Table Of Contents - Huawei MediaPad 10 fhd Maintenance Manual

MediaPad10 FHD Maintenance Manual
1 Product Overview .................................................................................................................... 8
1.1 Brief Introduction ....................................................................................................................................... 8
1.2 Hardware Specifications ........................................................................................................................... 11
1.3 Software Specifications ............................................................................................................................ 12
1.4 Exploded View of the Host ....................................................................................................................... 12
2 Functional Chips .................................................................................................................... 14
2.1 Hi3620 ..................................................................................................................................................... 14
2.1.1 Chip Specifications .......................................................................................................................... 14
2.1.2 Pin Assignment ................................................................................................................................ 15
2.1.3 Working Principles and Functions of the Hi3620 .............................................................................. 15
2.2 POP LPDDR2 .......................................................................................................................................... 17
2.3 PMU Hi6421 ............................................................................................................................................ 20
2.4 Wi-Fi and Bluetooth Modules ................................................................................................................... 25
2.5 GPS BCM47511 ....................................................................................................................................... 28
3 Layout of Major Components .............................................................................................. 32
3.1 Layout of Components on the S10 PCBA ................................................................................................. 32
3.2 Components on the S10 PCBA ................................................................................................................. 32
4 Principles and Failure Analysis ........................................................................................... 37
4.1 Working Principles of the MediaPad 10 FHD ............................................................................................ 37
4.2 Power-On and Power Tree ........................................................................................................................ 39
4.2.1 Hardware Startup Process ................................................................................................................ 39
4.2.2 Power Tree ...................................................................................................................................... 41
4.3 Circuit Analysis and Troubleshooting for Functional Units ........................................................................ 42
4.3.1 Working Principles of the AP Subsystem .......................................................................................... 42
4.3.2 Detailed Analysis of Working Principles of the AP Subsystem .......................................................... 45
4.4 Circuit Analysis and Troubleshooting for the Modem Unit ........................................................................ 65
5 Software Upgrade .................................................................................................................. 73
5.1 Upgrade Preparation ................................................................................................................................. 73
5.2 Upgrading the Software by Using a USB Peripheral .................................................................................. 73
5.2.1 Upgrading the Software by Using a microSD Card ........................................................................... 73
6 Disassembly Procedure ......................................................................................................... 75
2012-10-09 Huawei Confidential
INTERNAL
Contents
Page 3 of 78