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LG KE260 Service Manual

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Service Manual
KE260
Date: November, 2006 / Issue 1.0

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  • Page 1 Service Manual KE260 Date: November, 2006 / Issue 1.0...
  • Page 2 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. * This manual provides the information necessary to install, program, operate and maintain the KE260 - 3 -...
  • Page 3 - 4 -...

  • Page 4: Table Of Contents

    2.2 Technical specification......12 5.7 Microphone trouble ........93 5.8 Vibrator trouble ........95 3. TECHNICAL BRIEF ......19 5.9 Main PCB Keypad back light trouble ..98 3.1 KE260 Component Block diagram..19 5.10 Indication LED........101 3.2 Baseband Processor (BBP) 5.11 SIM card trouble.........103 Introduction ..........21 5.12 MicroSD trouble .........105...
  • Page 5 - 6 -...

  • Page 6: Introduction

    A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the KE260 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
  • Page 7 1. INTRODUCTION E. Notice of Radiated Emissions The KE260 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

  • Page 8: Abbreviation

    1. INTRODUCTION 1.3 ABBREVIATION For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current - Constant Voltage Cigar Lighter Adapter Digital to Analog Converter Digital Communication System dB relative to 1 milli-watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory...
  • Page 9 1. INTRODUCTION LG Electronics OPLL Offset Phase Locked Loop Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave...

  • Page 10: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Feature Item Feature Comment Standard Battery Li-ploymer, 800mAh AVG TCVR Current 280mA Standby Current <2.7mA @PP9 Talk time 3hours (GSM TX Level 7) Standby time 300 hours (Paging Period:9, RSSI: -85dBm) Charging time 3 hours RX Sensitivity GSM9000 : -105dBm, DCS/PCS : -105dBm GSM900: 32dBm (Level 5)

  • Page 11: Technical Specification

    2. PERFORMANCE 2.2 Technical specification Item Description Specification GSM900 TX: 890 + 0.2 x n MHz RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 ) EGSM Frequency Band TX: 890 + 0.2 x (n-1024) MHz RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 ) DCS1800 TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 °≠...
  • Page 12 2. PERFORMANCE Item Description Specification GSM900/EGSM Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 Output RF Spectrum 6,000 DCS1800/PCS1900 (due to modulation) Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000...
  • Page 13 2. PERFORMANCE Item Description Specification DCS1800/PCS1900 Offset from Carrier (kHz). Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status GSM900 BER (Class II) < 2.439% @-102dBm Bit Error Ratio DCS1800/PCS1900 BER (Class II) < 2.439% @-100dBm Rx Level Report accuracy 3 dB 8 3 dB...
  • Page 14 2. PERFORMANCE Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side tone Distortion Three stage distortion < 10% <Change> System frequency 2.5ppm (26 MHz) tolerance <Change>32.768KHz tolerance...
  • Page 15 2. PERFORMANCE Item Description Specification Battery Bar Number Voltage( 0.05V) 3.86V~4.2V Battery Indicator 3.75V~3.85V 3.70V~3.74V 3.57V ~ 3.69V 3.56V~ 3.56V↓ 0.05V (Call) Low Voltage Warning 3.50V↓ 0.05V (Standby) Forced shut down Voltage 3.35 0.05 V Li-ion Battery Standard Voltage = 3.7 V Battery Type Battery full charge voltage = 4.2 V Capacity: 800mAh...
  • Page 16 2. PERFORMANCE * EDGE RF Specification Item Description Specification RMS EVM Peak EVM Percentile EVM ≥ Origin Offset Suppression 30dB GSM900/EGSM Level Power Toler. Level Power Toler. 27dBm 17dBm 27dBm 15dBm 27dBm 13dBm 27dBm 11dBm 25dBm 9dBm 23dBm 7dBm 21dBm 5dBm Power Level 19dBm...
  • Page 17 2. PERFORMANCE Item Description Specification Output RF Spectrum DCS1800, PCS1900 (due to modulation) Offset from carrier(kHz) Max. dBc +0.5 600~<1,200 1,200~<1,800 1,800~<3,000 3,000~<6,000 6,000 EGSM Output RF Spectrum (due to switching transient) Offset from carrier(kHz) Max. dBm 1,200 1,800 --30 DCS1800, PCS1900 Offset from carrier(kHz) Max.

  • Page 18: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF Baseband circuit 3.1 KE260 Component Block diagram. Figure 1 KE260 Hardware architecture KE260 is composed with 3 different PCB part such as main PCB, sub PCB and FPCB. - 19 -...
  • Page 19 3. TECHNICAL BRIEF The functional component arrangement is mentioned below diagram. Figure 2 KE260 Functional block diagram - 20 -...

  • Page 20: Baseband Processor (Bbp) Introduction

    3. TECHNICAL BRIEF 3.2. Baseband Processor (BBP) Introduction Figure 3. Top level block diagram of the S-GOLD2 (PMB8876) 3.2.1 General Description S-GOLD2 is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital functionality of a cellular radio. Additionally S-GOLD2 Provides multimedia extensions such as camera, software MIDI, MP3 sound.

