such as camera, software MIDI, MP3 sound.

  • Page 20: Block Description

    3. TECHNICAL BRIEF 3.2.2 Block Description • Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration. - TEAKLite DSP core • ARM-Memory - 32k Byte Boot ROM on the AHB - 96k Byte SRAM on the AHB, flexibly usable as program or data RAM - 16k Byte Cache for Program (internal) - 8k Byte tightly coupled memory for Program(internal)
  • Page 21 3. TECHNICAL BRIEF - Advanced static and dynamic power management features including TDMA-Frame synchronous low power mode and enhanced CPU modes(idle and sleep modes) - Pulse Number Modulation output for Automatic Frequency Correction(AFC) - Serial RF Control interface: support of direct conversion RF - A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission - 1 Serial Synchronous SPI compatible interfaces in the controller domain...
  • Page 22 3. TECHNICAL BRIEF 3.2.5. USART Interface KE770 have two UART Drivers as follow : - USART1 : Hardware Flow Control / SW upgrade / Calibration - USART2 : SW debug trace. Table 3 USART Interface Spec. USART_0(USART1) Resource Name Remark...
  • Page 23 3. TECHNICAL BRIEF 3.2.7. GPIO map Over a hundred allowable resources, KE770is using as follows except dedicated to SIM and Memory. KE770GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table. Table 5 S-Gold2 GPIO pin Map Port function ME820 Net Name Description...
  • Page 24 3. TECHNICAL BRIEF MEMORY &CLK GPIO_20 F_DPD For INTEL Memory CLK32K CLK32K For FM Radio & BLUETOOTH GPIO_22 Not Use CAMERA I/F CIF_D0 CIF_D(0) Camera DATA[0] CIF_D1 CIF_D(1) Camera DATA[1] CIF_D2 CIF_D(2) Camera DATA[2] CIF_D3 CIF_D(3) Camera DATA[3] CIF_D4 CIF_D(4) Camera DATA[4] CIF_D5 CIF_D(5)
  • Page 25 3. TECHNICAL BRIEF GPIO_99 GPIO_100 TFLASH_EN TransFlash card power enable(active High) DIF_RESET1_GPIO DIF_RESET1 LCD Reset EINT6 REMOTE_INT For Remote Control Headset I2C_SCL For SM-Power, FM Radio, Audio AMP I2C_SDA " PM_INT (EINT) PM_INT SM-Power interrupt SIM CARD CC_IO SIM_IO SIM CARD I/O CC_CLK SIM_CLK SIM CARD CLOCK...
  • Page 26 3. TECHNICAL BRIEF I2S1_RX I2S1_RX For Bluetooth I2S1_TX I2S1_TX " I2S1_WA0 I2S1_WA0 " MMCI_DAT[1] TF_DAT1 For T-Flash MMCI_DAT[2] TF_DAT2 " MMCI_DAT[3] TF_DAT3 " AUDIO I/F EPN1 RCV_N For Receiver EPP1 RCV_P " EPPA1 BBP_SND_L For Speaker EPPA2 BBP_SND_R For Speaker MICN1 MIC1_N For Mic...
  • Page 27 3. TECHNICAL BRIEF TRIG_IN TRIG_IN " MON1 MON1 " MON2 MON2 " TRACESYNC TRACESYNC " TRACECLK TRACECLK " PIPESTAT[2] PIPESTAT[2] " PIPESTAT[1] PIPESTAT[1] " PIPESTAT[0] PIPESTAT[0] " TRACEPKT[0] TRACEPKT[0] " TRACEPKT[1] TRACEPKT[1] " TRACEPKT[2] TRACEPKT[2] " TRACEPKT[3] TRACEPKT[3] " TRACEPKT[4] TRACEPKT[4] "...
  • Page 28 3. TECHNICAL BRIEF EBU_RD_n Read strobe EBU_BC0_n _BC0 EBU_BC1_n _BC1 EBU_A[0] A(0) Address bus[0] EBU_A[1] A(1) Address bus[1] EBU_A[2] A(2) Address bus[2] EBU_A[3] A(3) Address bus[3] EBU_A[4] A(4) Address bus[4] EBU_A[5] A(5) Address bus[5] EBU_A[6] A(6) Address bus[6] EBU_A[7] A(7) Address bus[7] EBU_A[8] A(8)
  • Page 29 3. TECHNICAL BRIEF EBU_WAIT_n _WAIT EBU_SDCLKO SDCLKO EBU_SDCLKI SDCLKI EBU_BFCLKO BFCLKO EBU_BFCLKI BFCLKI EBU_CKE SSC1_SCLK F_DPD T_OUT0 TXON_PA RF Power amp turn on GPIO_44 VIBRATOR_EN Vibrator enable(High: enable, Low:disable) T_OUT2 PA_BAND RF band select T_OUT3 ANT_SW1 RF FEM control signal 1 T_OUT4 ANT_SW2 RF FEM control signal 2...
  • Page 30 3. TECHNICAL BRIEF F32K Sleep crystal 32.768KHz OSC32K Sleep crystal 32.768KHz RESET_n _RESET Baseband processor reset CC1CC1IO TRIG_OUT For JTAG & ETM Interface Wake up signal to alarm (High; RTC_OUT RTC_OUT wake up, Low: Power off) VCXO_EN VCXO_EN 26MHz clock enable DSPIN0 _BT_RESET Bluetooth chip reset...

