Philips TDA8566 Product Data Sheet page 14

NXP Semiconductors
HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height
y
1
pin 1 index
24
Z
DIMENSIONS (mm are the original dimensions)
A
UNIT A 2 A 3
max.
3.5
mm 3.5 0.35
3.2
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT566-3
Fig 11. Package outline SOT566-3 (HSOP24)
TDA8566_6
Product data sheet
D
D 1
12
13
b p
e
(1) (2)
A 4 b p c D D 1
0.08 0.53 0.32 16.0 13.0
0.04 0.40 0.23 15.8 12.6
REFERENCES
IEC JEDEC
2 40 W/2
c
D 2
A 2
E 1
w
M
0 5
scale
(2)
D 2 E E 1 E 2 e
1.1 11.1 6.2 2.9
1
0.9 10.9 5.8 2.5
JEITA
Rev. 06 — 15 October 2007
stereo BTL car radio power amplifier
E
x
E 2
H E
A 4
detail X
10 mm
H E L p Q v w
14.5 1.1 1.7
0.25 0.25
13.9 0.8 1.5
EUROPEAN
PROJECTION
TDA8566
SOT566-3
A
X
v
A
M
Q
A
(A 3 )
L p
x y Z
8
2.7
0.03 0.07
0
2.2
ISSUE DATE
03-02-18
03-07-23
© NXP B.V. 2007. All rights reserved.
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