  • Page 21: Block Description

    3. TECHNICAL BRIEF 3.2.2. Block Description • Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration. - TEAKLite DSP core • ARM-Memory - 32k Byte Boot ROM on the AHB - 96k Byte SRAM on the AHB, flexibly usable as program or data RAM - 16k Byte Cache for Program (internal) - 8k Byte tightly coupled memory for Program(internal)
  • Page 22 3. TECHNICAL BRIEF - Advanced static and dynamic power management features including TDMA-Frame synchronous low power mode and enhanced CPU modes(idle and sleep modes) - Pulse Number Modulation output for Automatic Frequency Correction(AFC) - Serial RF Control interface: support of direct conversion RF - A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission - 1 Serial Synchronous SPI compatible interfaces in the controller domain...
  • Page 23 3. TECHNICAL BRIEF 3.2.5. USART Interface KE260 have two UART Drivers as follow : - USART1 : Hardware Flow Control / SW upgrade / Calibration - USART2 : SW debug trace. Table 3 USART Interface Spec. USART_0(USART1) Resource Name Remark...
  • Page 24 Over a hundred allowable resources, KE260is using as follows except dedicated to SIM and Memory. KE260GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table. Table 5 S-Gold2 GPIO pin Map Port function KE260 Net Name Description KEY MATRIX KP_IN0 KP_IN0...
  • Page 25 3. TECHNICAL BRIEF MEMORY &CLK GPIO_20 F_DPD For INTEL Memory CLK32K CLK32K For FM Radio & BLUETOOTH GPIO_22 Not Use CAMERA I/F CIF_D0 CIF_D(0) Camera DATA[0] CIF_D1 CIF_D(1) Camera DATA[1] CIF_D2 CIF_D(2) Camera DATA[2] CIF_D3 CIF_D(3) Camera DATA[3] CIF_D4 CIF_D(4) Camera DATA[4] CIF_D5 CIF_D(5)
  • Page 26 3. TECHNICAL BRIEF GPIO_99 INDICATION Charging indicator LED control GPIO_100 TF_PWR_EN TransFlash card power enable(active High) DIF_RESET1_GPIO DIF_RESET1 LCD Reset EINT6 REMOTE_INT For Remote Control Headset I2C_SCL For SM-Power, FM Radio, Audio AMP I2C_SDA " PM_INT (EINT) PM_INT SM-Power interrupt SIM CARD CC_IO SIM_IO...
  • Page 27 3. TECHNICAL BRIEF I2S1_RX I2S1_RX For Bluetooth I2S1_TX I2S1_TX " I2S1_WA0 I2S1_WA0 " MMCI_DAT[1] TF_DAT1 For T-Flash MMCI_DAT[2] TF_DAT2 " MMCI_DAT[3] TF_DAT3 " AUDIO I/F EPN1 RCV_N For Receiver EPP1 RCV_P " EPPA1 BBP_SND_L For Speaker EPPA2 BBP_SND_R For Speaker MICN1 MIC1_N For Mic...
  • Page 28 3. TECHNICAL BRIEF TRIG_IN TRIG_IN " MON1 MON1 " MON2 MON2 " TRACESYNC TRACESYNC " TRACECLK TRACECLK " PIPESTAT[2] PIPESTAT[2] " PIPESTAT[1] PIPESTAT[1] " PIPESTAT[0] PIPESTAT[0] " TRACEPKT[0] TRACEPKT[0] " TRACEPKT[1] TRACEPKT[1] " TRACEPKT[2] TRACEPKT[2] " TRACEPKT[3] TRACEPKT[3] " TRACEPKT[4] TRACEPKT[4] "...
  • Page 29 3. TECHNICAL BRIEF EBU_RD_n Read strobe EBU_BC0_n _BC0 EBU_BC1_n _BC1 EBU_A[0] A(0) Address bus[0] EBU_A[1] A(1) Address bus[1] EBU_A[2] A(2) Address bus[2] EBU_A[3] A(3) Address bus[3] EBU_A[4] A(4) Address bus[4] EBU_A[5] A(5) Address bus[5] EBU_A[6] A(6) Address bus[6] EBU_A[7] A(7) Address bus[7] EBU_A[8] A(8)
  • Page 30 3. TECHNICAL BRIEF EBU_WAIT_n _WAIT EBU_SDCLKO SDCLKO EBU_SDCLKI SDCLKI EBU_BFCLKO BFCLKO EBU_BFCLKI BFCLKI EBU_CKE SSC1_SCLK F_DPD T_OUT0 TXON_PA RF Power amp turn on GPIO_44 VIBRATOR_EN Vibrator enable(High: enable, Low:disable) T_OUT2 PA_BAND RF band select T_OUT3 ANT_SW1 RF FEM control signal 1 T_OUT4 ANT_SW2 RF FEM control signal 2...
  • Page 31 3. TECHNICAL BRIEF F32K Sleep crystal 32.768KHz OSC32K Sleep crystal 32.768KHz RESET_n _RESET Baseband processor reset CC1CC1IO TRIG_OUT For JTAG & ETM Interface Wake up signal to alarm (High; RTC_OUT RTC_OUT wake up, Low: Power off) VCXO_EN VCXO_EN 26MHz clock enable DSPIN0 _BT_RESET Bluetooth chip reset...

  • Page 32: Power Management Ic

    3. TECHNICAL BRIEF 3.3. Power management IC 3.3.1. General Description SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has been specially designed for usage with S-Gold2. Although optimized for usage with the Infineon S- GOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as well.
  • Page 33 3. TECHNICAL BRIEF Figure 4 Top level block diagram of the SM-Power(PMB6812) SM-POWER is a further step on the successful E-Power product line with enhanced and optimized functionality. SM-POWER features a baseband supply concept with a DC/DC step-down converter (SDBB) cascaded by two linear regulators (LBB1/2) - SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone functions (e.g.
  • Page 34 3. TECHNICAL BRIEF SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the linear regulator LBB1 for the DSP during mobile standby whenever this subsystem is not used. In this phase the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up with power being supplied by the other linear regulator LBB2.
  • Page 35 3V3_AUDIO 1V8_MEM I2C BUS INTERFACE PMB8753 2V65_BT RF Transceiver PWRON 1V5_CORE PMB6272 VBAT Charge CONTROL _RESET 1V8_MEM Control 2V85_RF PM_INT 2V72_IO 1V5_RF Audio 2V7_VCXO LED/3 RF3158 1V5_CORE VSUPPLY VSUPPLY Figure 5 Power domain block diagram of KE260 - 36 -...
  • Page 36 3. TECHNICAL BRIEF VRF1V5 VBAT 1V5_CORE 1V5_DSP VCHG PMRSTn R202 4.7K 2V11_RTC VRF2V85 VBAT VRF2V7 VRF2V65 VBACKUP SPOWER_INT C203 C204 2.2u 2.2u C205 C202 C206 C207 C208 C209 C210 2.2u 100u 2.2u 2.2u 2.2u 2.2u 2.2u VBAT 1V8_MEM 2V65_ANA VBAT VCHS VCXOEN XO_ENE...
  • Page 37 3. TECHNICAL BRIEF Charging IC USB_VBUS VCHG VBAT 2V72_IO D201 CUS02 U205 ISL6299 CUR_MON CRDL R233 C241 R235 R237 100K IMIN _PPR _CHG ICDL USBON R240 CHG_EN PGND R246 C242 C243 R244 C244 R243 R247 100K 100K (1%) Figure 7 Charging IC Circutit 4.2V~3.86V 3.85V~3.75V 3.74V~3.70V...

  • Page 38: Power On/Off

    3. TECHNICAL BRIEF 3.4. Power ON/OFF KE260Power State : Defined 3cases as follow ] Power-ON : Power key detect ( SM-Power’s ON port ] Power-ON-charging : Charger detect. ] Power-ON-remote : remote power on detect (Factory use only) Figure 8 Power on application. Input ON is a power-on input for SM-POWER with 2 active high levels (see Figure 8).