  • Page 31: Power Management Ic

    3. TECHNICAL BRIEF 3.3. Power management IC 3.3.1. General Description SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has been specially designed for usage with S-Gold2. Although optimized for usage with the Infineon S- GOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as well.
  • Page 32 3. TECHNICAL BRIEF Figure 3 Top level block diagram of the SM-Power(PMB6812) SM-POWER is a further step on the successful E-Power product line with enhanced and optimized functionality. SM-POWER features a baseband supply concept with a DC/DC step-down converter (SDBB) cascaded by two linear regulators (LBB1/2) - SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone functions (e.g.
  • Page 33 3. TECHNICAL BRIEF SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the linear regulator LBB1 for the DSP during mobile standby whenever this subsystem is not used. In this phase the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up with power being supplied by the other linear regulator LBB2.
  • Page 34 3. TECHNICAL BRIEF Table 6 LDO Output Table of SM-Power Net name Output Voltage Output Current Usage SDBB 1V8_MEM 1.8V 850mA Memory & for LDO LRFC 1V5_RF 1.5V 120mA RF transceiver LBB1 1V5_DSP 1.5V 170mA DSP in BBP LBB2 1V5_CORE 1.5V 300mA ARM core in BBP...
  • Page 35 3. TECHNICAL BRIEF 3.3.2. Charging The ISL6299 is a fully integrated low-cost single-cell Li-ion or Li-polymer battery charger. The charger accepts two power inputs, normally one from a USB (Universal Serial Bus) port and the other from a desktop cradle. The ISL6299 is an ideal charger for smart handheld devices that need to communicate with a personal computer via USB.
  • Page 36 3. TECHNICAL BRIEF 1. Charging method : CC-CV 2. Charger detect voltage : 4.0V 3. Charging time : 3h 4. Charging current : 500mA 5. CV voltage : 4.2V 6. Cutoff current : 100mA 7. Full charge indication current (icon stop current) : 100mA 8.

  • Page 37: Power On/Off

    3. TECHNICAL BRIEF 3.4. Power ON/OFF KE770Power State : Defined 3cases as follow ] Power-ON : Power key detect ( SM-Power’s ON port ] Power-ON-charging : Charger detect. ] Power-ON-remote : remote power on detect (Factory use only) Figure 7 Power on application. Input ON is a power-on input for SM-POWER with 2 active high levels (see Figure 8).

  • Page 38: Sim Interface

    Figure8 Remote power on and End-key power on circuit 3.5. SIM interface KE770 supports 3V plug in SIM, SIM interface scheme is shown in (Figure 9). SIM_IO, SIM_CLK, SIM_RST ports are used to communicate with BBP(S-Gold2) and the SIM power supply enabled by BBP (_SIM_EN).

  • Page 39: Memory

    3. TECHNICAL BRIEF 3.6. Memory 1Gbit Flash & 256Mbit SDRAM employed on KE770with 16 bit parallel data bus thru ADD(0) ~ ADD(24). The 256Mbit Capulet Wireless Flash memory with LPSDRAM stacked device family offers multiple high-performance solutions. The Capulet flash die is manufactured on 90 nm process technology.

  • Page 40: Lcd Display

    3. TECHNICAL BRIEF 3.7. LCD Display LCD module include: - LCD : 176 x 220 262K Colors TFT LCD - Backlight : 3 piece of white LED illumination Pin No. Pin Name Description LCD power supply 2V72_IO LCD power supply 2V72_IO GROUND White LED common Anode...

  • Page 41: Keypad Switching & Scanning

    3. TECHNICAL BRIEF 3.8. Keypad Switching & Scanning The keypad interface is a peripheral which can be used for scanning keypads up to 8 rows (outputs from Port Control Logic) and 8 columns (inputs to PCL). The number of rows and columns depend on settings of the PCL.

  • Page 42: Keypad Back-Light Illumination

    3. TECHNICAL BRIEF 3.9. Keypad back-light illumination VBAT LD504 U502 SSC-SWTS1007 R534 LGF_EN STBY LD503 SSC-SWTS1007 BGND VOUT R533 R530 BH33FB1WHFV 100K C530 C531 C542 C543 Figure 12 Keypad Back-light LEDs 3.10. LCD back light illumination Employed the AAT2807 is a dual charge pump designed to support both the white LED backlight and flash applications for systems operating with lithium-ion/polymer batteries.
  • Page 43 3. TECHNICAL BRIEF The interface relies on the number of rising edges of the EN/SET pin to address and load the registers. S2Cwire latches data or address after the EN/SET pin has been held high for time TLAT. The interface records rising edges of the EN/SET pin and decodes them into 16 different states, as indicated in table Figure 14 EN/SET port control method Table 8.

