Processor; Random Access Memory - NEC SP B-Series Service And Reference Manual

This section describes system specifications.

Processor

Microprocessor
500-MHz Pentium III processor
Clock Rate
T
350 MHz internally, 100 MHz FSB
T
400 MHz internally, 100 MHz FSB
T
450 MHz internally, 100 MHz FSB
T
500 MHz internally, 100 MHz FSB
Processor Support
T
32-bit addressing
T
64-bit data
Primary Cache
Secondary Cache
Processor Mounting
T
Processor subsystem is inserted into slot 1 on the system board.
T
A 242-pin edge connector is implemented on the processor board for
system board installation.
T
Retention Mechanism (RM) is inserted over slot 1 to act as an insertion
guide and prevent movement of processor after subsystem mounting.
T
For thermal protection, a heatsink is supported by a Heat Sink Support
(HSS) which is attached to the system board.

Random Access Memory

Standard Random Access Memory (RAM)
SDRAM installed in industry-standard DIMM sockets on system board
Total Memory
DIMM type
Expansion
T
4-Mbit by 64 (32-MB DIMM)
T
8-Mbit by 64 (64-MB DIMM)
T
16-Mbit by 64 (128-MB DIMM)
A-2 System Specifications
350-MHz, 400-MHz, or 450-MHz Pentium II processor or
32 KB of internal write-back cache on processor
512 KB of pipeline burst cache
support for up to 384 MB of high-speed PC100 SDRAM
gold-plated, dual in-line modules (DIMMs)
expandable using the following modules:
32 MB to 384 MB of 100-MHz