Table of Contents
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SCD-XB790
QQ
3 7 63 1515 0
TABLE OF CONTENTS
1.
2.
................................................................... 6
3.
3-1. Disassembly Flow ........................................................... 8
3-2. Case ................................................................................. 9
3-3. Front Panel Section ......................................................... 9
3-4. AUDIO Board, MAIN Board .......................................... 10
3-5. Mechanism Deck (CDM66B-DVBU6B) ....................... 10
3-6. Base Unit (DVBU-6B) .................................................... 11
4.
.............................................................. 12
5.
5-1. Block Diagram - RF/SERVO Section - ........................ 20
5-2. Block Diagram - SERVO Section - .............................. 21
5-3. Block Diagram - MAIN Section - ................................ 22
5-4. Block Diagram - AUDIO Section - .............................. 23
POWER SUPPLY Section - ........................................... 24
5-6. Notes for Printed Wiring Boards and
Schematic Diagrams ....................................................... 25
5-7. Schematic Diagram - RF Board - ................................. 26
- RF/LOADING Boards - .............................................. 27
- MAIN Board (Component Side) - .............................. 28
TE
5-10. Printed Wiring Board
L 13942296513
- MAIN Board (Conductor Side) - ................................ 29
- MAIN (1/5)/ LOADING Boards - ............................. 30
5-12. Schematic Diagram - MAIN Board (2/5) - .................. 31
5-13. Schematic Diagram - MAIN Board (3/5) - .................. 32
5-14. Schematic Diagram - MAIN Board (4/5) - .................. 33
5-15. Schematic Diagram - MAIN Board (5/5) - .................. 34
5-16. Schematic Diagram - AUDIO/HP Boards - ................. 35
- AUDIO Board (Component Side) - ............................ 36
- AUDIO (Conductor Side)/HP Boards - ..................... 37
5-19. Printed Wiring Boards - DISPLAY/KEY Boards - ...... 38
5-20. Schematic Diagram - DISPLAY/KEY Boards - .......... 39
- POWER/POWER SW/PT Boards - ............................ 40
- POWER/POWER SW/PT Boards - ............................ 41
5-23. IC Pin Function Description ........................................... 49
6.
6-1. Case Section .................................................................... 61
6-2. Front Panel Section ......................................................... 62
6-3. Chassis Section ............................................................... 63
6-4. Mechanism Deck Section (CDM66B-DVBU6B) .......... 64
6-5. Base Unit Section (DVBU-6B) ....................................... 65
7.
www
.
2
http://www.xiaoyu163.com
............................................... 3
............................... 66
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http://www.xiaoyu163.com
8
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
This appliance is classified as a CLASS 1
LASER product.
This label is located on the rear exterior.
Q Q
The following caution label is located
3
6 7
1 3
inside the unit.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
u163
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
2 9
9 4
2 8
1 5
0 5
8
2 9
9 4
m
co
9 9
2 8
9 9
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