  • Page 44: Battery Current Consumption Monitor

    3. TECHNICAL BRIEF 3.11 Battery current consumption monitor KE770use a current monitoring function to calculate the battery capacity and the remaining time, as monitoring current flow from the battery thru 47mohm resistor. BATTERY CURRENT MONITOR VSUPPLY VBAT U201 CN201 R204 47mohm LOAD (47 milli Ohm)

  • Page 45: Audio

    3. TECHNICAL BRIEF 3.13. Audio KE770Audio signal flow diagram as following diagram. Figure 17 Audio signal flow diagram 3.13.1. Audio amplifier sub system IC Audio amplifier sub system IC is an audio power amplifier capable of delivering 500mW of continuous average power into a mono 8 load, 25mW per channel of continuous average power into stereo 32 single-ended (SE) loads.
  • Page 46 3. TECHNICAL BRIEF VBAT C260 C261 C262 0.1uF 4.7u 2V72_IO C263 MONO_IN+ BBP_SND_L C264 MONO_IN- BBP_SND_R MONO+ SPK_P R260 U206 ID_ENB MONO- SPK_N 100K C265 0.068u LM4946SQX RHP3D1 R261 4.7K I2CSPI_VDD RHP3D2 C266 220n I2CSPI_SEL BBP_SND_R C267 ROUT 0.1uF (3.2x1.6x1.1T) C268 100u HS_OUT_R...
  • Page 47 3. TECHNICAL BRIEF 3.13.2. Microphone with gain switching circuit Microphone Gain : -42dB MICROPHONE C547 C546 R501 VMICP R503 VMICN R543 C502 R504 C503 MIC1_P 0.1u MIC500 OSF213-42DC R506 C506 MIC1_N 0.1u C508 Figure 20 Microphone - 48 -...

  • Page 48: Battery Charging/ Usb Charging Circuit49

    3. TECHNICAL BRIEF 3.14. Battery charging/ USB charging circuit The ICDL pin function is to program the cradle current during the cc mode. The cc mode current is programmed by the following equations = 16685.5 / 39K - 0.026 = 400mA The End Of Charging current is set by IMIN That can be programmed by the as following equation: = 14478 / 100K - 4 = 140mA CHARGIING IC...

  • Page 49: Bluetooth

    3. TECHNICAL BRIEF 3.15. BLUETOOTH Figure 22 BLUETOOTH Functional block diagram. - 50 -...

  • Page 50: General Features

    3. TECHNICAL BRIEF 3.15.1. General Features • Single Chip Bluetooth device for cellular applications integrating radio, baseband and memory • Fabricated in advanced low power 0.13µm CMOS technology • Very low component count (6 external components) • Ultra low power design - Peak current 40mA for basic data rate - Peak current 45mA for enhanced data rate - Bluetooth low power mode typ.
  • Page 51 3. TECHNICAL BRIEF 3.15.5. RF-Section • Integrated antenna switch to minimize external components count • Programmable RF transmit power between -55dBm...+6dBm - Fine tuning in 2dB programmable steps also supported • 20dBm power class 1 supported with external power amplifier - Separate TX output interface to PA (bypass of internal T/R switch) - Digital power step control •...
  • Page 52 3. TECHNICAL BRIEF 3.15.6 System Integration Figure 23 Mobile system integration The UART (serial interface) is used for the software interface between S-Gold2 baseband and the Bluetooth chip. For the HCI UART transport layer four interface lines are needed, two for data (UARTTXD and UARTRXD) and two for hardware flow control (UARTRTS and UARTCTS).
  • Page 53 3. TECHNICAL BRIEF 2V72_IO 1V8_MEM R321 BLUETOOTH C318 C319 0.1uF 0.1uF TP301 SCL0_P0_13 2V65_BT 1V8_MEM TP302 PCMFR2_SDA0_P0_12 TP304 BT_VCXO_EN TP303 SLEEPX_P0_15 1V5_CORE VBALUN TP305 CLK32_P1_5 CLK32K TP306 TRST_ TP307 RTCK WAKEUP_HOST_P1_8 TP308 JTAG_ WAKEUP_BT_P1_7 TP309 RESET_ _BT_RESET U305 VDDSUP RFOUT VDDCREG VDD_1 PAON...

  • Page 54: Micro Sd External Memory Card Slot

    3. TECHNICAL BRIEF 3.16. Micro SD external memory card slot The MicroSD Memory Module has eight exposed contacts on one side. The S-Gold2 is connected to the module using a dedicated eight-pin connector TRANS-FLASH ( CONNECTOR ) PART VBAT VCARD U501 TFLASH_EN STBY...
  • Page 55 3. TECHNICAL BRIEF SD mode Pin No. Name Type Description DAT2 Data bit [2] CD/DAT3 Data bit [3] Command response Power Power supply Clock Ground Power ground DAT0 Data bit [0] DAT1 Data bit [1] Table 7 Micro SD memory pad assign. Micro SD card status it is removed it is inserted...