  • Page 39: Sim Interface

    3. TECHNICAL BRIEF Power On VBAT VBAT R300 RTC_OUT PWRON U301 FSA4157L6X 220K RPWRON PWRON END_KEY C302 VBAT KP_OUT1 U350 VBAT R1114D281D-TR-F R390 VOUT RPWRON R305 Q300 END_KEY 2SC5585 GND1 R306 RPWRON_EN GND2 100K END_KEY KP_IN5 C303 C390 R304 100p 1000p 100K Figure9 Remote power on and End-key power on circuit...

  • Page 40: Memory

    3. TECHNICAL BRIEF 3.6. Memory 512Mbit Flash & 128Mbit SDRAM employed on KE260with 16 bit parallel data bus thru ADD(0) ~ ADD(24). The 256Mbit Sibley Wireless Flash memory with LPSDRAM stacked device family offers multiple high-performance solutions. The Sibley flash die is manufactured on 90 nm process technology.

  • Page 41: Lcd Display

    3. TECHNICAL BRIEF 3.7. LCD Display LCD module include: - LCD : 176 x 220 262K Colors TFT LCD - Backlight : 3 piece of white LED illumination LCD module is connected to Upper board thru 35 pins connector. LCD FPC Interface Spec: Table 7 LCD FPC Interface Spec.

  • Page 42: Keypad Switching & Scanning

    3. TECHNICAL BRIEF 3.8. Keypad Switching & Scanning The keypad interface is a peripheral which can be used for scanning keypads up to 8 rows (outputs from Port Control Logic) and 8 columns (inputs to PCL). The number of rows and columns depend on settings of the PCL.

  • Page 43: Keypad Back-Light Illumination

    SM-Power LED port which has constant current control function. The whole configuration of the SM-POWER LED drivers is shown in below Figure16. ( SLED1, SLED2 port are not used in the KE260) Figure 16 Keypad Back-light LEDs - 44 -...
  • Page 44 3. TECHNICAL BRIEF VBAT R349 R350 R351 R352 R353 R354 VA303 VA304 EVL5M02200 EVL5M02200 LD301 LD302 LD303 LD304 LD305 LD306 R356 LED_KEY VA307 EVL5M02200 Figure 17 Keypad Back-light LEDs - 45 -...

  • Page 45: Lcd Back Light Illumination

    3. TECHNICAL BRIEF 3.10. LCD back light illumination Employed the AAT2805 is a dual charge pump designed to support both the white LED backlight and flash applications for systems operating with lithium-ion/polymer batteries. The backlight charge pump is capable of driving up to four LEDs at a total of 80mA. The current sinks may be operated individually or in parallel for driving higher current LEDs.
  • Page 46 3. TECHNICAL BRIEF Figure 19 EN/SET port control method Table 8. Charge pump IC LCD part current setting table - 47 -...

  • Page 47: Battery Current Consumption Monitor

    3. TECHNICAL BRIEF 3.11 Battery current consumption monitor KE260use a current monitoring function to calculate the battery capacity and the remaining time, as monitoring current flow from the battery thru 47mohm resistor. VSUPPLY 26 27 U206 ZXCT1010E5TA R252 I_MONITOR IOUT 47mohm VBAT LOAD NC...

  • Page 48: Audio

    3. TECHNICAL BRIEF 3.13. Audio KE260Audio signal flow diagram as following diagram. Single End MIC1 Single End MIC2 PMB8876 Mono/ Differential Differential SPK_RCV_SEL Stereo/ Single ended GPIO Receiver & Speaker LM4845 Stereo Diffential FM_BBP_SEL Main PCB Active Mic. Stereo/ Single ended Si4701 Stereo/ Single ended Stereo head set &...
  • Page 49 3. TECHNICAL BRIEF 3.13.1. Audio amplifier sub system IC with 3D effect Audio amplifier sub system IC is an audio power amplifier capable of delivering 500mW of continuous average power into a mono 8Ω load, 25mW per channel of continuous average power into stereo 32 Ω...
  • Page 50 3. TECHNICAL BRIEF U401 FSA2257L10X SPK_P SPK_N SPK_REV_SEL SPK_REV_P SPK_REV_N REV_N REV_P VBAT SPK_RCV_SEL SPEAKER C428 R418 200K RECEIVER U404 FSA2257L10X RIN_HSO_SEL SNDOUT_R SNDOUT_L HSO_R HSO_L 2V65_ANA C452 C453 200K RIN_HSO_SEL RIN_LIN Figure 24 Audio signal distribute analog switch - 51 -...
  • Page 51 3. TECHNICAL BRIEF 3.13.2. Microphone with gain switching circuit Microphone Gain : -42dB C400 C401 MIC400 OB4-15L42-C33L C402 0.1u R400 MICN1 C403 0.1u R401 MICP1 C404 C405 VA400 PG05DBTFC VA401 R402 1.2K PG05DBTFC VMICN 1000p C406 R403 1.2K VMICP Figure 25 Microphone - 52 -...

  • Page 52: Charging Indication

    3. TECHNICAL BRIEF 3.14. Charging Indication Charging indicator LED LD600 and LD605 controlled by S-GOLD2’s GPIO that is INDICATION. When TA(Travel Adaptor) is plugged in to 24pin MMI connector, SM-POWER detect charger voltage then inform charger detecting to S-GOLD2. S-GOLD2 maintain low level of INDICATION until get EOC(End Of Charging) message from SM-POWER.

  • Page 53: Bluetooth

    3. TECHNICAL BRIEF 3.15. BLUETOOTH Figure 30 BLUETOOTH Functional block diagram. - 54 -...

  • Page 54: General Features

    3. TECHNICAL BRIEF 3.15.1. General Features • Single Chip Bluetooth device for cellular applications integrating radio, baseband and memory • Fabricated in advanced low power 0.13•Ïm CMOS technology • Very low component count (6 external components) • Ultra low power design - Peak current 40mA for basic data rate - Peak current 45mA for enhanced data rate - Bluetooth low power mode typ.
  • Page 55 3. TECHNICAL BRIEF 3.15.5. RF-Section • Integrated antenna switch to minimize external components count • Programmable RF transmit power between -55dBm...+6dBm - Fine tuning in 2dB programmable steps also supported • 20dBm power class 1 supported with external power amplifier - Separate TX output interface to PA (bypass of internal T/R switch) - Digital power step control •...
  • Page 56 3. TECHNICAL BRIEF 3.15.6 System Integration Figure 31 Mobile system integration The UART (serial interface) is used for the software interface between S-Gold2 baseband and the Bluetooth chip. For the HCI UART transport layer four interface lines are needed, two for data (UARTTXD and UARTRXD) and two for hardware flow control (UARTRTS and UARTCTS).

