Huawei MediaPad 10 fhd Maintenance Manual page 5

MediaPad10 FHD Maintenance Manual INTERNAL
Figures
Figure 1-1 Appearance of the MediaPad 10 FHD ............................................................................................. 9
Figure 1-2 Hardware principles of the MediaPad 10 FHD .............................................................................. 10
Figure 1-3 Exploded view of the host ............................................................................................................. 13
Figure 2-1 Functional blocks of the Hi3620 ................................................................................................... 14
Figure 2-2 Functional blocks of the POP LPDDR2 chip ................................................................................. 18
Figure 2-3 Model of the POP LPDDR2 chip provided by ELPIDA ................................................................. 18
Figure 2-4 Model of the POP LPDDR2 chip provided by Samsung ................................................................ 19
Figure 2-5 Pinouts of the POP LPDDR2 chip ................................................................................................. 20
Figure 2-6 Functional blocks of the power supply .......................................................................................... 23
Figure 2-7 RF solution for the Wi-Fi and Bluetooth modules of the S10 ......................................................... 26
Figure 2-8 Components encapsulated in the WI-FI or Bluetooth module ......................................................... 28
Figure 2-9 RF solution for the GPS module of the S10 ................................................................................... 29
Figure 2-10 Functional blocks of the BCM47511 chip .................................................................................... 30
Figure 2-11 Models of the BCM47511 ........................................................................................................... 30
Figure 2-12 Components encapsulated in the BCM47511 chip ....................................................................... 31
Figure 3-1 Layout of components on the S10 PCBA ...................................................................................... 32
Figure 4-1 Functional blocks of the PCBA ..................................................................................................... 38
Figure 4-2 Layout of components on the PCBA ............................................................................................. 38
Figure 4-3 Physical architecture of the PCBA ................................................................................................ 39
Figure 4-4 Power-on and power-off sequencing ............................................................................................. 40
Figure 4-5 Power-on procedure ...................................................................................................................... 41
Figure 4-6 AP framework .............................................................................................................................. 42
Figure 4-7 Working principles of the PMU ..................................................................................................... 45
Figure 4-8 Possible faults of the AP power circuit .......................................................................................... 47
Figure 4-9 Working principles of the AP charging circuit................................................................................ 49
Figure 4-10 Working principles of the coulometer circuit ............................................................................... 50
2012-10-09 Huawei Confidential Page 5 of 78