  • Page 56: 18Pin Multi Media Interface Connector

    3. TECHNICAL BRIEF 3.17. 18pin Multi Media Interface connector Table 11 Multi media interface pin assign KE770MMI Pin Function Description MIC2_P JACK_TYPE MULTI_PORT_2 MULTI_PORT_3 MULTI_PORT_0 MULTI_PORT_1 JACK_DETECT VSUPPLY VSUPPLY RPWRON VCHG VCHG VBUS_USB TX_DEBUG RX_DEBUG 2V72_IO 2V85_IO2 U303 2V65_ANA VBUS_USB 2V72_IO 2V65_ANA VCHG...
  • Page 57 3. TECHNICAL BRIEF III-2. RF circuit *RF Block Diagram - 58 -...

  • Page 58: General Description

    3. TECHNICAL BRIEF 3.18. General Description The RF transceiver (PMB 6272 SMARTi-PM) is an integrated single chip, quad-band transceiver for GSM850/GSM900/GSM1800/GSM1900 designed for voice and data transfer applications. The transceiver provides an analog I/Q baseband interface and consists of a direct conversion receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA functionality.
  • Page 59 3. TECHNICAL BRIEF 2V85_RF 1V5_RF 2V85_RF 2V85_RF 1V5_CORE R403 C407 C406 R404 C404 C408 C409 C411 C412 0.1uF 0.1uF C413 TRANSCEIVER (INFINEON) VDDBIAS2V8 RX1X U401 RX2X VDDDIG2V8 R409 RF_DA PMB6272 R410 RF_CLK GND2 RX3X VDDDIG1V5 FSYS3 BT_CLK RX4X FSYS2 VDDLNA1V5 2V7_VCXO 1V5_RF C425...

  • Page 60: Receiver Part

    3. TECHNICAL BRIEF 3.19. Receiver part Figure 30 Receiver part block diagram The constant gain direct conversion receiver contains all active circuits for a complete receiver chain for GSM/GPRS/EDGE (see Figure 39). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.

  • Page 61: Transmitter Part

    3. TECHNICAL BRIEF 3.20. Transmitter part The GMSK transmitter supports power class 4 for GSM850 and GSM900 as well as power class 1 for DCS1800 and PCS1900. The digital transmitter architecture is based on a very low power fractional-N Sigma-Delta synthesizer without any external components (see Figure39). The analog I/Q modulation data from the baseband is converted to digital, filtered and transformed to polar coordinates.

  • Page 62: Rf Synthesizer

    3. TECHNICAL BRIEF 3.21. RF synthesizer The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as Sigma- Delta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided by the internal crystal oscillator.

  • Page 63: Front End Module Control

    3. TECHNICAL BRIEF 3.23. Front End Module control Implemented in the S-Gold2 (U102) are three outputs which are ANT_SW1, ANT_SW2 and ANT_SW3 for direct control of front end modules with three logic input pins to select RX and TX mode as well as low and high band operation.

  • Page 64: Power Amplifier Module

    3. TECHNICAL BRIEF 3.24. Power Amplifier Module The RF3158 (U501) is a high-power, dual-mode amplifier (PA) with integrated power control. This PA is designed to operate both in a saturated mode for GMSK signaling and in a linear mode for 8PSK modulation.

  • Page 65: Pcb Layout

    4. PCB layout 4. PCB layout 4.1 Main & Sub PCB component placement Figure 35 Main PCB top. Figure 36 Main PCB top placement Figure 37 Main PCB bottom Figure 38 Main PCB bottom placement - 66 -...
  • Page 66 4. PCB layout Figure 39 Sub PCB top Figure 40 Sub PCB top placement Figure 41 Sub PCB bottom Figure 42 Sub PCB bottom placement - 67 -...

  • Page 67: Trouble Shooting

    5. Trouble shooting 5. Trouble shooting 5.1 Trouble shooting test setup Figure 43 Equipment setup Power on all of test equipment -Connect PIF-UNION JIG or dummy battery to the DUT for power up. -Connect mobile switch cable between Communication test set and DUT when you need to make a phone call.

  • Page 68: Power On Trouble

    5. Trouble shooting 5.2 Power on Trouble Check Points -Battery Voltage( Need to over 3.35V) -Power-On Key detection (PWRON signal) -Outputs of LDOs from PMIC POWER ON ( REMOTE / END_KEY ) D201 R218 RPWRON R219 PWRON R220 END_KEY KDR331V R222 C233 100K...
  • Page 69 5. Trouble shooting START Connect power supply to the DUT Vbat = over 3.35V Check the RPWRON, replace D201 "PWRON" signal = VBAT? Check END key FPCB Or Replace it. Check solder U205 or replace it "_RESET" signal goes to high? Check B to B connector Check camera connector Or replace camera module.
  • Page 70 5. Trouble shooting Outputs of LDOs from PMIC PMIC & Li-ion CHARGER VCHG 2V11_RTC 1V5_CORE 1V5_DSP 2V85_RF VBAT 2V7_VCXO 2V65_BT R201 R202 RTC_OUT PWRON VBACKUP 220K 4.7K R205 470K VBAT SPOWER_INT _PMRST C206 C207 C208 C209 C210 C211 C212 VBAT 1V8_MEM 3V1_USB 2.2u...

