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Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
MODEL IDENTIFICATION
- BACK PANEL -
MODEL
AEP model
CND model
AUS model
KR model
MX model
AR model
• Abbreviation
CND : Canadian model
MX
: Mexican model
KR
: Korea model
AR
: Argentine model
AUS : Australian model
PARTS No.
PARTS No.
4-231-894-0s
4-231-894-1s
4-231-894-2s
4-231-894-3s
4-231-894-4s
4-231-894-5s
TABLE OF CONTENTS
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··································································· 6
···································································· 13
6-1. Circuit Board Location ················································· 23
6-2. Block Diagrams ···························································· 24
6-3. Schematic Diagram
6-4. Printed Wiring Board
6-5. Printed Wiring Board
6-6. Schematic Diagram
6-7. Schematic Diagram
6-9. Printed Wiring Board
6-12. Printed Wiring Board
6-13. Schematic Diagram
6-16. Schematic Diagram
6-17. Printed Wiring Board
6-18. Printed Wiring Board
6-23. Printed Wiring Board
6-25. Printed Wiring Board
6-26. Schematic Diagram
6-27. IC Pin Function Description ······································· 47
6-28. IC Block Diagrams ····················································· 54
7-1. Main Section ································································· 58
7-2. Front Panel Section ······················································· 59
7-3. Chassis Section ····························································· 60
7-7. Base Unit Section (BU-30BD60) ································· 64
HCD-DP800AV
····························· 17
······························· 17
BD Section ······························· 26
BD Section ···························· 27
Main Section ························· 28
Main Section (1/3) ··················· 29
Main Section (2/3) ··················· 30
Main Section (3/3) ··················· 31
DSP Section ·························· 32
DSP Section (1/2) ··················· 33
DSP Section (2/2) ··················· 34
OPT Section ························ 35
OPT Section ··························· 35
Front Amp Section ··············· 36
Front Amp Section ················· 37
Surround Amp Section ··········· 38
Surround Amp Section ········ 39
Panel Section ······················· 40
Panel Section (1/2) ················· 41
Panel Section (2/2) ················· 42
Leaf SW Section ·················· 43
Leaf SW Section ····················· 43
Driver Section ······················ 44
Driver Section ························ 44
Trans Section ······················· 45
Trans Section ·························· 46
······································· 65
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