2.2.5.2.
2.2.5.3.
2.2.5.4.
2.2.5.5.
2.2.5.6.
2.2.5.7.
2.2.5.8.
2.2.6.
2.2.6.1.
2.2.6.2.
2.2.6.3.
2.2.6.4.
2.2.7.
Software Descriptions .................................................................................................. 2 − 33
2.2.7.1.
2.2.7.2.
2.2.7.3.
3.
Disassembly and Reassembly .............................................................................................................. 3 − 1
3.1.
3.1.1.
3.1.2.
3.1.3.
Releasing Plastic Latches .............................................................................................. 3 − 2
3.2.
Screws used in the printer.......................................................................................................... 3 − 3
3.3.
3.3.1.
Cover ........................................................................................................................ 3 − 4
3.3.2.
OPE.......................................................................................................................... 3 − 5
3.3.3.
Scanner ..................................................................................................................... 3 − 6
3.3.4.
ADF ......................................................................................................................... 3 − 7
3.3.5.
ADF Roller ................................................................................................................ 3 − 7
3.3.6.
ADF Motor ................................................................................................................ 3 − 8
3.3.7.
Scan Motor ................................................................................................................ 3 − 9
3.3.8.
CIS Unit .................................................................................................................... 3 − 10
3.3.9.
Middle Cover ............................................................................................................. 3 − 11
3.3.10. Fax Board .................................................................................................................. 3 − 12
3.3.11. Main board................................................................................................................. 3 − 12
3.3.12. SMPS board ............................................................................................................... 3 − 13
3.3.13. HVPS board ............................................................................................................... 3 − 13
3.3.14. Bin-Full sensor ........................................................................................................... 3 − 14
3.3.15. Main Drive Unit.......................................................................................................... 3 − 14
OPE board ................................................................................................... 2 − 23
Fax board .................................................................................................... 2 − 24
Joint PBA .................................................................................................... 2 − 25
SMPS Board ................................................................................................ 2 − 26
HVPS Board ................................................................................................ 2 − 28
Feeding ....................................................................................................... 2 − 31
Transfer....................................................................................................... 2 − 31
Fusing......................................................................................................... 2 − 32
LSU............................................................................................................ 2 − 32
Architecture ................................................................................................. 2 − 33
Data and Control Flow ................................................................................... 2 − 34
Contents
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