  • Page 71: Charging Trouble

    5. Trouble shooting 5.3 Charging trouble Check Points -Connection of TA (check TA voltage 4.8V) -Charging Current Path component voltage drop -Battery voltage • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : about 4.0V •...
  • Page 72 5. Trouble shooting CHARGIING IC VBUS_USB VCHG VBAT 2V72_IO D301 USFB13L U301 CRDL R312 R311 100K IMIN _PPR _CHG ICDL USBON CHG_EN PGND ISL6299 R318 R314 R319 C311 C312 R315 C313 100K 100K Charging • Connecting TA & Charger Detection •...
  • Page 73 5. Trouble shooting START 18pin MMI(CN305) Re- solder the CN305 Is soldered ? The TA can be broken CRDL pin Change other TA of U301 = 4.8V ? then retest "CHG_EN" signal Check solder goes to low? U301 or replace it D301 voltage drop Replace it is near 0.3V ?

  • Page 74: Lcd Display Trouble

    5. Trouble shooting 5.4 LCD display trouble Check Points -LCD assembly status ( FPCB) -EMI filter soldering -Connector combination LCD CONNECTOR ( 34 PIN, SOCKET ) 2V72_IO 2V72_IO 2V72_IO DIF_VSYNC INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 DIF_CS R308 R309 DIF_CD INOUT_B2 INOUT_A2 100K 100K DIF_WR...

  • Page 75: Camera Trouble

    5. Trouble shooting 5.5 Camera Trouble Check Points -Connectors combination -EMI filter soldering -FPCB status 2M FF CAMERA I/F CONNECTOR 2V85_IO2 2V8_CAM CAM Power ON/OFF Sequence (24PIN, SOCKET) VDD_C R384 (1V5_CAM) VDD_A R387 Q302 _CAM_IO_EN (2V8_CAM) VDD_IO SI1305-E3 (2V85_IO2) FL301 1V5_CAM CIF_D(0:7) CIF_D(7)
  • Page 76 5. Trouble shooting Check Points - 77 -...

  • Page 77: Receiver & Speaker Trouble

    5. Trouble shooting 5.6 Receiver & Speaker trouble Check Points -Speaker spring contact -Audio amp soldering -analog switch soldering VBAT C260 C261 C262 0.1uF 4.7u 2V72_IO C263 MONO_IN+ BBP_SND_L C264 MONO_IN- BBP_SND_R MONO+ SPK_P R260 U206 ID_ENB MONO- SPK_N 100K C265 0.068u LM4946SQX...
  • Page 78 5. Trouble shooting - 79 -...

  • Page 79: Microphone Trouble

    5. Trouble shooting 5.7 Microphone trouble Check Points -Microphone hole -Mic. Bias & signal come from MICROPHONE C547 C546 R501 VMICP R503 VMICN R543 C502 R504 C503 MIC1_P 0.1u MIC500 R506 C506 OSF213-42DC MIC1_N 0.1u C508 Check solder related microphone path Waveform - 80 -...
  • Page 80 5. Trouble shooting START Check microphone sound hole Check mic. Bias Make a phone call then line ( VMICP) C137 Mic. Bias come from BBP? (about 2V) Signal comes Replace out from microphone Microphone Assemble - 81 -...

  • Page 81: Vibrator Trouble

    5. Trouble shooting 5.8 Vibrator trouble Check Points - VCC lines (VBAT) - Vibrator signal path - The connection between the main board and vibrator module The soldering of socket VIBRATOR CIRCUIT VBAT VBAT R301 R386 R302 R303 100ohm Q301 R304 VIBRATOR_EN 1.5K...
  • Page 82 5. Trouble shooting - 83 -...

  • Page 83: Keypad Back Light Trouble

    5. Trouble shooting 5.9 Keypad back light trouble Check Points -Signal path is connected well -Control IC is working properly VBAT LD504 U502 SSC-SWTS1007 R534 STBY LD503 LGF_EN SSC-SWTS1007 BGND VOUT R533 R530 BH33FB1WHFV 100K C530 C531 Check LGF_EN (R530) Signal C542 C543 when Key backlight ON...

  • Page 84: Sim Card Trouble

    5. Trouble shooting 5.10 SIM card trouble Check Points -Power control FET is working -Socket soldering -Proper SIM is used 2V85_SIM Check soldering all pin of socket Q500 _SIM_EN SI1305-E3 PIN5 PIN6 CN500 CN500 R505 R507 SIM_RST SIM_IO SIM_CLK GND4 GND1 GND3 GND2...
  • Page 85 5. Trouble shooting Pin 3 / SIM_CLK START Check All of SIM card voltage KE770 support 1.8V & 3V SIM only 6 pins are Repair it soldered well? When _SIM_EN Replace the is low SIM_IO damaged signal is ok? part...

