Optoma EP756 Service Manual
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Optoma EP756 Service Manual

Optoma EP756 Service Manual

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EP757
SERVICE MANUAL
1 1 1 1 1
Introduction

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Summary of Contents for Optoma EP756

  • Page 1 EP757 SERVICE MANUAL 1 1 1 1 1 Introduction...

  • Page 2: Product Highlights

    EP757 SERVICE MANUAL 1-1 Product Highlights...

  • Page 3: Technical Specification

    EP757 SERVICE MANUAL 1-2 Technical Specification...
  • Page 4 EP757 SERVICE MANUAL i l i...
  • Page 5 EP757 SERVICE MANUAL t l i...

  • Page 6: Fundamental Principle

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 2 2 2 2 2 Fundamental Principle This section provides the conceptual drawing about optics of projector. You can realize optical projection system through the following diagram and the integral part of configuration, too.

  • Page 7: Whole System Block Diagram

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 2-1 Whole System Block Diagram Inter Lock Speaker Switch Lamp LAMP Ballast LVPS Module Module...
  • Page 8 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 2-1.1 Front End Board Block Diagram Memory D-Sub output Thermal Board KDS (0-3) R.G.B.H.Vsync KDR (0-2) Standby-1...
  • Page 9 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 2-1.2 Thermal Board Block Diagram THERMAL BOARD Interface ECON KEY 7PIN 20P Connector to ERR_OUT 3P Connector *4 MAIN...
  • Page 10 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 2-1.1 Formatter Board Block Diagram +12V VCC2 (DMD) VCC2,VOFFSET,VBIAS VCC2 (ASIC) VOFFSET VERSET GENERATION VBIAS VRESET...
  • Page 11 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 2-2 Optics 2-2.1 Conceptual Drawing Lamp Module Relay Lens 2 Lamp Cover Glass Condenser Color Wheel Hollow Rod...
  • Page 12 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 2-2.2 Basic Functions Lamp Module The light source. Lamp Cover Glass Protecting system components if the lamp explodes Color Wheel Separating the light beam into and produce R.G.B colors.

  • Page 13: Mechanical Construction

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 3 3 3 3 3 Mechanical Construction This section provides the package and exploded overview, replaceable parts list and recommendatiom parts list for the portable projector.

  • Page 14: Package Overview

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 3-1 Package Overview...

  • Page 15: Replacement Parts List

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Replacement Parts List...

  • Page 16: Exploded Overview

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 3-2 Exploded Overview Replacement Parts List...
  • Page 17 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 3-2.1 Top Housing Module ÃÁÄÃ ÅÃÃ Replacement Parts List ÃÁÃ ÅÃÃ ÃÄÃ ÃÃ ÃÁÇÃ ÃÁÁÃ...
  • Page 18 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 3-2.2 Bottom Housing Module...
  • Page 19 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Replacement Parts List...
  • Page 20 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 3-2.3 Optical Engine Module Replacement Parts List ÁÁ...
  • Page 21 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 3-2.4 Only Bottom Housing ÂÈÂ ÂÃÂ Ç ÂÂ ÈÉ ÂÂ Replacement Parts List Á Ä...
  • Page 22 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 3-10 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 3-2.5 Connector Module Replacement Parts List...
  • Page 23 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 2-11 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 3-2.6 Thermal Sensor Board Replacement Parts List...

  • Page 24: Axial Fan Module

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 3-12 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 3-2.7 Axial Fan Module Replacement Parts List...
  • Page 25 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 2-13 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 3-2.8 Front IR Cover Module Replacement Parts List...
  • Page 26 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 3-14 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 3-2.9 Thermal Board Module Replacement Parts List...
  • Page 27 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 2-15 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 3-2.10 Back IR Cover Module Replacement Parts List...

  • Page 28: Recommendation Spare Parts List

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 3-16 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 3-3 Recommendation Spare Parts List...
  • Page 29 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 2-17 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix...
  • Page 30 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 3-18 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Note : SW = Swap Spare Parts, CM = Consume Spare Parts. You can place an order for swap or consume spare parts to do replacement.

  • Page 31: Procedure Of Disassembly

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 4 4 4 4 4 Procedure of Disassembly This section provides disassembly procedures for EP757 Micro Portable XGA DLP Projector.

