Block Diagram -Display Section - Sony CDX-GT121 Service Manual

CDX-GT121/GT220/GT222
5-2. BLOCK DIAGRAM — DISPLAY SECTION —
SYSTEM CONTROL
IC501 (2/2)
KEY MATRIX 40 KEYIN1
LSW901–911,
S901–904
41 KEYIN0
D503
KEY ACKNOWLEDGE
SWITCH 52 KEY ACK
Q664
AD_ON
76
RE901
PUSH SELECT
(VOLUME)
ROTARY
RE-0
31 RE-IN0
ENCODER
RE-1
32 RE-IN1
79 XOUT
X502
32.768kHz
80 XIN
82 OSCIN
X501
18.432MHz
83 OSCOUT
7 NOSE_SW
CDX-GT121/GT220/GT222
DISPLAY CONTROL
IC901
3
S1
|
LCD_SO 48 LCD901
28 DI
|
34
LCD_CKO 29 47 CL
LIQUID
S33 •
39
LCD_CE 27 46 CE CRYSTAL
DISPLAY
COM1 35
| PANEL
|
COM4 38
1 2
PANEL+B
LED931
( LCD BACK )
LSW901–911,
LIGHT
LED941,942,
944,945,951–953
KEY
(
ILLUMINATE
DIMMER
SWITCH
Q931
LCD
BACK LIGHT
SWITCH
Q932
GT220/GT222
REMOTE CONTROL
SIGNAL RECEIVER
IC971
SIRCS 64 3 OUT
IR
• NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1 / W or less unless otherwise
4
specified.
• f : internal component.
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• B : B– Line.
• H : adjustment for repair.
• Voltages and waveforms are dc with respect to ground
)
under no-signal (detuned) conditions.
no mark : FM
( ) : MW/LW
< > : CD PLAY
∗ : Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD PLAY
F
: FM
f
: MW/LW
L : AUX
• Waveforms
— MAIN Board —
1
IC501 ul (XOUT)
0.7Vp-p
32.768kHz
0.5 V/DIV, 20 µ sec/DIV
2
IC501 id (OSCOUT)
1.8Vp-p
18.432MHz
0.5 V/DIV, 20 nsec/DIV
18 18
For printed wiring boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Through hole.
a
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
C
Q
These are omitted
B E
B E C
These are omitted
E C B
These are omitted
3
IC51 9 (XTI)
1Vp-p
8.664MHz
0.5 V/DIV, 0.1 µ sec/DIV