  • Page 86: Microsd Trouble

    5. Trouble shooting 5.11 MicroSD trouble Check Points -Power control LDO is working -Socket soldering -Card detect is working TRANS-FLASH ( CONNECTOR ) PART VBAT VCARD U501 TFLASH_EN STBY BGND VOUT R510 BH29FB1WHFV 100K C521 C522 VCARD S500 SCHB1A0202 TF_DAT2 DAT2 DAT1 TF_DAT1...
  • Page 87 5. Trouble shooting - 88 -...

  • Page 88: Rf Part Troubleshooting

    5. Trouble shooting 5.12 RF PART TROUBLESHOOTING 5.12.1 RF Components FL401 U401 X401 U402 SW401 REFERENCE PART Description U402 PAM (Power Ampilifier Module) X401 VCTCXO (26MHz) FL401 FEM (Front End Module) U401 Transceiver SW401 Mobile Switch Table 1. RF Components - 89 -...
  • Page 89 5. Trouble shooting 5.12.2 TX Troble Test Points FL401 U401 FL401 U401 U203 X401 U402 U203 X401 U402 Checking Flow STAR 8960 : Test mode 190 CH, 5 level setting 190 CH, -60dBm setting Spectrum analyzer setting Oscilloscope setting 1. Check PMIC RF voltage output 4.
  • Page 90 5. Trouble shooting 5.12.3 Regulator Circuit Circuit Diagram PMIC & Li-ion CHARGER VCHG 2V11_RTC 1V5_CORE 1V5_DSP 2V85_RF VBAT 2V7_VCXO 2V65_BT R201 R202 RTC_OUT PWRON VBACKUP 220K 4.7K R205 470K VBAT SPOWER_INT _PMRST C206 C207 C208 C209 C210 C211 C212 VBAT 1V8_MEM 3V1_USB 2.2u...
  • Page 91 5. Trouble shooting Checking Flow Check C209 Check C208 Check c226 Go to next page RF 2.85V RF 2.7V RF 1.5V Check C217 Replace U201 Vbat Changing the Board - 92 -...
  • Page 92 5. Trouble shooting 5.12.4 VCTXO Circuit Test Points Checking Flow Check Pin 3. VCTCXO Circuit is OK 26 MHz O K? See next Page to check Refer to Graph ANT SW & Mobile SW Check Pin 4 Changing X401 2.7V OK? Re soldering R505 check C430 Pin 3...
  • Page 93 5. Trouble shooting 5.12.5 FEM & Mobile SW Test Points Ant SW 1 FL401 U403 SW401 PIN17 Ant SW 2 PIN1 Figure 4-10 Circuit Diagram MAIN PCB_BOTTOM SIDE SW401 KMS-518 CN401 R401 WFL-R-SMT10 C401 C402 PGSM/EGSM_Tx DCS/PCS_Tx L409 PGSM_Rx 100nH EGSM_Rx DCS_Rx PCS_Rx...
  • Page 94 5. Trouble shooting Checking Flow Check SW401 Replace Mobile SW Signal is OK ? (SW401) Check Pin A1,A2 of U403? Control Signal is Check PMB8876 (U103) 1 ~ 8 ,12,15 pin Replace FEM (FL601) of FL401 OK? Mobile SW & FEM is OK. See next page to check I/Q Signals.
  • Page 95 5. Trouble shooting 5.12.6 PAM Test Points PA_LEVEL (C445) TXON_PA (C443) Figure 4-12 Waveform Graph 4-8 Checking Flow Check PA_LEVEL,TXON_PA Check if there is Download S/W Similar? Any Major Differenc e or not Refer to Graph 48. Go to Next Step - 96 -...
  • Page 96 5. Trouble shooting 5.12.7 TX IQ Test Points Circuit Diagram C404 C413 Figure 4-13 Waveform Graph 4-9 - 97 -...

  • Page 97: Download & S/W Upgrade

    6. Download & S/W upgrade 6. Download & S/W upgrade 6.1 S/W download setup Figure S/W download & upgrade setup Preparation • Target terminal • PIF-Union • RS-232 Cable and PIF-UNION to Phone interface Cable • Power Supply or Battery •...

  • Page 98: Download Program User Guide

    6. Download & S/W upgrade 6.2 Download program user guide Execute Flashtool program, then below window will be appeared. - 99 -...
  • Page 99 6. Download & S/W upgrade When the application is started first time the following screen appears. Each section is described in the text below. Click the check box to enable or disable file download. This will open a normal file select box. Select the wanted file. - 100 -...
  • Page 100 6. Download & S/W upgrade Click on the blue text to select the COM port. - 101 -...
  • Page 101 6. Download & S/W upgrade Will change the window as below - 102 -...
  • Page 102 6. Download & S/W upgrade Click on the blue text to select the COM Port. Click Start button to next step. Click to Start COM4 Then remote power on the target phone - 103 -...
  • Page 103 6. Download & S/W upgrade During download, the screen will look something like this: - 104 -...
  • Page 104 6. Download & S/W upgrade The blue bar shows the download progress The FLS filename and the expected checksum are shown. The download statistics are shown. After download, the status is shown. If there is a need to stop the download process, click on the panel for the channel to be stopped. To stop the download the panel must be clicked twice.
  • Page 105 - 106 -...