  • Page 57: Micro Sd External Memory Card Slot

    3. TECHNICAL BRIEF BLUETOOTH 1V8_MEM 2V72_IO 1V8_MEM R200 R201 C200 C201 0.1u 0.1u I2S1_CLK R204 USIF_TXD I2S1_WA0 I2S1_RX R205 USIF_RXD I2S1_TX SCL0_P0_13 VRF2V65 1V5_CORE 1V8_MEM PCMFR2_SDA0_P0_12 BT_VCXO_EN SLEEPX_P0_15 C214 CLK32K CLK32_P1_5 0.1u TRST_ RTCK WAKEUP_HOST_P1_8 JTAG_ WAKEUP_BT_P1_7 RESET_ BT_RST U202 VDDSUP RFOUT PMB8753...
  • Page 58 3. TECHNICAL BRIEF Table 9 Micro SD memory pad assign. SD mode Pin No. Name Type Description DAT2 Data bit [2] CD/DAT3 Data bit [3] Command response Power Power supply Clock Ground Power ground DAT0 Data bit [0] DAT1 Data bit [1] Table 10 Micro SD memory card detect truth table.

  • Page 59: 18Pin Multi Media Interface Connector

    3. TECHNICAL BRIEF VBAT VCARD U300 BH2JNB1WHFV TFLASH_EN STBY BGND VOUT C300 C301 (2.85V ,150mA) VCARD R307 R308 R309 R310 R311 100K 100K 100K 100K J300 TFLASH_DAT2 DAT2 DAT1 TFLASH_DAT1 TFLASH_DAT3 DAT3 DAT0 TFLASH_DAT0 TFLASH_CMD TFLASH_CLK GND1 GND3 R315 TFLASH_DETECT GND2 GND4 R317...

  • Page 60: Power Supply

    3. TECHNICAL BRIEF KE260MMI Pin Function Description TXD_0 UART TX USBDP USB Differential Plus Signal USB_VBUS USB Power Supply From USB Host (EXTRSTn) TX_DEBUG UART TX For Debugging Ground RTS_0 Request to Send For UART VSUPPLY Power Supply VSUPPLY Power Supply CTS_0 Clear to Send For UART RX_DEBUG...

  • Page 61: Ear Jack

    3. TECHNICAL BRIEF 3.18. Ear Jack 2V85 R404 R405 VIN- HEADSET_DETECT R477 HOOK_DETECT 2V65_ANA VIN+ C407 C408 U400 100p 100p C477 LMV7291MGX-NOPB R406 330K R407 1.5K J400 C409 100u R408 HSO_L C410 0.1u R409 R410 2.2K MICN2 C411 0.1u R411 C412 100u R412...

  • Page 62: General Description

    3. TECHNICAL BRIEF RF circuit RF Block Diagram 3.20. General Description The RF transceiver (PMB 6272 SMARTi-PM) is an integrated single chip, quad-band transceiver for GSM850/GSM900/GSM1800/GSM1900 designed for voice and data transfer applications. The transceiver provides an analog I/Q baseband interface and consists of a direct conversion receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA functionality.
  • Page 63 3. TECHNICAL BRIEF Figure 37 RF transceiver PMB7262 SMARTi-PM functional block diagram - 64 -...
  • Page 64 3. TECHNICAL BRIEF C507 C508 C509 C510 C511 C512 3.9p 3.9p 3.3p 3.3p 5.6p 5.6p VRF1V5 VRF2V85 VRF2V7 VRF2V85 R500 C513 4700p C514 C515 C516 C517 C518 VRF1V5 VRF2V85 0.1u 0.1u 0.1u 0.1u 0.1u VBIAS VDDTX1V5 VDDRX2V8 VDDRX1V5 U500 VCO_RC PMB6272 R501 VDDTX2V8...

  • Page 65: Receiver Part

    3. TECHNICAL BRIEF 3.21. Receiver part Figure 39 Receiver part block diagram The constant gain direct conversion receiver contains all active circuits for a complete receiver chain for GSM/GPRS/EDGE (see Figure 39). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.
  • Page 66 3. TECHNICAL BRIEF The digital transmitter architecture is based on a polar modulation architecture, where the analog modulation data (rectangular I/Q coordinates) is converted to digital data stream and is subsequently transformed to polar coordinates by means of a CORDIC algorithm. The resulting amplitude information is fed into a digital multiplier for power ramping and level control.

  • Page 67: Rf Synthesizer

    3. TECHNICAL BRIEF 3.23. RF synthesizer The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as Sigma- Delta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided by the internal crystal oscillator.

  • Page 68: Front End Module Control

    3. TECHNICAL BRIEF 3.25. Front End Module control Implemented in the S-Gold2 (U102) are three outputs which are ANT_SW1, ANT_SW2 and ANT_SW3 for direct control of front end modules with three logic input pins to select RX and TX mode as well as low and high band operation.

  • Page 69: Power Amplifier Module

    3. TECHNICAL BRIEF 3.26. Power Amplifier Module The RF3158 (U501) is a high-power, dual-mode amplifier (PA) with integrated power control. This PA is designed to operate both in a saturated mode for GMSK signaling and in a linear mode for 8PSK modulation.

  • Page 70: Dual Mode Operation

    3. TECHNICAL BRIEF 3.26.1 Dual Mode Operation MODE VMODE RF INPUT VRAMP TX ENABLE Fixed Ramp Burst Control High EDGE High Ramp Burst Control Control amp bias current High When VMODE is low, the voltage on VRAMP is used to regulate the PA collector voltage which directly controls the output power.

  • Page 71: Pcb Layout

    4. PCB layout 4. PCB layout 4.1 Main & Sub PCB component placement Figure 44 Main PCB top placement Figure 45 Main PCB bottom - 72 -...
  • Page 72 4. PCB layout Figure 46 Main PCB bottom placement Figure 47 Sub PCB top - 73 -...
  • Page 73 4. PCB layout Bluetooth ANT Camera Connector Bluetooth Camera AMP LDO FPCB Connector FPCB Slide Connector Switch KEY LED - 74 -...
  • Page 74 4. PCB layout Flash LED Mobile Ear Jack Switch Antenna Switch Tranceiver 26MHz VTCXO 32KHz Crystal Memory PMIC Memory Micro SD Socket Charging Connector - 75 -...
  • Page 75 4. PCB layout KEY LED - 76 -...
  • Page 76 4. PCB layout Speaker Vibrator Soldering Soldering Connector Filter FPCB Connector Backup Battery - 77 -...

