XR-CA665EE
TABLE OF CONTENTS
1.
2.
2-4. MAIN Board ................................................................... 8
3.
3-1. Assembly Flow ................................................................ 9
3-2. Housing ........................................................................... 10
3-6. Guide (C) ......................................................................... 12
4.
5.
Tuner Section .................................................................. 13
6.
7.
8.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
2
............................................... 2
....................... 13
............................... 29
SERVICING NOTES
SERVICE POSITION
In checking the key board and main board, prepare two jigs (con-
nection cable J-2502-066-2 and
connection cable for F/P to main J-2502-071-1).
sub board
(CN801)
sub panel
assy
display board
(CN901)
main board (CN351)
mechanism deck
connect jig
(connection cable J-2502-066-2)
to the main board (CN351) and
mechanism deck.
connect jig
(connection cable
for F/P to main J-2502-071-1)
to the display board (CN901) and
sub board (CN801).