  • Page 106: Circuit Diagram

    R129 R130 R131 R132 VBAT VBAT VSUPPLY PT101 Engineer: KIM MIN JIN URXD C142 LG Electronics UTXD Drawn by: KIM MIN JIN RTS_0 Size: R&D CHK: TITLE: KIM MIN JIN CTS_0 DOC CTRL CHK: KE770_MAIN, MEMORY 12 1 8 A...
  • Page 107 2.2u 0.068u 4.7K HS_OUT_L USB_DM D-IC STF203-22-TC C272 220n BBP_SND_L Engineer: LG Electronics DRAWN BY : Size: R&D CHK: TITLE: KE770 DOC CTRL CHK: 12 1 8 A (AUDIO, PMIC, CHARGE PUMP ETC) MFG ENGR CHK: Changed by: Date Changed:...
  • Page 108 VA304 VA305 VA301 VA302 VA311 2.2nH C345 C346 Engineer: 2.7p C348 C349 18PIN MUILTIPORT RECEPTACEL L304 LG Electronics C350 C347 1000p Drawn by: BT_CLK 100p 2.2nH R&D CHK: Size: TITLE: DOC CTRL CHK: KE770 12 1 8 A (Bluetooth, Charging, Switches, Connectors etc)
  • Page 109 100p 100p 100p 100p Engineer: LG Electronics Drawn by: R&D CHK: Size: TITLE: DOC CTRL CHK: KE770 : RF PART 12 1 8 A MFG ENGR CHK: Changed by: Date Changed: Time Changed: QA CHK: Drawing Number: Page: REV: mentor...
  • Page 110 C548 C549 R521 KP_OUT(0) R522 KP_OUT(1) R523 KP_OUT(2) R524 KP_OUT(3) R526 KP_OUT(5) Engineer: VA502 EVL14K02200 LG Electronics VA503 VA504 VA505 VA506 Drawn by: EVL14K02200 EVL14K02200 EVL14K02200 EVL14K02200 R&D CHK: Size: TITLE: CMW_BAR : KEY_PCB DOC CTRL CHK: 12 1 8 A...

  • Page 111: Pcb Layout

    8. PCB LAYOUT - 112 -...
  • Page 112 8. PCB LAYOUT - 113 -...
  • Page 113 8. PCB LAYOUT - 114 -...
  • Page 114 8. PCB LAYOUT - 115 -...
  • Page 115 8. PCB LAYOUT - 116 -...

  • Page 116: Rf Calibration

    9. RF Calibration 9. RF Calibration 9.1. Test Equipment Setup 4.00 V 0.000 A 9.2 Calibration Steps 9.2.1. Turn on the Phone. 9.2.2. Execute “HK_24.exe” - 117 -...
  • Page 117 9. RF Calibration 9.2.3. Click “SETTING” Menu 9.2.4. Setup “Ezlooks” menu such as the following figure - 118 -...
  • Page 118 9. RF Calibration 9.2.5. Setup “Line System” menu such as the following figure Adjust the number of times. 9.2.6.Setup Logic operation such as the following figure. Operation Mode 1. By-Pass: not control by GPIB 2. Normal : control by GPIB Setup UART Port PWR : Power Supply CELL :Call-Test Equipment...
  • Page 119 9. RF Calibration 9.2.7. Select “MODEL”. 9.2.8. Click “START” for RF calibration 9.2.9. RF Calibration finishes. - 120 -...

  • Page 120: Stand-Alone Test

    10. Stand-alone Test 10. Stand-alone Test 10.1 Test Program Setting 1 Set COM Port. 2 Check PC Baud rate. 3 Confirm EEPROM & Delta file prefix name. - 121 -...
  • Page 121 10. Stand-alone Test 4 Click “Update Info” for communicating Phone and Test-Program. - 122 -...
  • Page 122 10. Stand-alone Test 5 For the purpose of the Standalone Test, Change the Phone to “ptest m ode” and then Click the “Reset” bar. 6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished. - 123 -...

  • Page 123: Engineering Mode

    11. ENGINEERING MODE 11. ENGINEERING MODE Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “2945#*#” Select. Pressing END will switch back to non-engineering mode operation.

  • Page 124: Exploded View & Replacement Part List

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 EXPLODED VIEW - 125 -...
  • Page 125 - 126 -...

  • Page 126: Replacement Parts

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.2 Replacement Parts Note: This Chapter is used for reference, Part order <Mechanic component> is ordered by SBOM standard on GCSC Location Level Description Part Number Spec Color Remark GSM,BAR/FILP TGSM0048705 Silver AAAY00 ADDITION AAAY0140120 Shining Silver...
  • Page 127 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark MTAF00 TAPE,MOTOR MTAF0010001 COMPLEX, (empty), , , , , Without Color MTAZ00 TAPE MTAZ0164201 COMPLEX, (empty), , , , , Without Color MTAZ01 TAPE MTAZ0164301 COMPLEX, (empty), , , , , Without Color MTAZ02...

