Printed Wiring Board -Handset Section - Sony SPP-111 Service Manual

SPP-111
5-6. PRINTED WIRING BOARD — HANDSET SECTION —
• Semiconductor Location
Ref. No. Location Ref. No. Location
D51 A-3 IC501 B-10
D202 B-14
D301 A-14 Q51 A-1
D501 D-6 Q52 A-2
D502 A-10 Q54 B-1
D504 A-11 Q201 D-9
Q301 A-13
IC101 B-5 Q501 C-8
IC201 D-14 Q502 C-8
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WXYZ
DEF MNO
OPER
JKL
MNO
ABC
GHI PQRS
Note:
• X : parts extracted from the component side.
•
: Carbon pattern.
•
¢ : internal component.
• b : Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
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