  • Page 77: Trouble Shooting

    5. Trouble shooting 5. Trouble shooting 5.1 Trouble shooting test setup 4.000V 0.0000A Figure 51 Equipment setup Power on all of test equipment - Connect PIF-UNION JIG or dummy battery to the DUT for power up. - Connect mobile switch cable between Communication test set and DUT when you need to make a phone call.
  • Page 78 5. Trouble shooting Power On VBAT VBAT R300 RTC_OUT PWRON U301 FSA4157L6X 220K RPWRON PWRON END_KEY C302 VBAT KP_OUT1 U350 R1114D281D-TR-F R390 VOUT RPWRON R305 Q300 END_KEY 2SC5585 GND1 R306 RPWRON_EN GND2 100K KP_IN5 C303 C390 R304 100p 100K 1000p End key _RESET - 79 -...
  • Page 79 5. Trouble shooting Power-on sequence 1.OFF State VBAT <= 2.5V If charger is plugged, precharge VBAT<2.5V 2.RTC ON VBAT<2.5V Digital supply off VBAT >= 2.5V No Charger or Td : 20ms (Charger valid or ON Signal High) VRTC NOT OK 3.BAT Sense BYP ON VBAT<2.9V or...
  • Page 80 5. Trouble shooting • Turn-on - VBAT > 3.1V + VCHG is High(>3.6V) or ON Signal is HIGH • PIN_ON High - Turn-on requested by RTCTOUT: VRTCOUT>=1.2V - Turn-on requested by KEY: ON>=VBAT-0.3V - RPWRON>=VBAT-0.3V Parameter Symbol Limit Values Unit Test Condition/ min.
  • Page 81 5. Trouble shooting START Connect power supply to the DUT Vbat = over 3.35V Remote power-on Power on pressing "End-Key" "RPWRON_EN" signal "END_KEY" signal over 0.7V? Is around VBAT? Check the Check the I/O Connector B-To-B Connector Replace it Or replace it. "RPWRON"...

  • Page 82: Charging Trouble

    5. Trouble shooting 5.3 Charging trouble Check Points -Connection of TA (check TA voltage 4.8V) -Charging Current Path component voltage drop -Battery voltage • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : about 4.0V •...
  • Page 83 5. Trouble shooting Charging IC USB_VBUS VCHG VBAT 2V72_IO D201 CUS02 U205 ISL6299 CUR_MON CRDL R233 C241 R235 R237 100K IMIN _PPR _CHG ICDL USBON R240 CHG_EN PGND C242 C243 R244 C244 R246 R243 R247 100K 100K (1%) < Fig. Schematic about Charging Circuit > Charging - Connecting TA &...
  • Page 84 5. Trouble shooting START 24pin MMI(CN200) Re- solder the CN200 Is soldered ? The TA can be broken CRDL pin Change other TA of U205= 5.2V ? then retest "CHG_EN" signal Check solder U205 or replace it goes to low? D201 voltage drop Replace it is near 0.3V ?

  • Page 85: Lcd Display Trouble

    5. Trouble shooting 5.4 LCD display trouble Check Points -LCD assembly status ( FPCB) -EMI filter soldering -Connector combination (200ohm,25pF) FL400 ICVE10054E250R201FR INOUT_A1 INOUT_B1 DIF_D7 INOUT_A2 INOUT_B2 DIF_D6 INOUT_A3 INOUT_B3 DIF_D5 1V8_MEM 2V72_IO VBAT INOUT_A4 INOUT_B4 DIF_D4 CN400 (200ohm,25pF) FL401 ICVE10054E250R201FR SPK_REV_N SPK_REV_P...
  • Page 86 5. Trouble shooting START Check LCD connector combination then LCD test with New LCD Is L CD FPCB Replace LCD module normal? Check solder and repair Signal is normal on Damaged filter EMI filters Assembl e Check signal line disconnection Check signal of the LCD FPCB flow via EMI filter...

  • Page 87: Camera Trouble

    5. Trouble shooting 5.5 Camera Trouble Check Points -Connectors combination -EMI filter soldering -FPCB status 2V6_CAM 2V6_CAM 1V8_CAM FB400 FB401 FL406 (7.5pF,10ohm, 7.5pF) ICVE10184E070R100FR 2V6_CAM INOUT_A1 INOUT_B1 SCL_CAM INOUT_A2 INOUT_B2 (7.5pF,10ohm, 7.5pF) FL407 SDA_CAM INOUT_A3 INOUT_B3 ICVE10184E070R100FR CIF_RESET INOUT_A4 INOUT_B4 R499 INOUT_B1 INOUT_A1...
  • Page 88 5. Trouble shooting - Block diagram - Check the connector combination 50pin main PCB connector Check signal flow via EMI filter - Check point - - 89 -...
  • Page 89 5. Trouble shooting START Check camera connector, 50pin main PCB connector combination then Camera test with equipped camera module Resolder EMI filters are soldered well? Replace Replace New FPCB module Replace New Camera module Main Working properly? Working properly? Replace Camera Replace FPCB module module...

  • Page 90: Receiver & Speaker Trouble

    5. Trouble shooting 5.6 Receiver & Speaker trouble Check Points -Speaker spring contact -Audio amp soldering -analog switch soldering 3V3_VAMP U401 FSA2257L10X SPK_P SPK_N SPK_REV_SEL SPK_REV_P SPK_REV_N REV_N REV_P C427 C450 VBAT 0.1u SPK_RCV_SEL C451 220n SPEAKER SPK_P PHONE_IN MONO+ R418 C428 200K...
  • Page 91 5. Trouble shooting START Check Speaker and Contacts are clear. Speak is contacted Check soldering C429,c430 audio signal check U404 Replace or U404 working properly? Repair it U402 Replace or C437, C438 Bypass signal check. Repair it U402 working properly? U401’s 3 and 7 pin audio signal check.

  • Page 92: Microphone Trouble

    5. Trouble shooting 5.7 Microphone trouble Check Points -Microphone hole -Mic. Bias & signal come from C400 C401 MIC400 OB4-15L42-C33L C402 0.1u R400 MICN1 C403 0.1u R401 MICP1 C404 C405 VA400 PG05DBTFC VA401 R402 1.2K PG05DBTFC VMICN 1000p C406 R403 1.2K VMICP Check solder...
  • Page 93 5. Trouble shooting Waveform START Check microphone sound hole Make a phone call then Check mic. Bias line R403 Mic. Bias come from BBP? Signal comes out from Replace microphone Microphone Assembl e - 94 -...