  • Page 32: Tools Needed

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Tools Needed : Hex Sleeves 5mm (Top) Screw Bit (+) : 102 Screw Bit (+) : 107 Angle Cutting Nipper (Left) Long Nose Nipper (Right)

  • Page 33: Disassemble Top Cover Module, Keypad Board And Speaker

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 4-1 Disassemble Top Cover Module, Keypad Board and Speaker Remove three screws and one long screw from Bottom Housing. Remove four screws beside Top Housing.
  • Page 34 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Unscrew one screw to remove Speaker Board Unscrew four screws to remove IR Cover Module, Vent. IR Cover Module Vent Speaker Board...
  • Page 35 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Tear off Keypad Light Insulator, then remove four screws of Keypad Board and tear off 3M Tape then unscrew two screws of Speaker Holders to remove speaker.

  • Page 36: Disassemble Av Module And Connector Board

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 4-2 Disassemble AV Module and Connector Board Turn over Bottom Housing and remove four screws from Bottom Housing. Unscrew two screws of Label Connector Module to remove Label Connector Module and remove two screws from Connector Cover Clamp.
  • Page 37 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Remove two screws and four long screws from Label Connector Module. Unscrew four screws of Connector Board to remove it. Connector Board Connector Board Label Connector Module...

  • Page 38: Disassemble Lamp Ballast And Power Supply

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 4-3 Disassemble Lamp Ballast and Power Supply Remove two screws from Lamp Housing. Unplug one wire to Lamp.
  • Page 39 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Remove two screws from Power Socket Bracket and take off it. Loosen one screw of Power supply from grounding. Unscrew four hex screws of Power Supply to remove it.

  • Page 40: Disassemble Lamp Module And Thermal Board

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 4-10 EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 4-4 Disassemble Lamp Module and Thermal Board Turn over Bottom Housing and loosen two screws of Lamp Cover from Bottom Housing and take off Lamp Cover.
  • Page 41 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 4-11 EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Unplug seven cables from Thermal Board. Remove one screw from Thermal Sensor Board. Unscrew one screw and one hex screw to remove Thermal Board.

  • Page 42: Disassemble Fan Module And Front End Board

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 4-12 EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 4-5 Disassemble Fan Module and Front End Board Remove two screws from Fan Module and take off it. Unscrew four screws and one long screw of Engine Module.
  • Page 43 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 4-13 EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Unscrew two screws to remove Front End Board from Engine. Front End Board...

  • Page 44: Disassemble Formatter Board

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 4-14 EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 4-6 Disassemble Formatter Board Unscrew one hex screw from Engine Module. Unscrew three screws to remove Fan from Engine Module.
  • Page 45 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 4-15 EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Unscrew two screws to remove Heat Sink. Engine Module Unscrew four screws to remove Formatter Board. Unscrew two screws to remove Safe Switch.

  • Page 46: Disassemble Engine Module

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 4-16 EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 4-7 Disassemble Engine Module Engine Module...
  • Page 47 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 4-17 EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix...
  • Page 48 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 5 5 5 5 5 Function Of Boards This section provides each connector location on boards, signal and function of each board.
  • Page 49 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 5-1 Front End Board (Main Board) 5-1.1 The Location of Connector 5-1.2 J8 : To Video...
  • Page 50 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 5-1.3 J7 : To Thermal Board 5-1.4 IR1 5-1.5 J2 : CON4...
  • Page 51 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 5-1.6 JP2 : To Source 5-1.7 J5 : To DC-DC 5-1.8 JP1...
  • Page 52 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 5-1.9 J6 : To A/V...
  • Page 53 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 5-1.10...
  • Page 54 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix...

  • Page 55: Formatter Board

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 5-2 Formatter Board 5-2.1 The Location of Connector...
  • Page 56 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 5-2.2 JP6...
  • Page 57 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 5-10 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix...
  • Page 58 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 5-11 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 5-2.3 J502 : Connected to Color Wheel 5-2.4 J503...

  • Page 59: Thermal Board

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 5-12 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 5-3 Thermal Board 5-3.1 The Location of Connector 5-3.2 J1...
  • Page 60 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 5-13 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 5-3.3 J2 5-3.4 J3 5-3.5 J10 5-3.6 J4...
  • Page 61 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 5-14 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 5-3.7 J5 5-3.8 J8 5-3.9 J7...

