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HCD-DX90
Q Q
3 7 6 3 1 5 1 5 0
7-13. PRINTED WIRING BOARD – LEAF SW SECTION – • See page 21 for Circuit Boards Location. • See page 28 for Schematic Diagram of Head Board.
• Semiconductor
Location
Ref. No. Location
D1001
B-2
D1002
B-5
IC1001
B-1
IC1002
B-5
A
Q1001
B-2
B
T E
L
1 3 9 4 2 2 9 6 5 1 3
C
D
w w w
1
2
TAPE MECHANISM
DECK BLOCK (2/3)
(TCM-230PWR11)
CN302
(Page 26)
x
a o
y
.
i
http://www.xiaoyu163.com
8
3
4
M901
M
(CAPSTAN)
Q
Q
3
7
6
3
TAPE MECHANISM
DECK BLOCK (3/3)
(TCM-230PWR11)
(ERASE HEAD)
(REC/PB HEAD)
CN303
(Page 26)
u 1 6 3
.
34
34
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2
4
9
9
8
5
PM1001
TAPE MECHANISM
PLUNGER
DECK BLOCK (1/3)
(DECK-A)
(TCM-230PWR11)
1
5
1
5
0
8
9
2
4
CN304
(Page 26)
m
c o
2
9
9
6
PM1002
PLUNGER
(DECK-B)
S1001, 1002
S1003 – 1006,
9
8
2
9
9
S1008,1009
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