Diagrams - Sony HCD-ZUX999 Service Manual

• Circuit Boards Location
L-SHAPE ILLUMINATION-A board
LEFT PANEL board
PANEL FUNCTION board
LEFT ENTER board
MASTER VOLUME board
DISC FUNCTION board
HEADPHONE board
CROSS FADER board
PT board
SW board
MOTOR (LD) board
MOTOR (TB) board
HCD-ZUX999
SECTION 5

DIAGRAMS

USB-A board
FL-TUBE board
SH-TAS board
L-SHAPE ILLUMINATION-B board
BOTTOM SIRCS board
OPEN/CLOSE KEY board
RIGHT ENTER board
MICROPHONE board
SUB PT board
SENSOR board
SPEAKER TERMINAL board
AMP board
REGULATOR board
MAIN board
DRIVER board
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
• Indication of transistor.
USB-B board
Q
B E
X-ROUND JOG board
These are omitted.
Q
RIGHT PANEL board
G S
These are omitted.
Q
B C E
• Abbreviation
E2 : 120V AC area in E model
E3 : 240V AC area in E model
E51 : Chilean and Peruvian models
MX : Mexican model
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
BD board
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
29 29
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• 2 : Nonfl ammable resistor.
Parts on the pattern face side seen
• C : Panel designation.
from the pattern face are indicated.
Parts on the parts face side seen from Note: The components identifi ed by mark 0 or dotted
the parts face are indicated.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : TUNER
<
• Voltages are taken with VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
These are omitted.
F
L
J
c
N
• Abbreviation
E2
E3
E51
MX
HCD-ZUX999
line with mark 0 are critical for safety.
Replace only with part number specifi ed.
> : CD PLAY
: Impossible to measure
*
: TUNER (ANALOG)
: TUNER (DIGITAL)
: CD PLAY (ANALOG)
: CD PLAY (DIGITAL)
: MIC
: 120V AC area in E model
: 240V AC area in E model
: Chilean and Peruvian models
: Mexican model