  • Page 94: Vibrator Trouble

    5. Trouble shooting 5.8 Vibrator trouble Check Points - VCC lines (VBAT) - Vibrator signal path - The connection between the main board and vibrator module The soldering of socket VBAT D200 1SS302-T5L_F_H Current VIB_O FB201 Flow R212 R213 Q200 VIBRATOR_EN 2SC5585 R214...
  • Page 95 5. Trouble shooting VBAT C613 C614 2.2u VIB+ R615 VIB_O VA605 EVL14K02200 (480pF) Check the contact is clear, if there is some obstacles then remove them - 96 -...
  • Page 96 5. Trouble shooting - 97 -...

  • Page 97: Main Pcb Keypad Back Light Trouble

    5. Trouble shooting 5.9 Main PCB Keypad back light trouble Check Points -Signal path is connected well -Control IC is working properly VBAT R349 R350 R351 R352 R353 R354 VA303 VA304 EVL5M02200 EVL5M02200 LD301 LD302 LD303 LD304 LD305 LD306 R356 LED_KEY VA307 Check R356 Soldering...
  • Page 98 5. Trouble shooting 5.9 Main PCB Keypad back light trouble Check Points -Signal path is connected well - FPCB is connected well -TR(Q600) is working properly 1V8_MEM 2V72_IO VBAT CN400 SPK_REV_N SPK_REV_P VBACKUP VIB_O KEY_BACKLIGHT_S MLED1 MLED2 MLED3 VBAT C607 EVL5M02200 R612 R610...
  • Page 99 5. Trouble shooting ICVE10184E150R101FR FL605 KP_IN_UPPER3 INOUT_B1 INOUT_A1 END_KEY INOUT_B2 INOUT_A2 KEY_BACKLIGHT_S INOUT_B3 INOUT_A3 VIB_O INOUT_B4 INOUT_A4 Start Replace U101 CN400 Pin25 is 2.8V? Connect FPCB Check FPCB or FL605 Point 1 is 1.4V? LED is turned Replace Q600 on ? - 100 -...

  • Page 100: Indication Led

    5. Trouble shooting 5.10 Indication LED Check Points -Signal path is connected well - FPCB is connected well - IC(U201) is working properly Key Backlight LED Indication LED VCHS VCXOEN VBATS VDDA VRFC VANA VSSR U201 VDDPW IREF PMB6812 VSSPW VDDAU VSSFB AUOP...
  • Page 101 5. Trouble shooting VCHG USB_VBUS D202 KDS121E 2V85 U204 FSA2257L10X R232 R221 Point 1 R234 R228 100K INDICATION 100K SLED1 VBAT C238 START Connect Data Cable with Point1 is above Point1 is above - 102 -...

  • Page 102: Sim Card Trouble

    5. Trouble shooting 5.11 SIM card trouble Check Points -Power control FET is working -Socket soldering -Proper SIM is used 2V85_SIM SIM_EN_N Q301 SI1305-E3 C320 0.1u J301 R355 4.7K GND1 SIM_RST SIM_IO SIM_CLK GND5 GND2 GND4 GND3 C321 C322 Pin 5 / 2V85_SIM Check soldering all pin of socket Pin 3 / SIM_CLK...
  • Page 103 5. Trouble shooting START Check All of SIM card voltage KE260support 1 8V & 3V SIM l 6 pins are Repair it soldered well? Replace the Q301 is damaged working? part Assemble - 104 -...

  • Page 104: Microsd Trouble

    5. Trouble shooting 5.12 MicroSD trouble Check Points -Power control LDO is working -Socket soldering -Card detect is working VBAT VCARD U300 BH2JNB1WHFV TFLASH_EN STBY BGND VOUT C300 C301 (2.85V ,150mA) VCARD R307 R308 R309 R310 R311 100K 100K 100K 100K J300 TFLASH_DAT2...
  • Page 105 5. Trouble shooting START Check the signal of TFLASH_EN KE260support 1 8V & 3V SIM only Are pins of J300 Repair it soldered well? Replace the U300 is damaged working? part Assemble - 106 -...

  • Page 106: Rf Part Troubleshooting

    5. Trouble shooting 5.13 RF PART TROUBLESHOOTING 5.13.1 RF Components SW500 FL500 U501 U500 X500 REFERENCE PART Description U501 PAM (Power Ampilifier Module) X500 VCTCXO (26MHz) FL500 FEM (Front End Module) U500 Transceiver SW500 Mobile Switch Table 1. RF Components - 107 -...
  • Page 107 5. Trouble shooting 5.13.2 TX Troble Test Points Figure 4-7 Checking Flow - 108 -...

  • Page 108: Test Points

    5. Trouble shooting 5.13.3 Regulator Circuit Test Points C209 C207 C205 C215 Figure 4-8 Circuit Diagram VRF1V5 VBAT 1V5_CORE 1V5_DSP VCHG PMRSTn R202 4.7K 2V11_RTC VRF2V85 VBAT VRF2V7 VRF2V65 VBACKUP SPOWER_INT C203 C204 2.2u 2.2u C205 C202 C206 C207 C208 C209 C210 2.2u...
  • Page 109 5. Trouble shooting Checking Flow - 110 -...
  • Page 110 5. Trouble shooting 5.13.4 VCTXO Circuit Test Points Checking Flow Figure 4-9 Waveform Graph 4-6(a) Graph 4-6(b) - 111 -...
  • Page 111 5. Trouble shooting Circuit Diagram VRF2V7 C527 R505 100p C528 0.1u X500 R506 VCONT C530 560p 26MHz - 112 -...
  • Page 112 5. Trouble shooting 5.13.5 FEM & Mobile SW Test Points Circuit Diagram VRF2V85 SW500 KMS-505 C500 100p C503 C504 0.1u FL500 LMSP43QA-539-TEMP GSM850_RX1 ANT_SW1 GSM850_RX2 ANT_SW2 GSM900_RX1 GSM900_RX2 C505 C506 100p 100p GSM1800_RX1 GND1 GSM1800_RX2 GND2 GND3 GSM1900_RX1 GND4 GSM1900_RX2 GND5 GND6 GSM1800_1900_TX...
  • Page 113 5. Trouble shooting Checking Flow SW500 GSM900: VC1-low / VC2-high DCS1800/1900: VC1-high/VC2-low ANT_SW1 ANT_SW2 Function Blank 900MHz RX 900MHz TX 1800/1900 MHz Rx 1800/1900 MHz Tx Table 4-2 - 114 -...
  • Page 114 5. Trouble shooting 5.13.6 PAM Test Points Vramp PAM_EN Figure 4-12 Waveform Graph 4-8 Checking Flow Check Vramp and PAM_EN Check if there is Download S/W Similar? Any Major Difference or not Refer to Graph 4-8 Go to Next Step - 115 -...
  • Page 115 5. Trouble shooting 5.13.7 TX IQ Test Points Circuit Diagram Figure 4-13 Waveform Graph 4-9 - 116 -...
  • Page 116 5. Trouble shooting 5.13.8 EDGE Trouble Test Points Figure 4-14 Checking Flow START HP8922 : Test mode(EDGE) 190 CH, 5 level setting (PDTCH) 190 CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting 1. Check Menu setting 4. Check PAM INPUT 2.
  • Page 117 5. Trouble shooting 5.13.8.1 EDGE Trouble - VCTXO Circuit Test Points Checking Flow Figure 4-15 Waveform Graph 4-6(a) Graph 4-6(b) Circuit Diagram VRF2V7 C527 R505 100p C528 0.1u X500 R506 VCONT C530 560p 26MHz - 118 -...
  • Page 118 5. Trouble shooting 5.13.8.2 EDGE Trouble - PAM Circuit C544 C543 Figure 4-16 Circuit Diagram R512 TXRAMP MODE_SELECT PAM_EN 100p 100p 100p C543 C544 C545 Checking Flow the edge mode Check C544. HIGH O.K? : mode_select - high redownlosd PAM_EN - high TXRAMP - donít care The GMSK mode Check C545...
  • Page 119 5. Trouble shooting 5.13.8.3 EDGE Trouble - PAM Input Circuit Test Points Circuit Diagram GSM INPUT R504 C520 10nH 0.5p C519 R503 R504 2.2nH 3.9p DCS INPUT C524 18nH C523 R503 Figure 4-16 Checking Flow the edge mode Check R504, Re soldering R503, O.K? R503 solder...
  • Page 120 5. Trouble shooting 5.13.8.4 EDGE Trouble -TX IQ Circuit Test Points Circuit Diagram Figure 4-13 Waveform Graph 4-9 - 121 -...