  • Page 62: Data Connector Board

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 5-15 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 5-4 Data Connector Board 5-4.1 The Location of Connector...
  • Page 63 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications 5-16 EP757 Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 5-4.2 J2 : To Main Board...

  • Page 64: Specifications

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 6 6 6 6 6 Specifications This chapter provides DMD, Lamp, Lamp Driver and DC-DC specifications. All specifications are for your reference.

  • Page 65: Dmd Specifications

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 6-1 DMD Specifications Table 1. Physical, Optical and Thermal Parameters r r i r r i - - - - - -...
  • Page 66 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Note 1 : Tilt Angle Tolerances Limits on variability of mirror tilt half angle are critical in the design of the accompanying optical system. Variations in tilt angle within a device may result in apparent non-uniformities, such as line pairing and image mottling, acress the pro- jected image.
  • Page 67 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Table 2. Absolute Max. Ratings r r i & &...
  • Page 68 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix...

  • Page 69: Troubleshooting

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 7 7 7 7 7 Troubleshooting This chapter provides technicians and people who have an electronic back- ground a primary description about maintaining the product.

  • Page 70: Equipment Needed

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 7-1 Equipment Needed EP757 Projector • VESA M1 to VGA Cable • PC (Personal Computer) •...
  • Page 71 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Continue B. Image Performance Is Image OK ? Troubleshooting Is function OK? C.
  • Page 72 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 7-2.1 A. Power Troubleshooting Start Is LED Reassembly lamp Check power cord Lamp Replacement indicator OK? Replacement Cover...
  • Page 73 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 7-2.2 B. Performance Troubleshooting Start Change Change Change Have image? DMD Board DMD CHIP Change Have garbage...
  • Page 74 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Continue Dot defect isn’t Change compliant with DMD CHIP the spec.? Adjust Change Change Change...
  • Page 75 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Color Adjust Procedure : * Notice : PC shall run R.G.B. gray scale pattern. Power on.
  • Page 76 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 7-2.4 D. Audio Troubleshooting Start Can hear Change Change Spearker sound? Main Board Change Change Sound is clear...
  • Page 77 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 7-2.5 E. Remote Control Troubleshooting Start Replace the battery Change Remote Controller Change IR Board Change Main Board...

  • Page 78: Function Test

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 8 8 8 8 8 Function Test and Alignment Procedure This chapter provides equipment, conditions, patterns, and procedure needed for Function Test and Alignment.

  • Page 79: Test Equipment

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 8-1 Test Equipment • IBM PC with XGA resolution (Color Video Signal & Pattern Generator) •...

  • Page 80: Test Display Modes And Patterns

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 8-3 Test Display Modes and Patterns 8-3.1 Compatible Modes Analog : i l i i l i "...
  • Page 81 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Digital : i l i...

  • Page 82: Function Test Display Pattern

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 8-3.2 Function Test Display Pattern & & . t r...
  • Page 83 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Fine Line Morie Pattern (Figure 1) Contrast & Brightness (Figure 2) R. Color Pattern (Figure 3) G.
  • Page 84 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix B. Color Pattern (Figure 5) Full White Pattern (Figure 6) Dark Pattern (Figure 7) Gary 30 Pattern (Figure 8) Blue 180 Pattern (Figure 9) Boundary Frame (Figure 10)

  • Page 85: Inspection Procedure

    Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 8-5 Inspection Procedure RESET : Please press “Menu” button on the projector panel to enter “Factory Reset” Function then choose “YES”...
  • Page 86 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix Screen Uniformity and Flicker : Test Signal : 1024 x 768 @ 85Hz Test Pattern : Full White Pattern ¡...
  • Page 87 Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications EP757 SERVICE MANUAL Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix 9 9 9 9 9 Appendix...

  • Page 88: Serial Number System Definition

    9-1.1 Serial Number Format for Projector A BBB Y WW C D BEMO EEEE A = Optoma, B~Z = OEM Product code (ex: 865 = EP757) Y = Last number of the year (ex: 2003 - 3) Week of year...

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