  • Page 128: Main Component

    SACC0021702 Silver BOTTOM CONNECTOR,BOARD TO ENBY00 ENBY0023201 44 PIN,0.4 mm,ETC , ,H=0.9, Header BOARD POLYI ,0.2 mm,DOUBLE ,KE770 B TO B FPCB ,; , , , , , , SPCY00 PCB,FLEXIBLE SPCY0091601 , , , SAEY00 PCB ASSY,KEYPAD SAEY0056701 SAEB00...
  • Page 129 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark CN503 CONN,RF SWITCH ENWY0003901 ,SMD , dB, FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), FL500 FILTER,EMI/POWER SFEY0010501 Pb-free SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), FL501 FILTER,EMI/POWER SFEY0010501...
  • Page 130 RES,CHIP,MAKER ERHZ0000495 56 ohm,1/16W ,J ,1005 ,R/TP R534 RES,CHIP,MAKER ERHZ0000495 56 ohm,1/16W ,J ,1005 ,R/TP FR-4 ,0.5 mm,BUILD-UP 6 ,KE770 KEY PCB ,; , , , , , , , , SPEY00 PCB,KEYPAD SPEY0046101 SJMY00 VIBRATOR,MOTOR SJMY0008203 3 V,.1 A,10*2.0T ,12mm POLYI ,0.2 mm,DOUBLE ,KE770 VOLUM_CAMERA...
  • Page 131 PRINTING, (empty), , , , , Without Color SAFY00 PCB ASSY,MAIN SAFY0157563 Silver SAFB00 PCB ASSY,MAIN,INSERT SAFB0061604 POLYI ,0.2 mm,DOUBLE ,KE770 END SIDEKEY FPCB ,; SPKY00 PCB,SIDEKEY SPKY0041301 , , , , , , , , , SAFF00 PCB ASSY,MAIN,SMT SAFF0079561 Black...
  • Page 132 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark C233 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C234 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C242 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C245 CAP,CERAMIC,CHIP ECCH0000120...
  • Page 133 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark C335 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C336 CAP,CHIP,MAKER ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C337 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C338 CAP,CERAMIC,CHIP ECCH0000155...
  • Page 134 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark C496 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C497 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C498 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C499 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C500 CAP,CHIP,MAKER ECZH0000841...
  • Page 135 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark NTC ,10000 ohm,SMD ,1005, 3350~3399k, J, R/T, PT101 THERMISTOR SETY0006301 PBFREE R102 RES,CHIP,MAKER ERHZ0000237 20 Kohm,1/16W ,F ,1005 ,R/TP R128 RES,CHIP,MAKER ERHZ0000244 22 Kohm,1/16W ,F ,1005 ,R/TP R201 RES,CHIP,MAKER ERHZ0000445...
  • Page 136 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark R338 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP R339 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R340 RES,CHIP,MAKER ERHZ0000522 24 ohm,1/16W ,J ,1005 ,R/TP R341 RES,CHIP,MAKER ERHZ0000522 24 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 137 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark 26 MHz,2 PPM,10 pF,SMD ,3.2*2.5*1.05 ,2.5ppm at -30 X401 VCTCXO EXSK0004103 to +85, AFC 0.1V to 1.5V, 2.85V, Double Room , ,26MHz ,2PPM ,2.85V ,3.2 ,2.5 ,1.05 , ,SMD ,R/TP SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0071302...
  • Page 138 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark C136 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C137 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C140 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP C141 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP C201 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 139 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark CONNECTOR,BOARD TO CN302 ENBY0020401 24 PIN,0.4 mm,ETC , ,H=0.9, Socket BOARD CONNECTOR,BOARD TO CN303 ENBY0023301 44 PIN,0.4 mm,ETC , ,H=0.9, Socket BOARD CN401 CONN,RF SWITCH ENWY0004001 ,SMD ,1.3 dB, USF ,30 V,1 A,R/TP , ,;...
  • Page 140 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark R129 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R130 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R131 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R132 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 141 0 ohm,1/16W ,J ,1005 ,R/TP R401 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP FR-4 ,0.8 mm,STAGGERED-10 ,KE770 MAIN PCB ,; , , , SPFY00 PCB,MAIN SPFY0139301 , , , , , , ,SMD , dB,H=1.85 ,; ,3.00MM ,STRAIGHT ,RF ADAPTER...

  • Page 142: Accessory

    SBOM standard on GCSC Location Level Description Part Number Spec Color Remark ADEY00 DATA KIT ADEY0001085 KE770 Data Kit for CIS/English Without Color MCHZ00 COMPACT DISK MCHZ0033001 COMPLEX, (empty), , , , , Silver MCJA00 COVER,BATTERY MCJA0037601 PRESS, STS, 0.5, , , ,...
  • Page 143 Note...
  • Page 144 Note...

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