Common Failure Analysis And Maintenance; Power Failure Check - FLY FS501 Service Manual

3.1.7 I/O Interface
I/O Connector MICRO USB interface standard. Mainly used for software, download picture
messages。
3.1.8 Display
The main screen is 5.0 inch。 5.0-inch color screen FWVGA

3.2 Common Failure Analysis and Maintenance

Before cutting board after the completion of the production line SMT X-RAY inspection, according to the actual
situation, X-RAY examination can not be found 100% badness, X-RAY inspection may omissions some fault plate flow
down. If found fault plate in the testing process, the first step is to re-check of the X-RAY and carefully to see if there
is even welding, lap welding, Weld, if normal, analyze the situation following the positioning。

3.2.1 Power failure Check

The failure phenomenon caused by a power failure: can not boot, shutdown leakage current boot large current.
The main reason for the problem: Weld, electrical the original filtering or ESD device to short-circuit, burning with the
device is connected to a power source.
Positioning as well as steps to solve this type of problem is as follows：
1， Troubleshoot and connected to the power supply components of the welding, Weld, or the peripheral devices
even tin。
2， with a multimeter rule out whether there is power to short-circuit, and step by step to troubleshoot the cause
of the short (mainly: even tin, IC burned ESD protection device breakdown, capacitor breakdown)。
3， boot to test the power output is normal。
If a power output value is not normal, whether the view filter capacitor welding problems, whether the
breakdown, filter capacitor is broken, replace; excluded one by one, and finally you can navigate to the main chip
damage。
Each the power test position and the normal boot value is shown in the following table
VDDCORE 1.1V
VDDARM 1.2V
VDDMEM 1.2V
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