Table Of Contents - Sony D-E770 Service Manual

TABLE OF CONTENTS

1. SERVICING NOTES
2. GENERAL
······································································· 4
3. DISASSEMBLY
······························································ 5
3-1. Cabinet (Upper) ··································································· 5
3-2. CDM-3123EBA and Main Board ········································ 5
4. ELECTRICAL ADJUSTMENTS
5. DIAGRAMS
····································································· 7
5-1. IC Pin Function Description ················································ 7
5-2. IC Block Diagrams ······························································ 9
5-3. Block Diagram ··································································· 10
5-4. Printed Wiring Board ························································· 12
5-5. Schematic Diagram ···························································· 15
6. EXPLODED VIEWS
6-1. Cabinet Section ·································································· 18
6-2. Main Section ······································································ 19
6-3. Mechanism Section (CDM-3123EBA) ······························ 20
7. ELECTRICAL PARTS LIST
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
····················································· 3
······························· 6
···················································· 18
···································· 21
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board. (within 3 times)
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
ATTENTION AU COMPOSANT AYANT RAPPORT
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
- 2 -
À LA SÉCURITÉ!