Note For Printed Wiring Boards And Schematic Diagrams - Sony MEX-1HD Service Manual

6-5.

NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
1
• All resistors are in Ω and / W or less unless otherwise
4
specified.
• : internal component.
f
• C : panel designation.
Note: Note:
The components identi- Les composants identifiés par
une marque 0 sont critiques
fied by mark 0 or dotted
line with mark 0 are criti- pour la sécurité.
cal for safety. Ne les remplacer que par une
Replace only with part pièce por tant le numéro
number specified. spécifié.
• A : B+ Line.
• B : B– Line.
• Power voltage is dc 14.4V and fed with regulated dc power
supply from ACC and BATT cords.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : CD PLAY
( ) : HD
〈〈 〉〉 : FM
[ ] : AM
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : FM
f : AM
E : MEMORY STICK PLAY
j : USB IN
J : CD
Note on Printed Wiring Boards:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• f : internal component.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
• SERVO board, MAIN board, SUB board and POWER board
are multi-layer printed boards.
However, the patterns of intermediate-layer have not been in-
cluded in these diagrams.
* Replacement of IC3003 and IC4001 used in this set
requires a special tool.
• Lead Layouts
surface
Lead layout of conventional IC CSP (chip size package)
• Circuit Boards Location
SERVO board
SWITCH board
DISPLAY board
31 31
POWER board
MAIN board
SUB board
MEX-1HD