  • Page 121: Download & S/W Upgrade

    6. Download & S/W upgrade 6. Download & S/W upgrade 6.1 S/W download setup 4.000V 0.0000A Figure S/W download & upgrade setup Preparation • Target terminal • PIF-Union • RS-232 Cable and PIF-UNION to Phone interface Cable • Power Supply or Battery •...

  • Page 122: Download Program User Guide

    6. Download & S/W upgrade 6.2 Download program user guide - 123 -...
  • Page 123 6. Download & S/W upgrade - 124 -...
  • Page 124 6. Download & S/W upgrade ➜ ➜ KE260 KE260 - 125 -...
  • Page 125 6. Download & S/W upgrade KE260 KE260 KE260 KE260 - 126 -...

  • Page 126: Circuit Diagram

    Date Sign & Name Sheet/ Sheets R123 REV_N 07/25 KE260 MODEL nobody Designer R124 2006 REV_P C130 C131 Checked DRAWING BASEBAND/JTAG/DEBUGER NAME Approved DRAWING VER.1.0 LG Electronics Inc. Iss. Notice No. Date Name LG(42)-A-5505-10:01 LG Electronics Inc. - 127 -...
  • Page 127 C249 C250 C251 C253 C254 C248 VBUS C246 EVL5M02200 EVL5M02200 VA201 VA202 R255 C247 EVL5M02200 USBDM D-IC Checked C252 DRAWING PM/CHARGE/IO/BT/SLIDE NAME Approved DRAWING VER.1.0 LG Electronics Inc. Iss. Notice No. Date Name LG(42)-A-5505-10:01 LG Electronics Inc. - 128 -...
  • Page 128 EVL5M02200 Section Date Sign & Name Sheet/ Sheets 07/25 KE260 MODEL nobody Designer 2006 Checked SIM/MEMORY/CHARGE PUMP DRAWING TF CARD/KEY BACKLIGHT NAME Approved DRAWING VER.1.0 LG Electronics Inc. Iss. Notice No. Date Name LG(42)-A-5505-10:01 LG Electronics Inc. - 129 -...
  • Page 129 R451 R423 100K CAM_CTRL_ON C460 C441 C442 BGND C443 C444 Checked NOT CONTROL 0.01u IF CONN/CAMERA/ DRAWING CAM CONTROL NAME MIC/AUDIO AMP/HEADSET Approved DRAWING VER.1.0 LG Electronics Inc. Iss. Notice No. Date Name LG(42)-A-5505-10:01 LG Electronics Inc. - 130 -...
  • Page 130 100p 100p 100p C543 C544 C545 Section Date Sign & Name Sheet/ Sheets 07/25 KE260 MODEL nobody Designer 2006 Checked DRAWING NAME Approved DRAWING VER.1.0 LG Electronics Inc. Iss. Notice No. Date Name LG(42)-A-5505-10:01 LG Electronics Inc. - 131 -...
  • Page 131 (480pF) R617 C617 R618 R619 Section Date Sign & Name Sheet/Sheets MODEL KE260 03/22 Designer 2006 Checked DRAWING UPPER PCB NAME Approved DRAWING VER .1.0 Iss. Notice No. Date Name LG Electronics Inc. LG Electronics Inc. LGIC(42)-A-5505-10:01 - 132 -...

  • Page 132: Pcb Layout

    8. PCB LAYOUT - 133 -...
  • Page 133 8. PCB LAYOUT - 134 -...
  • Page 134 8. PCB LAYOUT - 135 -...
  • Page 135 8. PCB LAYOUT - 136 -...

  • Page 136: Rf Calibration

    9. RF Calibration 9. RF Calibration 9.1 Test Equipment Setup 4.00 V 0.000 A 9.2 Calibration Steps 9.2.1. Turn on the Phone. 9.2.2. Execute “HK_24.exe” - 137 -...
  • Page 137 9. RF Calibration 9.2.3. Click “SETTING” Menu 9.2.4. Setup “Ezlooks” menu such as the following figure - 138 -...
  • Page 138 9. RF Calibration 9.2.5. Setup “Line System” menu such as the following figure Adjust the number of times. 9.2.6. Setup Logic operation such as the following figure. Operation Mode 1. By-Pass: not control by GPIB 2. Normal : control by GPIB Setup UART Port PWR : Power Supply CELL :Call-Test Equipment...
  • Page 139 9. RF Calibration 9.2.7. Select “MODEL” . 9.2.8. Click “START” for RF calibration 9.2.9. RF Calibration finishes. - 140 -...

  • Page 140: Stand-Alone Test

    10. Stand-alone Test 10. Stand-alone Test 1. Test Program Setting 1 Set COM Port. 2 Check PC Baud rate. 3 Confirm EEPROM & Delta file prefix name. 4 Click “Update Info” for communicating Phone and Test-Program. - 141 -...
  • Page 141 10. Stand-alone Test Connected 5 For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the “Reset” bar. 6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished. Change ìptest moodî - 142 -...
  • Page 142 10. Stand-alone Test 2.Tx Test 1 Click “Non signaling mode” bar and then confirm “OK” text in the command line. 2 Put the number of TX Channel in the ARFCN. 3 Select “Tx” in the RF mode menu and “PCL” in the PA Level menu. 4 Finally, Click “Write All”...
  • Page 143 10. Stand-alone Test 3. Rx Test 1 Put the number of RX Channel in the ARFCN. 2 Select “Rx” in the RF mode menu. 3 Finally, Click “Write All” bar and try the efficiency test of Phone. 4 The Phone must be changed “normal mode” after finishing Test. 5 Change the Phone to “normal mode”...

  • Page 144: Engineering Mode

    11. ENGINEERING MODE 11. ENGINEERING MODE Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “2945#*#” Select. Pressing END will switch back to non-engineering mode operation.
  • Page 145 - 146 -...

  • Page 146: Exploded View & Replacement Part List

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 EXPLODED VIEW Assy 2 27 28 18 19 22 21 Assy 1 30 25 29 33 20 16 Assy 4 43 45 39 46 48 42 49 41 Assy 3 ASSY D ESC RI PTI ON D RAW I N G NO.
  • Page 147 - 148 -...

  • Page 148: Replacement Parts

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.2 Replacement Parts Note: This Chapter is used for reference, Part order <Mechanic component> is ordered by SBOM standard on GCSC Level Ref No Part Name Part Number Spec Color GSM(SLIDE) TGLL0005801 AAAY00 ADDITION AAAY0187001 Black...
  • Page 149 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color ACGK00 COVER ASSY,FRONT ACGK0077401 Dark Brown MBJC00 BUTTON,FUNCTION MBJC0019901 MOLD, ABS MP-211, , , , , Metal Silver MBJN00 BUTTON,VOLUME MBJN0009401 MOLD, ABS MP-211, , , , , Metal Silver MCCE00 CAP,RECEPTACLE MCCE0031601...
  • Page 150 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color MICC00 INSERT,FRONT(UPPER) MICC0011501 EXTRUSION, LDPE, , , , , Gold MPBZ00 MPBZ0144801 CUTTING, NS, , , , , Black MTAZ00 TAPE MTAZ0171401 CUTTING, NS, , , , , MTAZ01 TAPE MTAZ0145101...

  • Page 151: Main Component

    12. EXPLODED VIEW & REPLACEMENT PART LIST <Main component> Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Level Ref No Part Name Part Number Spec Color 3.0 ,-2.0 dBd,, ,internal, GSM900/DCS1800/PCS1900 ,; SNGF00 ANTENNA,GSM,FIXED SNGF0020901...
  • Page 152 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color Q600 TR,BJT,NPN EQBN0007101 EMT3 ,0.15 W,R/TP ,LOW FREQUENCY R600 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP R603 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP R604 RES,CHIP ERHY0003301...
  • Page 153 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color SPEY00 PCB,KEYPAD SPEY0043701 FR-4 ,0.5 mm,BUILD-UP 6 , , , , , , , , , , , SJMY00 VIBRATOR,MOTOR SJMY0008003 3 V,80 mA,9*3.4 ,17mm SUSY00 SPEAKER SUSY0023101...
  • Page 154 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color C207 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP C208 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP C209 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP C210 CAP,CERAMIC,CHIP ECCH0005602...
  • Page 155 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color C390 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C400 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C401 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C402 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 156 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color C503 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C504 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C505 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C506 CAP,CHIP,MAKER ECZH0000813...
  • Page 157 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color C544 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C545 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C599 CAP,CHIP,MAKER ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP CN200 CONNECTOR,I/O ENRY0005301...
  • Page 158 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color R123 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R124 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R202 RES,CHIP,MAKER ERHZ0000286 4700 ohm,1/16W ,F ,1005 ,R/TP R203 RES,CHIP,MAKER ERHZ0000406...
  • Page 159 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color R304 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R307 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R309 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R310 RES,CHIP,MAKER ERHZ0000406...
  • Page 160 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color R477 RES,CHIP ERHY0000101 0 ohm,1/16W,F,1005,R/TP R500 RES,CHIP ERHY0000101 0 ohm,1/16W,F,1005,R/TP R501 RES,CHIP ERHY0000185 820 ohm,1/16W ,F ,1005 ,R/TP R502 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP R503 INDUCTOR,CHIP ELCH0005001...
  • Page 161 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color VA202 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005 VA203 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005 VA400 DIODE,TVS EDTY0008501 TFSC ,5 V,50 W,R/TP ,small size VA401 DIODE,TVS EDTY0008501...
  • Page 162 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color C234 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP C237 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C240 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C260 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 163 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color CONNECTOR, CN400 ENBY0031101 60 PIN,0.4 mm,ETC , ,H=1.0, Female BOARD TO BOARD CONNECTOR, CN401 ENBY0019101 24 PIN,0.4 mm,STRAIGHT , ,H1.5, MALE BOARD TO BOARD D200 DIODE,SWITCHING EDSY0005301...
  • Page 164 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color R209 INDUCTOR,CHIP ELCH0001404 1.5 nH,S,1005,R/TP R210 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R211 INDUCTOR,CHIP ELCH0001404 1.5 nH,S,1005,R/TP R212 RES,CHIP,MAKER ERHZ0000325 24 ohm,1/16W ,F ,1005 ,R/TP R213 RES,CHIP,MAKER ERHZ0000404...
  • Page 165 12. EXPLODED VIEW & REPLACEMENT PART LIST Level Ref No Part Name Part Number Spec Color R423 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R451 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP R490 RES,CHIP ERHY0000101 0 ohm,1/16W,F,1005,R/TP R491 RES,CHIP,MAKER ERHZ0000444 22 Kohm,1/16W ,J ,1005 ,R/TP SPFY00 PCB,MAIN...

  • Page 166: Accessory

    SBOM standard on GCSC Level Ref No Part Name Part Number Spec Color 3.7 V,800 mAh,1 CELL,PRISMATIC ,KE260 BATT, BATTERY PACK, 383450, Europe Label, Pb-Free , ,3.7 ,800 ,0.2C SBPP00 SBPP0019601 Black LI-POLYMER ,PRISMATIC ,50x34x38 , ,BLACK ,Hardpack ,Europe...
  • Page 167 Note...
  • Page 168 Note...

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